Patents by Inventor JIM-WEI WU

JIM-WEI WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10868241
    Abstract: The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jim-Wei Wu, Li Tseng, Chia-Hsun Chang, Wen-Chih Wang, Keith Kuang-Kuo Koai
  • Publication number: 20200365797
    Abstract: The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Inventors: JIM-WEI WU, LI TSENG, CHIA-HSUN CHANG, WEN-CHIH WANG, KEITH KUANG-KUO KOAI