Patents by Inventor Joachim Heinz Schober

Joachim Heinz Schober has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9047548
    Abstract: A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: June 2, 2015
    Assignee: NXP B.V.
    Inventors: Christian Scherabon, Anton Salfener, Wolfgang Steinbauer, Joachim Heinz Schober
  • Patent number: 8695881
    Abstract: The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: April 15, 2014
    Assignee: NXP B.V.
    Inventors: Joachim Heinz Schober, Christian Zenz
  • Patent number: 8659132
    Abstract: A microelectronic package assembly comprises a lead frame having a holding bar (16) and a microelectronic package (14). The microelectronic package (14) comprises a package body (22) and a connecting element (24) for connecting the package body (22) to the holding bar (16) of the lead frame (12). The connecting element (24) extends from an outer surface (26) of the package body (22) and is engaged with an ending part (28) of the holding bar (16).
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: February 25, 2014
    Assignee: NXP B.V.
    Inventor: Joachim Heinz Schober
  • Publication number: 20110204503
    Abstract: A microelectronic package assembly comprises a lead frame having a holding bar (16) and a microelectronic package (14). The microelectronic package (14) comprises a package body (22) and a connecting element (24) for connecting the package body (22) to the holding bar (16) of the lead frame (12). The connecting element (24) extends from an outer surface (26) of the package body (22) and is engaged with an ending part (28) of the holding bar (16).
    Type: Application
    Filed: October 13, 2009
    Publication date: August 25, 2011
    Applicant: NXP B.V.
    Inventor: Joachim Heinz Schober
  • Publication number: 20100224959
    Abstract: A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.
    Type: Application
    Filed: May 16, 2007
    Publication date: September 9, 2010
    Applicant: NXP B.V.
    Inventors: Christian Scherabon, Anton Salfener, Wolfgang Steinbauer, Joachim Heinz Schober
  • Publication number: 20090200381
    Abstract: The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.
    Type: Application
    Filed: June 22, 2005
    Publication date: August 13, 2009
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Joachim Heinz Schober, Christian Zenz
  • Publication number: 20090190314
    Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).
    Type: Application
    Filed: July 26, 2005
    Publication date: July 30, 2009
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Heinz Schober
  • Patent number: 7245005
    Abstract: The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: July 17, 2007
    Assignee: NXP B.V.
    Inventors: Rainer Moll, Joachim Heinz Schober
  • Patent number: 7124956
    Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: October 24, 2006
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Rainer Moll, Joachim Heinz Schober
  • Publication number: 20040174690
    Abstract: In a lead-frame configuration (1), which has a frame base (3) and a multiplicity of lead-frames (6, 7, 8, 9, 10, 11) connected with the frame base (3) and intended to hold a chip each, each lead-frame (6, 7, 8, 9, 10, 11) has two connecting plates (12, 13), and each connecting plate (12, 13) is connected with the frame base (3) via connecting webs (28, 29, 30, 31, 32, 33) and the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) delimit a bridging zone (34) which can be bridged using a chip and which is formed by only a narrow air gap (34) so that the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) about each other directly without a further intermediate section of the lead-frame concerned.
    Type: Application
    Filed: November 17, 2003
    Publication date: September 9, 2004
    Inventors: Rainer Moll, Joachim Heinz Schober
  • Publication number: 20040144848
    Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.
    Type: Application
    Filed: November 17, 2003
    Publication date: July 29, 2004
    Inventors: Rainer Moll, Joachim Heinz Schober
  • Publication number: 20040140122
    Abstract: In a product (4) with a component (19) which has at least one component contact (20, 21) formed by a metal bump (20, 21), and with a substrate (15) which has at least one substrate contact (16, 17), an electrically conductive intermetallic connection (34, 35) is formed in each case between a component contact (20, 21) and a substrate contact (16, 17) and between the component (19) and the substrate (15) is provided a protective layer (26) formed using a foil which was fixedly connected with the substrate (15) before formation of the electrically conductive intermetallic connection (34, 35) existing in each case between a component contact (20, 21) and a substrate contact (16, 17) and which can be softened at least once under the effect of heat.
    Type: Application
    Filed: November 13, 2003
    Publication date: July 22, 2004
    Inventors: Rainer Moll, Joachim Heinz Schober
  • Patent number: 6657294
    Abstract: A data carrier (1) includes an IC module (3), having a substrate (4), and a conductor configuration (5) connected to the substrate (4), and an IC (2) connected to the substrate (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) The data carrier (1) is equipped with a protection mechanism (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection mechanism (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4).
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: December 2, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Marcus Toth, Joachim Heinz Schober, Peter Schmallegger, Veronika Sauer
  • Patent number: 6643142
    Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 4, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Gunter Aflenzer, Joachim Heinz Schober, Marcus Toth
  • Patent number: 6552422
    Abstract: In a data carrier (1) with an integrated electronic component (3) and with a transmission coil (12), short turn portions (21, 22, 23, 24, and 25) of the transmission coil (12) are formed by connection lines which are provided on the integrated electronic component (3) in the area of a component surface (4) of the integrated electronic component (3) and which are preferably formed by conductor tracks.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: April 22, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Joachim Heinz Schober
  • Publication number: 20020075663
    Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).
    Type: Application
    Filed: October 9, 2001
    Publication date: June 20, 2002
    Inventors: Gunter Aflenzer, Joachim Heinz Schober, Marcus Toth
  • Publication number: 20020020900
    Abstract: A data carrier (1) includes an IC module (3), which comprises a substrate means (4), and a conductor configuration (5) connected to the substrate means (4), and an IC (2) connected to the substrate means (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) , the data carrier (1) being equipped with a protection means (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection means (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4). FIG. 2.
    Type: Application
    Filed: May 23, 2001
    Publication date: February 21, 2002
    Inventors: Marcus Toth, Joachim Heinz Schober, Peter Schmallegger, Veronika Sauer