Abstract: The following disclosure relates to an electrification device and an electrical dust collecting apparatus including the same capable of adsorbing and filtering fine dust included in air in an air conditioning apparatus such as an air conditioner or an air cleaner, and more particularly, to an electrification device and an electrical dust collecting apparatus including the same capable of having uniform electrification by fixing an electrification plate and a wire at accurate positions using a fixing member coupled to a case to support both end portions of the electrification plate and the wire.

Abstract: Provided is a method of inducing oligodendrocyte precursor cells (OPCs) through direct reprogramming from human somatic cells into which a nucleic acid molecule encoding an Oct4 protein or Oct4 protein-treated human somatic cells. The method of inducing OPCs by treating Oct4-overexpressing human somatic cells with a low molecular weight substance may establish OPCs with high efficiency in a short period of time through direct reprogramming without via neural stem cells, and thus the OPCs are useful as a cell therapeutic agent for an intractable demyelinating disease.

Abstract: A display device includes a signal receiver configured to receive an image signal; a display including a plurality of modules each including a plurality of light sources, and display an image based on the received image signal; and a controller configured to perform first uniformity calibration between light sources within each individual module with regard to the modules, and second uniformity calibration between the modules, wherein the controller controls the first uniformity calibration to be applied to the image signal received in the signal receiver based on a first coefficient determined for each of the light sources within each individual module, controls the second uniformity calibration to be applied to the image signal subjected to the first uniformity calibration based on a second coefficient determined for each of the modules, and controls a calibrated image to be displayed based on the image signal subjected to the second uniformity calibration.

Abstract: Disclosed herein are cavity structures in integrated circuit (IC) package supports, as well as related methods and apparatuses. For example, in some embodiments, an IC package support may include: a cavity in a dielectric material, wherein the cavity has a bottom and sidewalls; conductive contacts at the bottom of the cavity, wherein the conductive contacts include a first material; a first peripheral material outside the cavity, wherein the first peripheral material is at the sidewalls of the cavity and proximate to the bottom of the cavity, and the first peripheral material includes the first material; and a second peripheral material outside the cavity, wherein the second peripheral material is at the sidewalls of the cavity and on the first peripheral material, and the second peripheral material is different than the first peripheral material.

Abstract: Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

Abstract: An image sensor chip includes an internal voltage generator for generating internal voltages using an external voltage received at a first terminal of the image sensor chip, a temperature sensor for generating a temperature voltage, a selection circuit for outputting one of the external voltage, the internal voltages, and the temperature voltage, a digital code generation circuit for generating a digital code using an output voltage of the selection circuit, and a second terminal for outputting the digital code from the image sensor chip.

Abstract: Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed over the substrate. In an embodiment, a bilayer build-up layer is formed over the plurality of conductive features. In an embodiment, the bilayer build-up layer comprises a first dielectric layer and a second dielectric layer. In an embodiment, a surface of the first dielectric layer comprises depressions. In an embodiment, the second dielectric layer is disposed in the depressions of the surface of the first dielectric layer.

Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

Abstract: The present invention relates to an electrification device and an electrical dust collecting apparatus including the same capable of adsorbing and filtering fine dust included in air in an air conditioning apparatus such as an air conditioner or an air cleaner, and more particularly, to an electrification device and an electrical dust collecting apparatus including the same capable of improving dust collecting efficiency by performing stable electrification at an accurate position using an electrification electrode in which an electrification pin and an electrode rod are formed integrally with each other.

Abstract: A composition for treatment of a cancer according to an embodiment of the present disclosure expresses secreted protein acidic and rich in cysteine (SPARC). The composition includes an albumin and at least one cysteine bound thereto.

Abstract: The present invention relates to an electrical dust collection device comprising: a charging part for applying charges to dust particles introduced from the outside; a dust collection part for collecting, by electric attraction, the dust particles charged by the charging part, wherein the charging part uses a first charging plate and a second charging plate, in parallel, in the movement direction of dust, thereby increasing an assembly property and further increasing dust collecting efficiency through stable charging, and the dust collection part comprises a first connection portion that continues at one side of a plurality of first dust collection plates, thereby increasing productivity and dust collecting performance.

Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: A photocatalyst device including: a body; a light source part fixed to the body to irradiate ultraviolet light and having an LED and a substrate for fixing the LED thereto; a catalyst part fixed to the body to conduct photocatalytic reaction with the light irradiated by the light source part and thus to generate superoxygen radicals; and a heat radiating part disposed on the light source part to radiate the heat generated from the light source part, whereby the photocatalyst device purifies air and sterilizes and deodorizes the evaporator, while being easily mountable as a single module.

Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: The present invention relates to an electric precipitator which adsorbs and filters fine dust included in air from air conditioning apparatuses such as an air conditioner or an air purification apparatus, wherein an electric charging part and a precipitating part to which high voltage is applied do not adversely affect each other and may increase precipitation efficiency.