Abstract: A method of notifying an owner of a lost item in a vehicle having a vehicle compartment is provided. The method comprises providing at least one sensor to sense the lost item in the vehicle compartment. The method further comprises sensing the lost item on a point relative to a spherical coordinate system to define a sensed item data and determining a position of the lost item in cartesian coordinates based on the sensed item data to define a position data. The method further comprises translating the sensed item data and the position data for visualization of the lost item to define an item image of the lost item relative to the vehicle compartment, and updating an inventory list of lost objects to include the lost item with the item image. The method further comprises identifying the owner of the lost item by way of a perception algorithm, providing notification to the owner of the lost item, and providing viewable access of the item image such that the image is viewed by the owner of the lost item.

Abstract: A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.

Abstract: An electrical circuit in a semiconductor package may include a wire connected at each end by a bond point formed using a wire-bonding machine. When a connection point (e.g., a die pad) has a very small dimension, the wire used for the circuit may be required to have a similarly small diameter. This small diameter can lead to a weak bond point, especially in bonds that include a heel portion. The heel portion is a transition region of the bond point that may have less strength (e.g., as measure by a pull-test) than other portions of the bond point and/or may be exposed to more forces than other portions of the bond point. Accordingly, a capping-bond point may be applied to the bond point to strengthen the bond point by clamping the heel portion and shielding it from forces that could cause cracks.