Abstract: Various embodiments relate to a liquid metal particle-assembled network synthesized in various polymers and a method of manufacturing the same. The liquid metal particle- assembled network is configured to include a polymer matrix, first liquid metal particles spaced apart from each other and disposed within the polymer matrix, and second liquid metal particles that connect the first liquid metal particles between the first liquid metal particles within the polymer matrix. In this case, the size of each of the second liquid metal particles may be smaller than the size of each of the first liquid metal particles.

Abstract: Various embodiments are directed to apparatuses and methods involving an elastomer material comprising a flexible polymer backbone with a particular ratio of at least first moieties and second moieties. The first moieties provide a first number of dynamic bonds resulting from interactions between the first moieties and the second moieties provide a second number of dynamic bonds resulting from interactions between the second moieties, the second number of dynamic bonds having a weaker bonding strength than the first number of dynamic bonds. The elastomer material, based on the ratio of the first moieties and second moieties, exhibits autonomous self-healing, a particular toughness, and is stretchable.

Abstract: A self-healing composite includes a matrix including an elastomer and conductive nanostructures embedded in the matrix, wherein the elastomer includes a polymer main chain, a —HN—C(?O)—NH— containing first structural unit capable of forming a strong hydrogen bond, and a —HN—C(?O)—NH— containing second structural unit capable of forming a weak hydrogen bond.

Abstract: Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.

Abstract: A self-healing composite includes a matrix including an elastomer and conductive nanostructures embedded in the matrix, wherein the elastomer includes a polymer main chain, a —HN—C(?O)—NH— containing first structural unit capable of forming a strong hydrogen bond, and a —HN—C(?O)—NH— containing second structural unit capable of forming a weak hydrogen bond.

Abstract: Various embodiments are directed to apparatuses and methods involving an elastomer material comprising a flexible polymer backbone with a particular ratio of at least first moieties and second moieties. The first moieties provide a first number of dynamic bonds resulting from interactions between the first moieties and the second moieties provide a second number of dynamic bonds resulting from interactions between the second moieties, the second number of dynamic bonds having a weaker bonding strength than the first number of dynamic bonds. The elastomer material, based on the ratio of the first moieties and second moieties, exhibits autonomous self-healing, a particular toughness, and is stretchable.

Abstract: Various embodiments are directed to a method of forming an apparatus including placing a first electronic circuit in contact with a second electronic circuit, wherein each of the first and second electronic circuits have connector circuits configured and arranged to provide an electrical connection between the first and second electronic circuits and are formed with a polymer film that is configured to adhere, via self-healing, to another polymer film. The method further includes, in response to the contact, causing or facilitating the self-healing of the respective polymer films of the first and second electronic circuits, thereby creating the electrical connection therebetween.