Patents by Inventor Jiro Takeda

Jiro Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10576971
    Abstract: A push cart includes a wheel, a motor, an obstacle detector, and a controller. The motor is configured to generate a rotational force that rotates the wheel. The obstacle detector is configured to detect an obstacle. The controller is configured to execute, in response to detection of the obstacle by the obstacle detector, avoidance control to control driving of the motor such that a movement of the push cart is limited. The controller is configured to disable execution of the avoidance control in response to a determination that a specified disabling condition is satisfied.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 3, 2020
    Assignee: MAKITA CORPORATION
    Inventors: Kouichi Takeda, Itsuku Kato, Jiro Suzuki
  • Patent number: 10573574
    Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: February 25, 2020
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: John J. Ullo, Tsutomu Yamate, Jiro Takeda
  • Publication number: 20200032214
    Abstract: An object of the present invention is to provide a novel myocardial stem cell for transplantation which enables maintenance of a therapeutic effect on and/or preventive effect against cardiac failure for a prolonged period, a method for producing the myocardial stem cell, and a cell preparation containing the myocardial stem cell. [Solution] The present invention relates to a method for producing a myocardial stem cell to be used for treatment and/or prevention of cardiac failure, the method comprising the step of introducing a complex of a mitochondria-targeting carrier and a mitochondria activating agent into a myocardial stem cell; a cell produced by the method and a cell preparation containing the cell; and a liposome to be used for producing the cell. According to the present invention, there can be provided a myocardial stem cell which is capable of maintaining a therapeutic effect and/or preventive effect by cell transplantation for a prolonged period.
    Type: Application
    Filed: November 16, 2017
    Publication date: January 30, 2020
    Applicant: LUCA Science Inc.
    Inventors: Hideyoshi HARASHIMA, Yuma YAMADA, Jiro ABE, Atsuhito TAKEDA
  • Patent number: 9772174
    Abstract: A capacitor based sensor for angular position detection having two fixed plates arranged at an angle and a semicircular rotating plate in between. The sensor can determine any angular position in the full 0-360 degrees range. The sensor may be temperature compensated, and integrated with electronics such that sensor module only has two electrical leads, one for input power and one for input/output digital data. A method for converting capacitance measurements to an angle is also disclosed.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: September 26, 2017
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Mohamed Naushad Mohamed Zuhair, Jiro Takeda
  • Patent number: 9097088
    Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: August 4, 2015
    Assignee: Schlumberger Technology Corporation
    Inventors: Jiro Takeda, Lahcen Garando, Jose Gregorio Labanda
  • Publication number: 20140375340
    Abstract: A capacitor based sensor for angular position detection having two fixed plates arranged at an angle and a semicircular rotating plate in between. The sensor can determine any angular position in the full 0-360 degrees range. The sensor may be temperature compensated, and integrated with electronics such that sensor module only has two electrical leads, one for input power and one for input/output digital data. A method for converting capacitance measurements to an angle is also disclosed.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 25, 2014
    Inventors: Mohamed Naushad Mohamed Zuhair, Jiro Takeda
  • Publication number: 20140146480
    Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.
    Type: Application
    Filed: January 30, 2014
    Publication date: May 29, 2014
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: JOHN J. ULLO, TSUTOMU YAMATE, JIRO TAKEDA
  • Publication number: 20120152545
    Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 21, 2012
    Inventors: JIRO TAKEDA, LAHCEN GARANDO, JOSE GREGORIO LABANDA
  • Patent number: 7793712
    Abstract: A downhole tool, configured to be suspended in a borehole traversing an earth formation, includes a downhole data acquisition system placed in the tool body and electrically connected to an electric power generator at the formation surface. The downhole data acquisition system includes a sensor for detecting local conditions in the borehole, and a transducer for transducing the voltage of an input signal from high to low or low to high. The transducer having a gallium nitride or silicon carbide based discrete semiconductor device.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: September 14, 2010
    Assignee: Schlumberger Technology Corporation
    Inventors: Tsutomu Yamate, Hiroshi Inoue, Jiro Takeda, Yukio Sudo, Emmanuel Desroques, Satoru Umemoto
  • Patent number: 7688674
    Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool along the borehole. A conveyance and a sensor section are configured to move the sensor section in the borehole. At least one receiver is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: March 30, 2010
    Assignee: Schlumberger Technology Corporation
    Inventors: William Underhill, Masahiro Kamata, Jiro Takeda, Colin Wilson
  • Patent number: 7566592
    Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180° C. and 220° C. and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 28, 2009
    Assignee: Schlumberger Technology Corporation
    Inventors: Shigeru Sato, Jiro Takeda, Atsushi Kayama, So Suzuki, Lionel Beneteau
  • Publication number: 20090160047
    Abstract: A downhole tool having at least one semiconductor device, including: a die; a bonding pad which is attached to the surface of the die; a bonding wire which is attached to the bonding pad; a bonding point which is formed on the bonding pad for connecting the bonding wire to the bonding pad; an encapsulating resin encapsulating the die and being provided with a cavity such that a connecting portion of the bonding point and the bonding pad is exposed out of the resin in the cavity; and a lid on the encapsulating resin to cover the cavity.
    Type: Application
    Filed: December 21, 2007
    Publication date: June 25, 2009
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: AKIRA OTSUKA, SHOHACHI MIYAMAE, JIRO TAKEDA
  • Publication number: 20090139244
    Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 4, 2009
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: John Ullo, Tsutomu Yamate, Jiro Takeda
  • Publication number: 20080219096
    Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool along the borehole. A conveyance and a sensor section are configured to move the sensor section in the borehole. At least one receiver is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.
    Type: Application
    Filed: March 5, 2007
    Publication date: September 11, 2008
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: WILLIAM UNDERHILL, MASAHIRO KAMATA, JIRO TAKEDA, COLIN WILSON
  • Publication number: 20080102561
    Abstract: Methods of manufacturing printed circuit board assemblies include placing a semiconductor chip having a plurality of lead terminals on a board formed with a plurality of solder lands at its surface such that each of the plurality of lead terminals is in touch with a corresponding one of the solder lands; supplying a solder material on the plurality of lead terminal s and the plurality of solder lands; supplying a flux including mono salt of adipic acid and alkyl secondary amine; and locally heating the plurality of lead terminals such that the solder material and the flux are melted to join together the lead terminals and the solder lands.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 1, 2008
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: YASUNORI GOTO, JIRO TAKEDA, TSUTOMU MASAKI
  • Publication number: 20080047751
    Abstract: A downhole tool, configured to be suspended in a borehole traversing an earth formation, includes a downhole data acquisition system placed in the tool body and electrically connected to an electric power generator at the formation surface. The downhole data acquisition system includes a sensor for detecting local conditions in the borehole, and a transducer for transducing the voltage of an input signal from high to low or low to high. The transducer having a gallium nitride or silicon carbide based discrete semiconductor device.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 28, 2008
    Applicant: Schlumberger Technology Corporation
    Inventors: Tsutomu Yamate, Hiroshi Inoue, Jiro Takeda, Yukio Sudo, Emmanuel Desroques, Satoru Umemoto
  • Publication number: 20070212817
    Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180° C. and 220° C. and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.
    Type: Application
    Filed: October 26, 2006
    Publication date: September 13, 2007
    Applicant: Schlumberger Technology Corporation
    Inventors: Shigeru Sato, Jiro Takeda, Atsushi Kayama, So Suzuki, Lionel Beneteau
  • Patent number: 6630890
    Abstract: A borehole logging tool system includes a surface system, a logging array, and a logging cable providing power supply and data paths connecting the logging array to the surface system, wherein the logging array includes a series of discrete sondes connected together. The sondes in the logging array, for example a borehole seismic logging array, are connected to their neighbours by means of lengths of logging cable. Such cable can be the same as that connecting the logging array to the surface system. The logging array can also include a master controller module which communicates with the surface system and which includes a first controller module which connects to the surface system and a second controller which controls operation of the sondes in the logging array independently of any other borehole logging tools connected to the surface system.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: October 7, 2003
    Assignee: Schlumberger Technology Corporation
    Inventors: Tatsuki Endo, David Mathison, Jiro Takeda
  • Patent number: 4857831
    Abstract: Apparatus and method for investigating a borehole casing. The preferred apparatus generally comprises: a housing which is connected to a cable; sets of electrodes, each set being axially spaced from another set, with the electrodes in each set being circumferentially spaced at an axial depth; a positioning device provided in the housing for bringing the electrodes into contact with the casing; a measuring circuit provided inside of the housing and electrically connected to the electrodes for measuring at least the potential difference of the casing between the electrode locations, wherein the potential difference information is amplified by the measuring circuit, and the amplified information is transmitted through the cable for processing; and a control circuit provided in the housing for controlling the operation of the positioning device and the measuring circuit.
    Type: Grant
    Filed: December 29, 1986
    Date of Patent: August 15, 1989
    Assignee: Schlumberger Technology Corporation
    Inventors: Dylan H. Davies, Jiro Takeda