Patents by Inventor Joachim Heinz Schober
Joachim Heinz Schober has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9047548Abstract: A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.Type: GrantFiled: May 16, 2007Date of Patent: June 2, 2015Assignee: NXP B.V.Inventors: Christian Scherabon, Anton Salfener, Wolfgang Steinbauer, Joachim Heinz Schober
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Patent number: 8695881Abstract: The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.Type: GrantFiled: June 22, 2005Date of Patent: April 15, 2014Assignee: NXP B.V.Inventors: Joachim Heinz Schober, Christian Zenz
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Patent number: 8659132Abstract: A microelectronic package assembly comprises a lead frame having a holding bar (16) and a microelectronic package (14). The microelectronic package (14) comprises a package body (22) and a connecting element (24) for connecting the package body (22) to the holding bar (16) of the lead frame (12). The connecting element (24) extends from an outer surface (26) of the package body (22) and is engaged with an ending part (28) of the holding bar (16).Type: GrantFiled: October 13, 2009Date of Patent: February 25, 2014Assignee: NXP B.V.Inventor: Joachim Heinz Schober
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Publication number: 20110204503Abstract: A microelectronic package assembly comprises a lead frame having a holding bar (16) and a microelectronic package (14). The microelectronic package (14) comprises a package body (22) and a connecting element (24) for connecting the package body (22) to the holding bar (16) of the lead frame (12). The connecting element (24) extends from an outer surface (26) of the package body (22) and is engaged with an ending part (28) of the holding bar (16).Type: ApplicationFiled: October 13, 2009Publication date: August 25, 2011Applicant: NXP B.V.Inventor: Joachim Heinz Schober
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Publication number: 20100224959Abstract: A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.Type: ApplicationFiled: May 16, 2007Publication date: September 9, 2010Applicant: NXP B.V.Inventors: Christian Scherabon, Anton Salfener, Wolfgang Steinbauer, Joachim Heinz Schober
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Publication number: 20090200381Abstract: The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided.Type: ApplicationFiled: June 22, 2005Publication date: August 13, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Joachim Heinz Schober, Christian Zenz
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Publication number: 20090190314Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: ApplicationFiled: July 26, 2005Publication date: July 30, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Heinz Schober
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Patent number: 7245005Abstract: The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.Type: GrantFiled: May 16, 2002Date of Patent: July 17, 2007Assignee: NXP B.V.Inventors: Rainer Moll, Joachim Heinz Schober
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Patent number: 7124956Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.Type: GrantFiled: May 16, 2002Date of Patent: October 24, 2006Assignee: Koninklijke Philips Electronics N.V.Inventors: Rainer Moll, Joachim Heinz Schober
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Publication number: 20040174690Abstract: In a lead-frame configuration (1), which has a frame base (3) and a multiplicity of lead-frames (6, 7, 8, 9, 10, 11) connected with the frame base (3) and intended to hold a chip each, each lead-frame (6, 7, 8, 9, 10, 11) has two connecting plates (12, 13), and each connecting plate (12, 13) is connected with the frame base (3) via connecting webs (28, 29, 30, 31, 32, 33) and the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) delimit a bridging zone (34) which can be bridged using a chip and which is formed by only a narrow air gap (34) so that the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) about each other directly without a further intermediate section of the lead-frame concerned.Type: ApplicationFiled: November 17, 2003Publication date: September 9, 2004Inventors: Rainer Moll, Joachim Heinz Schober
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Publication number: 20040144848Abstract: In the case of a product (1) having a first product sub-part (4) and a second product sub-part (3), the two product sub-parts (3, 4) each comprise two connection zones (8, 9, 10, 11) consisting of metal and of suitably thin construction for a crimping process and the connection zones (8, 9, 10, 11) are connected together in pairs by means in each case of a crimp connection, in which the connection zones (10, 11) of at least one product sub-part (3) exhibit the remnants (16), remaining after performance of the crimping process, of elevations (17) present prior to performance of the crimping process.Type: ApplicationFiled: November 17, 2003Publication date: July 29, 2004Inventors: Rainer Moll, Joachim Heinz Schober
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Publication number: 20040140122Abstract: In a product (4) with a component (19) which has at least one component contact (20, 21) formed by a metal bump (20, 21), and with a substrate (15) which has at least one substrate contact (16, 17), an electrically conductive intermetallic connection (34, 35) is formed in each case between a component contact (20, 21) and a substrate contact (16, 17) and between the component (19) and the substrate (15) is provided a protective layer (26) formed using a foil which was fixedly connected with the substrate (15) before formation of the electrically conductive intermetallic connection (34, 35) existing in each case between a component contact (20, 21) and a substrate contact (16, 17) and which can be softened at least once under the effect of heat.Type: ApplicationFiled: November 13, 2003Publication date: July 22, 2004Inventors: Rainer Moll, Joachim Heinz Schober
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Patent number: 6657294Abstract: A data carrier (1) includes an IC module (3), having a substrate (4), and a conductor configuration (5) connected to the substrate (4), and an IC (2) connected to the substrate (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) The data carrier (1) is equipped with a protection mechanism (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection mechanism (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4).Type: GrantFiled: May 23, 2001Date of Patent: December 2, 2003Assignee: Koninklijke Philips Electronics N.V.Inventors: Marcus Toth, Joachim Heinz Schober, Peter Schmallegger, Veronika Sauer
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Patent number: 6643142Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).Type: GrantFiled: October 9, 2001Date of Patent: November 4, 2003Assignee: Koninklijke Philips Electronics N.V.Inventors: Gunter Aflenzer, Joachim Heinz Schober, Marcus Toth
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Patent number: 6552422Abstract: In a data carrier (1) with an integrated electronic component (3) and with a transmission coil (12), short turn portions (21, 22, 23, 24, and 25) of the transmission coil (12) are formed by connection lines which are provided on the integrated electronic component (3) in the area of a component surface (4) of the integrated electronic component (3) and which are preferably formed by conductor tracks.Type: GrantFiled: August 28, 2000Date of Patent: April 22, 2003Assignee: Koninklijke Philips Electronics N.V.Inventor: Joachim Heinz Schober
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Publication number: 20020075663Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).Type: ApplicationFiled: October 9, 2001Publication date: June 20, 2002Inventors: Gunter Aflenzer, Joachim Heinz Schober, Marcus Toth
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Publication number: 20020020900Abstract: A data carrier (1) includes an IC module (3), which comprises a substrate means (4), and a conductor configuration (5) connected to the substrate means (4), and an IC (2) connected to the substrate means (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) , the data carrier (1) being equipped with a protection means (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection means (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4). FIG. 2.Type: ApplicationFiled: May 23, 2001Publication date: February 21, 2002Inventors: Marcus Toth, Joachim Heinz Schober, Peter Schmallegger, Veronika Sauer