Abstract: A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured spray the cleaning water therethrough, and wherein the spraying port has an X shape may be provided.