Patents by Inventor Jian Yin

Jian Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10155879
    Abstract: The present invention relates to non aqueous, graftable coating composition comprised of a homogenous solution of a polymer and a spin casting organic solvent, where the composition does not contain acidic compounds, coloring particles, pigments or dyes, and the polymer has a linear polymer chain structure which is comprised of repeat units derived from monomers containing a single polymerizable olefinic carbon double bond, and the polymer contains at least one triarylmethyl chalcogenide containing moiety which is selected from the group consisting of repeat units having structure (I) an end chain group unit of structure (II) and mixtures thereof, and the polymer does not contain any repeat units or end groups containing water ionizable groups, ionic groups, free thiol groups, or free hydroxy groups, and where A1, A2, and A3 are independently an Aryl or a substituted Aryl; Y is a chalcogen selected from O, S, Se or Te; X1 and X2 are individually selected organic spacers; P1 is an organic polymer repeat unit m
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 18, 2018
    Assignee: AZ Electronic Materials (Luxembourg) S.à.r.l.
    Inventors: Guanyang Lin, Hengpeng Wu, JiHoon Kim, Jian Yin, Durairaj Baskaran, Jianhui Shan
  • Patent number: 10111333
    Abstract: An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 23, 2018
    Assignee: INTERSIL AMERICAS INC.
    Inventors: Jian Yin, Matthew Harris
  • Patent number: 10025733
    Abstract: The present invention discloses a data output dispatching device and method capable of reducing the probability of packets from the same queue being transmitted sequentially. An embodiment of the method comprises the following steps: providing a plurality of buffers capable of storing the data of Q queues respectively while each queue is associated with a weighting and the sum Ws of all the weightings is between 2(M?1) and 2M and not greater than a maximum sum in which Q is an integer greater than 1, M is a positive integer and N is an integer not less than M; providing a binary bit reverse count value not greater than 2N; and assigning a token to one of the Q queues for data output according to the reverse count value.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: July 17, 2018
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Jian-Yin Zhu
  • Patent number: 10019594
    Abstract: A computer system, computer product, and method for accessing a secure store, which includes receiving a request to access a secure store, checking the file path of the request to make sure it exists in the secure store, verifying security parameters from the process at the file system filter layer, saving the PID of the process by the file system filter layer, comparing the saved PID to the process's PID, and allowing the process to access the path in the secure store specified in the request.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: July 10, 2018
    Assignee: Honeywell International, Inc.
    Inventors: Qi Zhu, Jian Yin, Fei Jing
  • Publication number: 20180145782
    Abstract: Embodiments of the present disclosure provide a data transmission method and a device, and the method includes: determining synchronization header indication information indicating a frame header location of a first code stream, where the first code stream is obtained by encoding CPRI service data; decoding the first code stream to obtain a second code stream, where the first code stream is a 10B code stream, and the second code stream is an 8B code stream, or the first code stream is a 66B code stream, and the second code stream is a 64B code stream; inserting frame header indication information indicating a frame header location of the second code stream into the second code stream according to the synchronization header indication information; and mapping the second code stream and the frame header indication information into an OPU in an ODU frame.
    Type: Application
    Filed: January 23, 2018
    Publication date: May 24, 2018
    Inventors: Jian Yin, Jinqiu Liao, Xin Xiao, Chao Liu
  • Publication number: 20180109174
    Abstract: Disclosed herein is a power converter with low step down conversion ratio with improved power conversion efficiency. The power converter includes a first inductor to receive the input voltage, and a second inductor to supply the output voltage to a load. The first inductor and the second inductor are electromagnetically coupled to each other. The power converter further includes a first switch coupled between the first inductor and the second inductor. The first switch is switched according to a pulse having a frequency corresponding to a resonant frequency of (i) a series inductance between the first inductor and the second inductor and (ii) a parallel capacitance across the first switch. The power converter further includes a second switch coupled to the first switch and the second inductor to supply a reference voltage to the second inductor according to another pulse having the frequency.
    Type: Application
    Filed: August 17, 2017
    Publication date: April 19, 2018
    Applicant: Intersil Americas LLC
    Inventors: Sitthipong ANGKITITRAKUL, Jian YIN
  • Patent number: 9945659
    Abstract: Embodiments of the present invention provide an optical fiber length measurement method and apparatus, where the method is used to measure an optical fiber length between a first device and a second device, and the method includes: acquiring, by a measurement device, timestamp parameters, where the timestamp parameters include a first transmit timestamp Ta1, a first receive timestamp Ta2, a second transmit timestamp Tb1, and a second receive timestamp Tb2; and determining, by the measurement device, the optical fiber length L according to the timestamp parameters, where when (Ta2?Tb1)+(Tb2?Ta1)?n*T, L=2.5*[(Ta2?Tb1)+(Tb2?Ta1)], or when (Ta2?Tb1)+(Tb2?Ta1)>n*T, L=2.5*[(Ta2?Tb1)+(Tb2?Ta1)?n*T]. The method does not depend on a dedicated measurement instrument such as an OTDR, an OFDR, or an OCDR, thereby simplifying a measurement process, and helping reduce a measurement cost.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: April 17, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jian Yin, Fan He
  • Publication number: 20170358986
    Abstract: A system, power supplies, controller and method for enhanced phase current sharing are disclosed. For example, a power supply for enhanced phase current sharing is disclosed, which includes a plurality of power modules, a communication bus coupled to an input of each power module of the plurality power modules, and an output voltage node coupled to a first side of an inductor of each power module of the plurality of power modules, wherein each power module of the plurality of power modules includes a digital controller coupled to the input of the power module, and an RC circuit enabled to generate a feedback signal, coupled to a second side of the inductor and the output voltage node. In some implementations, the power supply is at least part of a power management integrated circuit (PMIC) or at least part of a power supply formed on a semiconductor IC, wafer, chip or die.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Applicant: Intersil Americas LLC
    Inventors: Shuai JIANG, Jian YIN, Zhixiang LIANG
  • Publication number: 20170329988
    Abstract: A computer system, computer product, and method for accessing a secure store, which includes receiving a request to access a secure store, checking the file path of the request to make sure it exists in the secure store, verifying security parameters from the process at the file system filter layer, saving the PID of the process by the file system filter layer, comparing the saved PID to the process's PID, and allowing the process to access the path in the secure store specified in the request.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 16, 2017
    Inventors: Qi Zhu, Jian Yin, Fei Jing
  • Publication number: 20170325333
    Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.
    Type: Application
    Filed: July 21, 2017
    Publication date: November 9, 2017
    Applicant: Intersil Americas LLC
    Inventors: Jian YIN, Nikhil KELKAR, Loyde M. CARPENTER,, JR., Nattorn PONGRATANANUKUL, Patrick J. SELBY, Steven R. RIVET, Michael W. ALTHAR
  • Patent number: 9755512
    Abstract: Auto-compensation—for compensating voltage regulators generating a regulated output voltage—may be performed dynamically by determining various coefficients of a compensation function used in compensating the power regulator, based at least on assumptions about the structure of the regulator and corresponding filters. At least the DC loop gain and the position of the compensation zeros may be determined without requiring any prior knowledge of the values of the various components of the system. The compensator coefficients may be adjusted based on duty-cycle jitter information, which may be accurately obtained/measured at a high signal-to-noise ratio. By observing the duty-cycle jitter, the capacitor (equivalent series resistance) may be optimally compensated by tuning the 0 dB crossover slope of the loop gain. Accordingly, auto-compensation may be performed by measuring the duty-cycle jitter while maintaining optimum stability and transient performance.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: September 5, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Shuai Jiang, Zhixiang Liang, Jian Yin
  • Patent number: 9748846
    Abstract: A system, power supplies, controller and method for enhanced phase current sharing are disclosed. For example, a power supply for enhanced phase current sharing is disclosed, which includes a plurality of power modules, a communication bus coupled to an input of each power module of the plurality power modules, and an output voltage node coupled to a first side of an inductor of each power module of the plurality of power modules, wherein each power module of the plurality of power modules includes a digital controller coupled to the input of the power module, and an RC circuit enabled to generate a feedback signal, coupled to a second side of the inductor and the output voltage node. In some implementations, the power supply is at least part of a power management integrated circuit (PMIC) or at least part of a power supply formed on a semiconductor IC, wafer, chip or die.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: August 29, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Shuai Jiang, Jian Yin, Zhixiang Liang
  • Patent number: 9720429
    Abstract: In an embodiment, a coupled-inductor structure includes first and second windings. The first winding is configured to conduct a phase current, has a first node configured for coupling to a phase node of a power supply, and has a second node configured for coupling to an output node of the power supply and to a first node of a sense impedance that is configured to generate a sense signal representative of the phase current. And the second winding is configured for magnetic coupling with the first winding, has a first node coupled to the first node of the first winding, and has a second node configured for coupling to a second node of the sense impedance. For example, the first winding may be a phase inductor of a switching power supply, and the impedance may be a capacitor that generates a sense voltage representative of the phase current.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: August 1, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Shuai Jiang, Jian Yin
  • Patent number: 9723766
    Abstract: An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 1, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Jian Yin, Nikhil Vishwanath Kelkar, Michael Althar
  • Patent number: 9717146
    Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: July 25, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Jian Yin, Nikhil Kelkar, Loyde M. Carpenter, Jr., Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet, Michael W. Althar
  • Publication number: 20170199026
    Abstract: Embodiments of the present invention provide an optical fiber length measurement method and apparatus, where the method is used to measure an optical fiber length between a first device and a second device, and the method includes: acquiring, by a measurement device, timestamp parameters, where the timestamp parameters include a first transmit timestamp Ta1, a first receive timestamp Ta2, a second transmit timestamp Tb1, and a second receive timestamp Tb2; and determining, by the measurement device, the optical fiber length L according to the timestamp parameters, where when (Ta2?Tb1)+(Tb2?Ta1)?n*T, L=2.5*[(Ta2?Tb1)+(Tb2?Ta1)], or when (Ta2?Tb1)+(Tb2?Ta1)?n*T, L=2.5*[(Ta2?Tb1)+(Tb2?Ta1)?n*T]. The method does not depend on a dedicated measurement instrument such as an OTDR, an OFDR, or an OCDR, thereby simplifying a measurement process, and helping reduce a measurement cost.
    Type: Application
    Filed: March 24, 2017
    Publication date: July 13, 2017
    Inventors: Jian YIN, Fan HE
  • Patent number: 9696739
    Abstract: In an embodiment, a coupled-inductor structure includes first and second windings. The first winding is configured to conduct a phase current, has a first node configured for coupling to a phase node of a power supply, and has a second node configured for coupling to an output node of the power supply and to a first node of a sense impedance that is configured to generate a sense signal representative of the phase current. And the second winding is configured for magnetic coupling with the first winding, has a first node coupled to the first node of the first winding, and has a second node configured for coupling to a second node of the sense impedance. For example, the first winding may be a phase inductor of a switching power supply, and the impedance may be a capacitor that generates a sense voltage representative of the phase current.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: July 4, 2017
    Assignee: INTERSIL AMERICAS LLC
    Inventors: Shuai Jiang, Jian Yin
  • Publication number: 20170174931
    Abstract: The present invention relates to non aqueous, graftable coating composition comprised of a homogenous solution of a polymer and a spin casting organic solvent, where the composition does not contain acidic compounds, coloring particles, pigments or dyes, and the polymer has a linear polymer chain structure which is comprised of repeat units derived from monomers containing a single polymerizable olefinic carbon double bond, and the polymer contains at least one triarylmethyl chalcogenide containing moiety which is selected from the group consisting of repeat units having structure (I) an end chain group unit of structure (II) and mixtures thereof, and the polymer does not contain any repeat units or end groups containing water ionizable groups, ionic groups, free thiol groups, or free hydroxy groups, and where A1, A2, and A3 are independently an Aryl or a substituted Aryl; Y is a chalcogen selected from O, S, Se or Te; X1 and X2 are individually selected organic spacers; P1 is an organic polymer repeat unit m
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Applicant: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
    Inventors: Guanyang Lin, Hengpeng Wu, JiHoon Kim, Jian Yin, Durairaj Baskaran, Jianhui Shan
  • Publication number: 20170162488
    Abstract: Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.
    Type: Application
    Filed: February 22, 2017
    Publication date: June 8, 2017
    Inventors: Jian Yin, Nikhil Vishwanath Kelkar, Loyde Milton Carpenter, JR.
  • Patent number: 9659183
    Abstract: A computer system, computer product, and method for accessing a secure store, which includes receiving a request to access a secure store, checking the file path of the request to make sure it exists in the secure store, verifying security parameters from the process at the file system filter layer, saving the PID of the process by the file system filter layer, comparing the saved PID to the process's PID, and allowing the process to access the path in the secure store specified in the request.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: May 23, 2017
    Assignee: Honeywell International Inc.
    Inventors: Qi Zhu, Jian Yin, Fei Jing