Patents by Inventor Jinhe Liu

Jinhe Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic structures including bridges
    Patent number: 11887962
    Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: January 30, 2024
    Assignee: Intel Corporation
    Inventors: Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi, Malavarayan Sankarasubramanian, Jan Krajniak, Manish Dubey, Jinhe Liu, Wei Li, Jingyi Huang
  • Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects
    Patent number: 11791274
    Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia, Edvin Cetegen
  • DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS ARCHITECTURES
    Publication number: 20230078395
    Abstract: Disclosed herein are embedded heterogeneous architectures having minimized die shift and methods for manufacturing the same. The architectures may include a substrate, a bridge, and a material attached to the substrate. The substrate may include a first subset of vias and a second subset of vias. The bridge may be located in between the first subset and the second subset of vias. The material may include a first portion located proximate the first subset of vias, and a second portion located proximate the second subset of vias. The first and second portions may define a partial boundary of a cavity formed within the substrate and the bridge may be located within the cavity.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Inventors: Robin Mcree, Yosuke Kanaoka, Gang Duan, Jinhe Liu, Timothy A. Gosselin
  • MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
    Publication number: 20210391273
    Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 16, 2021
    Applicant: Interl Corporation
    Inventors: Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia, Edvin Cetegen
  • MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
    Publication number: 20210391295
    Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 16, 2021
    Applicant: Intel Corporation
    Inventors: Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi, Malavarayan Sankarasubramanian, Jan Krajniak, Manish Dubey, Jinhe Liu, Wei Li, Jingyi Huang