Patents by Inventor Jiasheng Wang

Jiasheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125699
    Abstract: A microfluidic ion detection chip having a bubble brightening structure includes a substrate, an upper plate, two glass cover plates, and a foam board. The substrate is provided with a fluid mixing region, a lower optical detection through hole, and a lower gas flow channel. The upper plate is adhesively connected to the substrate and is provided with a sample outlet, an upper optical detection through hole, an upper gas flow channel, and two sample inlets, the upper gas flow channel and the lower gas flow channel are combined to form a gas flow channel. The two glass cover plates are respectively disposed at the lower optical detection through hole and the upper optical detection through hole. The foam board is provided with a foaming structure capable of generating bubbles and a surfactant coated on the foam board, the foam board is disposed at the gas flow channel.
    Type: Application
    Filed: October 19, 2021
    Publication date: April 18, 2024
    Inventors: Zongtao LI, Hong WANG, Yongheng XING, Jiasheng LI, Jiexin LI, Zhou LU, Junhao WU
  • Publication number: 20240099183
    Abstract: Disclosed is a variable-size and variable-amount topdressing device. The device includes a main frame; an image recognition unit; a variable-amount fertilizer applying portion; two electric push rods which are vertically and fixedly connected to inner opposite surfaces of the main frame respectively; and a variable-size fertilizer applying portion arranged at an output end of the variable-amount fertilizer applying portion, where a height of the variable-size fertilizer applying portion is adjusted by the two electric push rods, an output end of the variable-size fertilizer applying portion is arranged corresponding to the output end of the variable-amount fertilizer applying portion, and the variable-size fertilizer applying portion is used for adjusting a fertilizer applying range. The variable-amount fertilizer applying portion, the variable-size fertilizer applying portion and the two electric push rods are electrically connected to the image recognition unit.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Inventors: Jiasheng WANG, Zhengguo LIAN, Dongwei WANG, Ni HUI, Yang QIAO
  • Publication number: 20230181639
    Abstract: Provided is an antibody or an antigen-binding fragment thereof, a T cell antigen receptor, an immune cell expressing the T cell antigen receptor (TCR), and a preparation method therefor and the use thereof. The TCR can specifically recognize corresponding pMHC complexes, activate TCR T cells, and produce high-level cytokines IFN?, IL2, TNF?, significantly kill target cells and prolong the life of tumor-bearing mice.
    Type: Application
    Filed: April 23, 2021
    Publication date: June 15, 2023
    Inventors: Lemei JIA, Hua CHEN, Wenzhong LI, Jiasheng WANG, Lei LEI, Fang LIU, Xueqiang ZHAO, Xin LIN
  • Patent number: 11626757
    Abstract: A method and system for operating a power circuit capable of transmitting and receiving wireless power. The method includes determining that the power circuit is operating in receive mode, and, based thereon, having a first equivalent capacitance. The method further includes determining that the power circuit is operating in the transmit mode, and, based thereon, having a second equivalent capacitance. The first equivalent capacitance being different than the second equivalent capacitance.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: April 11, 2023
    Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD.
    Inventor: Jiasheng Wang
  • Patent number: 11496185
    Abstract: A method for modulating a signal including operating a circuit in a first arrangement during a first operating interval and switching the circuit between the first arrangement and a second arrangement during a first modulation interval to vary a load on the circuit to produce a first amplitude shift keying (ASK) signal. The method further includes detecting a voltage on the circuit crossing a threshold level and operating the circuit in the second arrangement during a second operating interval. The method also includes switching the circuit between the second arrangement and the first arrangement during a second modulation interval to vary the load on the circuit to produce a second ASK signal.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: November 8, 2022
    Assignees: STMicroelectronics (Research & Development Limited), STMicroelectronics Asia Pacific PTE Ltd.
    Inventors: Wenhe Zhao, Jiasheng Wang
  • Publication number: 20220085848
    Abstract: A method for modulating a signal including operating a circuit in a first arrangement during a first operating interval and switching the circuit between the first arrangement and a second arrangement during a first modulation interval to vary a load on the circuit to produce a first amplitude shift keying (ASK) signal. The method further includes detecting a voltage on the circuit crossing a threshold level and operating the circuit in the second arrangement during a second operating interval. The method also includes switching the circuit between the second arrangement and the first arrangement during a second modulation interval to vary the load on the circuit to produce a second ASK signal.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 17, 2022
    Inventors: Wenhe Zhao, Jiasheng Wang
  • Publication number: 20220021242
    Abstract: A method and system for operating a power circuit capable of transmitting and receiving wireless power. The method includes determining that the power circuit is operating in receive mode, and, based thereon, having a first equivalent capacitance. The method further includes determining that the power circuit is operating in the transmit mode, and, based thereon, having a second equivalent capacitance. The first equivalent capacitance being different than the second equivalent capacitance.
    Type: Application
    Filed: July 16, 2020
    Publication date: January 20, 2022
    Inventor: Jiasheng Wang
  • Patent number: 11095170
    Abstract: A system and method for improving ASK packet transfer reliability and power dissipation efficiency at light-load or no-load conditions of a receiving device is provided. In an embodiment, the receiving device includes a dissipating element coupled to a rectifier. The dissipating element is connected to a reference voltage at a first duration corresponding to a transmission of the ASK packet. The dissipating element is disconnected from the reference voltage a second duration corresponding to an end of the transmission of the ASK packet.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: August 17, 2021
    Assignee: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD.
    Inventor: Jiasheng Wang
  • Patent number: 9059516
    Abstract: A 3D package device of a photonic integrated chip matching circuit, comprising: a first carrier substrate; a first microwave transmission line array formed by evaporation on the top surface of the first carrier substrate to provide bias voltages and high-frequency modulation signals to the photonic integrated chip; a second carrier substrate formed perpendicularly to the first carrier substrate or to have a certain angle with respect to the first carrier substrate, so as to constitute a 3D structure; a second microwave transmission line array formed by evaporation on the bottom surface of the second carrier substrate to match electrodes of the first microwave transmission line array, the second microwave transmission line array being soldered or sintered with the electrodes of the first microwave transmission line array; an electrode array formed by evaporation on a side surface or two opposite side surfaces of the second carrier substrate; and a microwave circuit.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: June 16, 2015
    Assignee: Institute of Semiconductors, Chinese Academy of Sciences
    Inventors: Ninghua Zhu, Jiasheng Wang, Jianguo Liu, Yu Liu