Abstract: A semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.

Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

Abstract: A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to the adhesive layer of the semiconductor chip that is mounted on the first wafer, forming a molding layer between the first wafer and the second wafer, and cutting the first wafer, the molding layer and the second wafer.

Abstract: The present invention relates to a vehicle air conditioner having a photocatalyst module, i.e., a two-layered flow air conditioner in which an inner flow path of the air conditioner is divided into an upper flow path and a lower flow path, the air conditioner providing an optimal design location and a mounting structure of a photocatalyst module which are capable of purifying both the upper flow path and the lower flow path by using a minimum number of photocatalyst modules.

Abstract: The present invention relates to a vehicle air conditioner, and more particularly, to a vehicle air conditioner having a photocatalyst module, which provides an optimal design location or a mounting structure in which the photocatalyst module is mounted on an upper surface of a duct, the upper surface of the duct has a predetermined inclination with respect to a floor surface, and the photocatalyst module is mounted on a left/right independent air conditioner.

Abstract: A secondary battery cell includes: a case in which an electrode assembly is accommodated; a cap plate assembly coupled to at least one side of the case; and a venting unit including a base coupled to one surface of the case and a notch portion formed on the base, and the notch portion includes: a first notch portion extending in a first direction; a second notch portion extending in a second direction intersecting the first direction; and a third notch portion extending in a third direction, parallel to a longitudinal direction of the base from both ends of the first notch portion and the second notch portion.

Abstract: A secondary battery cell includes: a case in which an electrode assembly is accommodated; a cap plate assembly coupled to at least one side of the case; and a venting unit including a base coupled to one surface of the case and a notch portion formed on the base, and the notch portion includes: a first notch portion extending in a first direction, parallel to a longitudinal direction of the base; a second notch portion extending in a second direction, perpendicular to the first direction, from both ends of the first notch portion, respectively; and a third notch portion extending in the first direction from both ends of the second notch portion, respectively.

Abstract: The present invention relates to a fragrance generator for a vehicle, the fragrance generator including a storage casing configured to accommodate a plurality of fragrance cartridges therein, a cover casing coupled to one surface of the storage casing and configured to discharge a fragrance discharged from the fragrance cartridge, and a rotary member interposed between the storage casing and the cover casing and having a length extending in two directions of one surface, in which one or both of a pair of lateral casings disposed on two opposite surfaces of the storage casing is separably coupled to the storage casing, thereby further improving assembling performance and durability.

Abstract: A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.

Abstract: A semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, and vertical conductive structures spaced apart from a side surface of the semiconductor chip. Each of the vertical conductive structures includes a wire, and a metal layer covering a side surface of the wire. A top surface of the wire is exposed from the metal layer.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: The present invention relates to a photocatalytic device and a vehicle air conditioner including the same and, more specifically, to a photocatalytic device and a vehicle air conditioner including the same, and compared with a conventional photocatalytic device, the photocatalytic device readily protects, from external contaminants, electronic elements of a substrate at which a light source for emitting ultraviolet light is provided, and increases structural stability by changing a method for connecting the substrate and a connector with each other.

Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.

Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: Provided are a light-emitting diode (LED) display device and a method of operating the LED display device determining whether a line flicker will occur based on a level of an input image signal, obtaining an LED line scan order corresponding to the level of the input image signal and brightness according to the input image signal based on the determining, and driving at least one LED line based on the LED line scan order. An LED line scan order may be adjusted according to a level of an input/output image signal in an LED display device so as to reduce occurrence of a line flicker phenomenon in all levels of the input/output image signal.

Abstract: A semiconductor package includes a first substrate including a first wiring layer inside the first substrate, a second substrate including a second wiring layer inside the second substrate, and a mold layer between the first substrate and the second substrate. An upper surface of the mold layer is on a same plane as upper surfaces of the first substrate and the second substrate. The package includes a first connecting film on each of the upper surface of the first substrate and the upper surface of the second substrate, the first connecting film connecting the first substrate and the second substrate, and a first semiconductor chip on the upper surface of the first substrate. The first semiconductor chip is spaced apart from the first connecting film, and an upper surface of the first connecting film is lower than an upper surface of the first semiconductor chip.

Abstract: A vehicle air conditioner is equipped with a photocatalyst which is irradiated with light so that bacteria generated in the photocatalyst is removed. In particular, an entire area of the photocatalyst is irradiated with the light using a small number of light sources so that sterilization effect of a filter can be improved.

Abstract: A vehicle air conditioner is equipped with a photocatalyst which is irradiated with light so that bacteria generated in the photocatalyst is removed. In particular, an entire area of the photocatalyst is irradiated with the light using a small number of light sources so that sterilization effect of a filter can be improved.

Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.

Abstract: Disclosed is a semiconductor package including a base film that has a first surface and a second surface opposite to the first surface, a plurality of input/output lines on the first surface of the base film, a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines and including a central portion and end portions on opposite sides of the central portion, and a heat radiation pattern on the second surface of the base film. The heat radiation pattern corresponds to the semiconductor chip and has a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip.