Patents by Inventor Jing Hua Teng

Jing Hua Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8436334
    Abstract: A multiple quantum well (MQW) structure for a light emitting diode and a method for fabricating a MQW structure for a light emitting diode are provided. The MQW structure comprises a plurality of quantum well structures, each quantum well structure comprising: a barrier layer; and a well layer having quantum dot nanostructures embedded therein formed on the barrier layer, the barrier and the well layer comprising a first metal-nitride based material; wherein at least one of the quantum well structures further comprises a capping layer formed on the well layer, the capping layer comprising a second metal-nitride based material having a different metal element compared to the first metal-nitride based material.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: May 7, 2013
    Assignee: Agency for Science, Technology and Research
    Inventors: Chew Beng Soh, Soo Jin Chua, Wei Liu, Jing Hua Teng
  • Patent number: 8421058
    Abstract: A light emitting diode structure and a method of forming a light emitting diode structure are provided. The structure includes a superlattice comprising, a first barrier layer; a first quantum well layer comprising a first metal-nitride based material formed on the first barrier layer; a second barrier layer formed on the first quantum well layer; and a second quantum well layer including the first metal-nitride based material formed on the second barrier layer; and wherein a difference between conduction band energy of the first quantum well layer and conduction band energy of the second quantum well layer is matched to a single or multiple longitudinal optical phonon energy for reducing electron kinetic energy in the superlattice.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: April 16, 2013
    Assignee: Agency for Science, Technology and Research
    Inventors: Wei Liu, Chew Beng Soh, Soo Jin Chua, Jing Hua Teng
  • Publication number: 20110284824
    Abstract: A light emitting diode structure and a method of forming a light emitting diode structure are provided. The structure comprises a superlattice comprising, a first barrier layer; a first quantum well layer comprising a first metal-nitride based material formed on the first barrier layer; a second barrier layer formed on the first quantum well layer; and a second quantum well layer comprising the first metal-nitride based material formed on the second barrier layer; and wherein a difference between conduction band energy of the first quantum well layer and conduction band energy of the second quantum well layer is matched to a single or multiple longitudinal optical phonon energy for reducing electron kinetic energy in the superlattice.
    Type: Application
    Filed: November 20, 2009
    Publication date: November 24, 2011
    Applicant: Agency for Science, Technology and Research
    Inventors: Wei Liu, Chew Beng Soh, Soo Jin Chua, Jing Hua Teng
  • Publication number: 20100224857
    Abstract: A multiple quantum well (MQW) structure for a light emitting diode and a method for fabricating a MQW structure for a light emitting diode are provided. The MQW structure comprises a plurality of quantum well structures, each quantum well structure comprising: a barrier layer; and a well layer having quantum dot nanostructures embedded therein formed on the barrier layer, the barrier and the well layer comprising a first metal-nitride based material; wherein at least one of the quantum well structures further comprises a capping layer formed on the well layer, the capping layer comprising a second metal-nitride based material having a different metal element compared to the first metal-nitride based material.
    Type: Application
    Filed: October 12, 2007
    Publication date: September 9, 2010
    Applicant: Agency for Science Tecnology and Research
    Inventors: Chew Beng Soh, Soo Jin Chua, Wei Liu, Jing Hua Teng
  • Patent number: 7223623
    Abstract: A method for forming a modified semiconductor having a number of band gaps involves providing a semiconductor having a surface and a quantum region which emits photons in response to electrical or optical stimulation, the quantum region having an original band gap and being disposed under the surface and applying a number of layers of a number of materials to a number of selected regions of the surface, the materials being adapted to cause, upon thermal annealing, a number of different degrees of intermixing in a number of portions of the quantum region disposed immediately below each of the selected regions of the surface. The layers of materials can be applied in a dot or line pattern, or both, to increase the plurality of band gap tuning. The method includes thermally annealing the layers to the surface.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: May 29, 2007
    Assignees: Agency for Science, Technology and Research, National University of Singapore
    Inventors: Jing Hua Teng, Soo Jin Chua, Jian Rong Dong
  • Publication number: 20050153473
    Abstract: A method for forming a modified semiconductor having a number of band gaps involves providing a semiconductor having a surface and a quantum region which emits photons in response to electrical or optical stimulation, the quantum region having an original band gap and being disposed under the surface and applying a number of layers of a number of materials to a number of selected regions of the surface, the materials being adapted to cause, upon thermal annealing, a number of different degrees of intermixing in a number of portions of the quantum region disposed immediately below each of the selected regions of the surface. The layers of materials can be applied in a dot or line pattern, or both, to increase the plurality of band gap tuning. The method includes thermally annealing the layers to the surface.
    Type: Application
    Filed: April 4, 2003
    Publication date: July 14, 2005
    Inventors: Jing Hua Teng, Soo Jin Chua, Jian Rong Dong