Patents by Inventor Jin-Soo Park

Jin-Soo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240078710
    Abstract: Disclosed herein are a method, an apparatus and a storage medium for encoding/decoding using a transform-based feature map. An optimal basis vector is extracted from one or more feature maps, and a transform coefficient is acquired through a transform using the basis vector. The basis vector and the transform coefficient may be transmitted through a bitstream. In an embodiment, one or more feature maps are reconstructed using the basis vector and the transform coefficient, which are decoded from the bitstream.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Youn-Hee KIM, Jooyoung LEE, Se-Yoon JEONG, Jin-Soo CHOI, Dong-Gyu SIM, Na-Seong KWON, Seung-Jin PARK, Min-Hun LEE, Han-Sol CHOI
  • Publication number: 20240077417
    Abstract: The disclosure relates to a non-dispersive infrared (NDIR) gas sensor which detects the concentration of gas with a simple structure and method by manufacturing an optical waveguide with a gas-permeable polymer material instead of a conventional cavity or chamber type. An optical signal travels through the optical waveguide of gas-permeable polymer by total internal reflection, and the gas naturally penetrates the optical waveguide without the use of separate inlet and outlet openings, so that the optical signal and gas particles come into contact with each other within the optical waveguide. Since the optical signal detected by a photodetector at the other end of the optical waveguide after traveling while contacting the gas particles has properties changed according to the concentration of the gas which they have contacted in the optical waveguide, it is possible to measure the concentration of a specific gas from the detected optical signal.
    Type: Application
    Filed: July 11, 2023
    Publication date: March 7, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jin Hwa RYU, Soocheol KIM, Hyunseok KIM, So Yung PARK, Hoe-Sung YANG, Kang Bok LEE, Kwang-Soo CHO, Kyu Won HAN
  • Publication number: 20240076224
    Abstract: A molding method for a cover window includes: locally heating a peripheral portion of a glass substrate around a central portion of the glass substrate to a temperature of about 610° C. to about 670° C., forming a cover window by pressing the glass substrate, and annealing and cooling the cover window. Accordingly, a cover window in which each of edges has an outwardly convex curved surface through a glass substrate may be formed. In addition, the surface roughness of a cover window formed through a glass substrate may be improved.
    Type: Application
    Filed: August 25, 2023
    Publication date: March 7, 2024
    Inventors: HYUNSEUNG SEO, Young Ki PARK, Jong Soo BAEK, JIHYUN KO, SEUNGHO KIM, Jin Su NAM, Oh Joo PARK, JUN HO LEE
  • Patent number: 11924988
    Abstract: A display apparatus including a display and a supporter. The supporter being mounted on the display and configured to support the display and rotate the display module between a first position and a second position. The supporter including a drive motor, a first gear, and a detection sensor. The drive motor configured to supply a driving force to rotate the display. The first gear configured to rotate together with the display by receiving the driving force from the drive motor. The detection sensor configured to detect a rotation amount of a second gear configured to rotate in with the first gear.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Yong Choi, Young Chul Kim, Ji Su Kim, Hun Sung Kim, Sung Yong Park, Jin Soo Shin, Dae Sik Yoon, Yong Yeon Hwang
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Publication number: 20240073416
    Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee University
    Inventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
  • Patent number: 11917193
    Abstract: According to the present invention, an image encoding apparatus comprises: a motion prediction unit which derives motion information on a current block in the form of the motion information including L0 motion information and L1 motion information; a motion compensation unit which performs a motion compensation for the current block on the basis of at least one of the L0 motion information and L1 motion information so as to generate a prediction block corresponding to the current block; and a restoration block generating unit which generates a restoration block corresponding to the current block based on the prediction block. According to the present invention, image encoding efficiency can be improved.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 27, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Hui Yong Kim, Gwang Hoon Park, Kyung Yong Kim, Sang Min Kim, Sung Chang Lim, Jin Ho Lee, Jin Soo Choi, Jin Woong Kim
  • Publication number: 20240063456
    Abstract: A battery pack including a battery cell stack including a plurality of battery cells, a cooling member configured to cool the battery cell stack, a deformation member configured to discharge heat from the plurality of battery cells to the cooling member, and a housing configured to receive the battery cell stack, the cooling member, and the deformation member therein, wherein the deformation member includes a first deformation member interposed between the plurality of battery cells, and a coolant. It is possible to adjust the temperature of each of the plurality of battery cells to a predetermined level when the temperature of the battery cells is equal to or lower than a dangerous temperature, and it is possible to block heat transfer between the plurality of battery cells when the temperature of the battery cells is higher than the dangerous temperature.
    Type: Application
    Filed: December 15, 2022
    Publication date: February 22, 2024
    Inventor: Jin Soo Park
  • Publication number: 20240063463
    Abstract: A battery pack including a battery cell stack of a plurality of battery cells, a cooling member configured to cool the battery cell stack, a heat transfer member configured to discharge heat from the plurality of battery cells to the cooling member, and a housing for battery cell stack, the cooling member, and the heat transfer member. The heat transfer member is provided with a cooling fluid introduction portion and a cooling fluid discharge portion. When the temperature of the battery cell is equal to or lower than a dangerous temperature, it is possible to adjust the temperature of each of the battery cells to a predetermined level, and when the temperature of the battery cell is higher than the dangerous temperature, it is possible to rapidly cool the battery cell.
    Type: Application
    Filed: December 13, 2022
    Publication date: February 22, 2024
    Inventor: Jin Soo PARK
  • Patent number: 11901130
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Publication number: 20230411074
    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.
    Type: Application
    Filed: November 9, 2022
    Publication date: December 21, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eui Hyun JO, Jin Soo PARK, Chul Seung LEE, Byung Jun JEON, Hyung Jong CHOI, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK
  • Patent number: 11846882
    Abstract: Disclosed is a method for manufacturing a high-density neural probe including needles having various forms. The method, in which only a photolithography process and an etching process are used, simplifies a manufacturing process of the neural probe, minimizes changes in the characteristics of the neural probe depending on process equipment or conditions, and may thus ensure a high yield, thereby being advantageous in terms of commercialization. In addition, various forms of needles may be manufactured depending on the shape of patterns included in a mask, the height of the needles may be controlled by adjusting the size of the patterns and the gap between the patterns, and thereby, a neural probe having a plurality of needles having different heights may be manufactured.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: December 19, 2023
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Maesoon Im, Byung Chul Lee, Young Jun Yoon, Jin Soo Park, Seung Min Kwak
  • Publication number: 20230386750
    Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction, first and second external electrodes including first and second plating layers disposed on the third and fourth surfaces, respectively and first and second electrode layers disposed on the first and second plating layers, respectively, first and second band electrodes disposed on the first surface and connected to the first and second external electrode, respectively. The first and second electrode layers do not contain glass.
    Type: Application
    Filed: March 24, 2023
    Publication date: November 30, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo PARK, Eui Hyun JO, Hyun Hee GU
  • Patent number: 11795547
    Abstract: Disclosed is an aerosol-deposition-coating method for plasma-resistant coating, in which the inside of a processing device can be protected from plasma during a plasma-etching process, the roughness of a coating layer on a metal substrate can be decreased to thereby reduce the generation of particles, and adhesion between the coating layer and the metal substrate can be enhanced.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: October 24, 2023
    Assignee: KOMICO LTD.
    Inventors: Dae-Hoon Jang, Hyunchul Ko, Dong-Joo Kim, Sang-Gyu Park, Jin-Soo Park
  • Publication number: 20230230765
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.
    Type: Application
    Filed: December 14, 2022
    Publication date: July 20, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo PARK, Eui Hyun JO, Jun Hyeong KIM, Ha Jeong KIM, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK, Byung Jun JEON, Chul Seung LEE
  • Patent number: 11699554
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Jin Soo Park, Ji Hong Jo, Myung Jun Park, Hyun Hee Gu, Jong Ho Lee
  • Publication number: 20230187138
    Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.
    Type: Application
    Filed: October 20, 2022
    Publication date: June 15, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Jong Ho Lee, Kang Ha Lee, Yoon A Park, Eui Hyun Jo, Myung Jun Park, Hyun Hee Gu, Woo Kyung Sung
  • Publication number: 20230154684
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
  • Patent number: 11587735
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: February 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Patent number: 11506543
    Abstract: A temperature sensor installing device for a power relay assembly is configured to be attached to a lower surface of a bus bar attached to a heating surface of the power relay assembly. The temperature sensor installing device includes: a body housing; a temperature sensor insertion recess formed in an upper portion of the body housing and accommodating a temperature sensor such that a temperature sensing surface of the temperature sensor faces upward; and a nut insertion recess formed in the upper portion of the body housing and accommodating a nut.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: November 22, 2022
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Jin Soo Park