Abstract: An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

Abstract: A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.

Abstract: A semiconductor module includes a package, a plastic molding compound and contacts extending through the package from an underside of the package to an upper side of the package. The package includes least two layers of plastic, the first layer of plastic having external contacts and layer through contacts. A wiring structure carries the second layer of plastic, which surrounds semiconductor chips in a plastic molding compound, the contacts extending through the package being arranged in the edge regions of the semiconductor module.

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

Abstract: An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Abstract: A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Abstract: A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.

Abstract: The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

Abstract: A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

Abstract: Connector module and method of manufacturing same A connector module (31, 71) comprises a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72), a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73).

Abstract: An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

Abstract: A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract: A component and associated connection wire is disclosed. One embodiment includes a first connection region for connecting a first workpiece and a second connection region for connecting a second workpiece. In one embodiment a NiP layer is formed on a Ni layer at least in the second connection region.

Abstract: A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

Abstract: An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

Abstract: A semiconductor device includes surface-mountable external contacts on an underside of the semiconductor device, wherein the external contacts are arranged on external contact pads and surrounded by a solder-resist layer. The external contacts of the outer edge regions include external contact pads that merge into inspection tags, wherein the inspection tags can be wetted by solder and are not covered by the solder-resist layer.

Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.