Abstract: Methods and apparatuses are provided for controlling a communication device. A first subframe is received from a serving cell and a plurality of subframes is received from a plurality of neighbor cells. A respective time difference of arrival (TDOA) is measured for each of the plurality of subframes based on a time of arrival (TOA) of the first subframe. At least one of the measured TDOAs is transmitted to a location server. The respective TDOAs are measured based on at least one of a cell-specific reference signal (CRS) and a synchronization signal in the plurality of subframes.

Abstract: Methods and apparatuses are provided for controlling a communication device. A first subframe is received from a serving cell and a plurality of subframes is received from a plurality of neighbor cells. A respective time difference of arrival (TDOA) is measured for each of the plurality of subframes based on a time of arrival (TOA) of the first subframe. At least one of the measured TDOAs is transmitted to a location server. The respective TDOAs are measured based on at least one of a cell-specific reference signal (CRS) and a synchronization signal in the plurality of subframes.

Abstract: A function execution method and apparatus thereof for displaying one or more sub-functions included in a function selected by a first touch on a trace according to a second touch input based upon the first and the second touches inputted with a timing difference, and executing the relevant sub-function selected among the displayed one or more sub-functions. For this purpose, a function execution method according to the present invention is performed by comprising: detecting a first touch input touched on a display unit; detecting a drag created by a second touch inputted while maintaining the first touch; and displaying one or more sub-functions included in a function selected by the first touch along a trace of the detected drag on the display unit.

Abstract: Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: The present invention relates to a keyboard for inputting multiple languages using a detachable keypad, and more particularly, to a rotary-type keyboard for inputting multiple languages that includes a baseboard, rows of a plurality of key caps placed on the baseboard, and a plurality of moving mechanism members connecting the key caps to the baseboard and enabling the key caps to move upward and downward with respect to the baseboard. The key caps are divided into an opaque portion and a transparent portion, and have a plurality of rotatable members which are provided between the baseboard and the transparent portion in the direction in which the rows of key caps extend, and which have characters printed on the outer surfaces thereof. The plurality of rotatable members provide the user with different characters through the transparent portion depending on the angle of rotation.

Abstract: Disclosed herein a printed circuit board comprising: a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.

Abstract: The present invention relates to a keyboard for inputting multiple languages using a detachable keypad. More particularly, the present invention includes: a base board; rows of a plurality of key caps that are disposed on the base board; and a plurality of moving mechanism members that connect the key caps to the base board and enable the key caps to vertically move relative to the base board. Each key cap is divided into an opaque portion and a transparent portion, and characters are disposed on the upper surface thereof. The insertion-type keyboard for inputting multiple languages according to the present invention comprises an insertion member that is provided such that a character can be seen by a user through the transparent portion, and a space part in which the insertion member is accommodated between the base board and the transparent portion in the direction in which the rows of key caps are arranged.

Abstract: A packaging method comprises steps of forming a plurality of pads and another circuit pattern on a substrate, forming a second dry film pattern including opening exposing the pad, mounting a solder coating ball in the opening of the second dry film pattern, performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern, delaminating the second dry film pattern, and forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern.

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.

Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.