Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.

Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.

Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.

Abstract: A composite molding compound comprising a combination of metal and ceramic powders is disclosed. The powders are combined with a binder, a liquid carrier and other processing additives in a manner to provide uniform distribution of two phases in a material format that facilitates the molding of complex parts at relatively low pressures and temperatures using conventional injection molding machines. The products formed from these molding compounds may be designed with tailored physical and mechanical properties such as thermal conductivity, thermal expansion coefficient, density, elastic modulus and wear properties.