Patents by Inventor Jie Huang

Jie Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240017538
    Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.
    Type: Application
    Filed: August 2, 2023
    Publication date: January 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Jie Huang, Yu-Ching Lo, Ching-Pin Yuan, Wen-Chih Lin, Cheng-Yu Kuo, Yi-Yang Lei, Ching-Hua Hsieh
  • Patent number: 11877331
    Abstract: A method and a system for smart Bluetooth operation switching based on a beacon broadcast are provided. A Bluetooth device transmits the beacon broadcast; a mobile terminal scans the beacon broadcast and, by parsing the beacon broadcast, the mobile terminal determines whether to wake up an application program; sending a parsed beacon broadcast to the application program, and identifying feature data of a Bluetooth device connectable broadcast set in the beacon broadcast; the Bluetooth device transmits a connectable broadcast; the mobile terminal connects to the connectable broadcast and performs an identity verification; acquiring a received signal strength indicator (RSSI) signal strength between the Bluetooth device and the mobile terminal, and mutually calculating position information to obtain a relative distance of the Bluetooth device and the mobile terminal; and, when the relative distance reaches a threshold, executing a corresponding switch action.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: January 16, 2024
    Assignee: Shenzhen Shengrun Technology Co., Ltd
    Inventors: Jie Huang, Chihua Chen, Yan Zhang
  • Patent number: 11860905
    Abstract: Techniques are discussed for preparing and executing scanning plans for particular types of information, including personally identifiable information. A user indicates one or more datastores to be scanned for the particular type of information. A scanner determines scan objectives for the scanning plan and classifiers for use in scans conducted according to the scanning plan. The scanner estimates scan performance metrics and scan quality metrics. The scanner presents estimated results for the scanning plan based on the selected classifiers, scan objectives, estimate scan performance metrics, and estimated scan quality metrics. The user can modify the set of scan objectives or select between alternative sets of scan objectives. The scanning plan may be performed iteratively and the results of previous scan may be used to adjust classifiers or scan objectives to be used in subsequent scans.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 2, 2024
    Assignee: PayPal, Inc.
    Inventors: Gaoyuan Wang, Jie Huang, Zelin Yan, Fuyuan Kang
  • Patent number: 11860120
    Abstract: An IC includes a source region and a drain region in a semiconductor layer. A channel region is between the source region and the drain region. A sensing well is on a back surface of the semiconductor layer and over the channel region. An interconnect structure is on a front surface of the semiconductor layer opposite the back surface of the semiconductor layer. A biosensing film lines the sensing well and contacts a bottom surface of the sensing well that is defined by the semiconductor layer. A coating of selective binding agent is over the biosensing film and configured to bind with a cardiac cell.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: January 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
  • Patent number: 11860152
    Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kun-Lung Chen, Tung-Tsun Chen, Cheng-Hsiang Hsieh, Yu-Jie Huang, Jui-Cheng Huang
  • Patent number: 11860121
    Abstract: An IC includes a source region and a drain region in a semiconductor layer. A channel region is between the source region and the drain region. A sensing well is on a back surface of the semiconductor layer and over the channel region. An interconnect structure is on a front surface of the semiconductor layer opposite the back surface of the semiconductor layer. A biosensing film lines the sensing well and contacts a bottom surface of the sensing well that is defined by the semiconductor layer. A coating of selective binding agent is over the biosensing film and configured to bind with a cardiac cell.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: January 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
  • Patent number: 11841536
    Abstract: A bi-directional optical communication device comprising a reduced number of components for speedier and less costly manufacture includes a plate and a wavelength-division multiplexer disposed on the plate. An optical-signal transmitter disposed on the board emits first beam to the wavelength-division multiplexer and an optical-signal receiver disposed on the board detects the second beam emitted by the wavelength-division multiplexer. An optical receptacle is disposed on the plate for actual connection to an optical fiber. The optical fiber emits the second beam to the wavelength-division multiplexer, and the multiplexer emits the first beam to the optical fiber.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: December 12, 2023
    Assignee: SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Jie Huang
  • Publication number: 20230393091
    Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; a carrier substrate on the MLI structure; a first through substrate via (TSV) structure extending though the carrier substrate and configured to provide an electrical connection between the MLI structure and a separate die; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; and a microfluidic channel cap structure attached to the buried oxide layer.
    Type: Application
    Filed: August 17, 2023
    Publication date: December 7, 2023
    Inventors: Allen Timothy Chang, Jui-Cheng Huang, Wen-Chuan Tai, Yu-Jie Huang
  • Patent number: 11828606
    Abstract: A method and apparatus for updating a point cloud. The method may include: determining an area point cloud matching newly added point clouds from historical point clouds to be updated based on a set formed by a pose of a point cloud acquisition device acquiring the newly added point clouds. The method may further include: merging the newly added point clouds into the matched area point cloud to obtain merged historical point clouds. The method may further include: performing global optimization on the merged historical point clouds based on a pose of each point cloud in the merged historical point clouds to obtain updated point clouds.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: November 28, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Jie Huang, Yu Liu
  • Patent number: 11826133
    Abstract: A method for identifying brain-state dependent functional areas of unitary pooled activity (FAUPAs) using a statistical model that does not require a priori knowledge of the activity-induced ideal response signal time course is provided. A system for identifying a functional network in a brain of a living object includes a FAUPA identifier configured to identify FAUPAs by analyzing a plurality of images of the brain over a predetermined period. The plurality of images include a plurality of voxels, and the FAUPA identifier analyzes each voxel of the plurality of voxels in relation to one or more surrounding voxels of each voxel until each voxel of the plurality of voxels is evaluated. A brain network identification module configured to construct the functional network based on the identified FAUPAs that are functionally connected. A display module configured to display images of the brain depicting the FAUPAs included in the functional network.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: November 28, 2023
    Assignee: Board of Trustees of Michigan State University
    Inventor: Jie Huang
  • Publication number: 20230375500
    Abstract: A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 23, 2023
    Applicant: Tawian Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Cheng Huang, Yi-Hsien Chang, Chin-Hua Wen, Chun-Ren Cheng, Shih-Fen Huang, Tung-Tsun Chen, Yu-Jie Huang, Ching-Hui Lin, Sean Cheng, Hector Chang
  • Patent number: D1007129
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: December 12, 2023
    Inventor: Jie Huang
  • Patent number: D1007131
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: December 12, 2023
    Inventor: Jie Huang
  • Patent number: D1007132
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: December 12, 2023
    Inventor: Jie Huang
  • Patent number: D1008237
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: December 19, 2023
    Inventor: Jie Huang
  • Patent number: D1008637
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: December 26, 2023
    Inventor: Jie Huang
  • Patent number: D1010292
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: January 9, 2024
    Inventor: Jie Huang
  • Patent number: D1010597
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: January 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ting Xu, Jie Huang, Fei Wang, Zedong Zeng, Guang Cao
  • Patent number: D1011315
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: January 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jie Huang, Zengzhu Deng, Qiang Huang
  • Patent number: D1011328
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: January 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ting Xu, Jie Huang, Fei Wang, Zedong Zeng, Guang Cao