Patents by Inventor Jochen Dangelmaier

Jochen Dangelmaier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070158860
    Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.
    Type: Application
    Filed: December 8, 2006
    Publication date: July 12, 2007
    Inventors: Jochen Dangelmaier, Mario Engl, Horst Theuss
  • Publication number: 20070145972
    Abstract: A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.
    Type: Application
    Filed: June 15, 2006
    Publication date: June 28, 2007
    Inventors: Albert Auburger, Jochen Dangelmaier, Alfred Gottlieb, Martin Petz, Uwe Schindler, Horst Theuss
  • Patent number: 7221048
    Abstract: A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: May 22, 2007
    Assignee: Infineon Technologies AG
    Inventors: Frank Daeche, Jochen Dangelmaier, Stefan Paulus, Bernd Stadler, Horst Theuss, Michael Weber
  • Publication number: 20070069376
    Abstract: A panel for the production of electronic components is disclosed. The components have a substantially planar semiconductor chip with chip through-contacts which are provided with electrically conductive material. A rewiring region is subdivided into an insulating layer and also a first rewiring arranged therein, the rewiring projecting laterally beyond the side edge of the planar semiconductor chip. The rewiring has external contacts for electrical connections toward the outside. The panel provides a filling layer made of plastic, which encapsulates the semiconductor chip in a side region between the chip front side and the chip rear side and which is connected to the rewiring region.
    Type: Application
    Filed: September 28, 2006
    Publication date: March 29, 2007
    Applicant: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Horst Theuss
  • Publication number: 20070069354
    Abstract: A semiconductor sensor device includes a sensor chip. The sensor chip includes a sensor region and contact areas on its upper side and is further arranged in a cavity housing. The cavity housing includes side walls, a housing bottom, a cavity, external contacts on the outside of the cavity and contact pads on an upper side of the housing bottom facing the cavity. The sensor chip is embedded into a rubber-elastic plastic composition within the cavity of the cavity housing such that the sensor region of the sensor chip faces the housing bottom and the contact areas of the sensor chip are electrically connected to the contact pads on the housing bottom via elastic flip-chip contacts.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 29, 2007
    Inventors: Jochen Dangelmaier, Horst Theuss
  • Patent number: 7189009
    Abstract: A micro-optical module includes a housing, at least one optoelectronic component, and an optoelectronic unit assigned thereto. The housing is partly embodied as an MID body, having a cavity and having a three-dimensional conductor structure in the cavity. The MID body includes an optical channel filled with a plastic waveguide.
    Type: Grant
    Filed: November 15, 2005
    Date of Patent: March 13, 2007
    Assignee: Infineon Technologies, AG
    Inventors: Jochen Dangelmaier, Horst Theuss, Helmut Wietschorke
  • Publication number: 20070023896
    Abstract: A semiconductor device for radio frequencies of more than 10 GHz having a semiconductor chip is disclosed. In one embodiment, the semiconductor chip, on its active top side, having a radio-frequency region and a low-frequency region and/or a region which is supplied with DC voltage. In one embodiment, the low-frequency region and/or the region which is supplied with DC voltage of the semiconductor chip is directly embedded in a plastic housing composition, the plastic housing composition is arranged such that it is spaced apart from the radio-frequency region on the active top side of the semiconductor chip.
    Type: Application
    Filed: July 18, 2006
    Publication date: February 1, 2007
    Inventors: Jochen Dangelmaier, Klaus Pressel, Horst Theuss
  • Publication number: 20060255458
    Abstract: A semiconductor module includes a package, a plastic molding compound and contacts extending through the package from an underside of the package to an upper side of the package. The package includes least two layers of plastic, the first layer of plastic having external contacts and layer through contacts. A wiring structure carries the second layer of plastic, which surrounds semiconductor chips in a plastic molding compound, the contacts extending through the package being arranged in the edge regions of the semiconductor module.
    Type: Application
    Filed: April 17, 2006
    Publication date: November 16, 2006
    Inventor: Jochen Dangelmaier
  • Publication number: 20060192296
    Abstract: A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.
    Type: Application
    Filed: February 22, 2006
    Publication date: August 31, 2006
    Inventors: Albert Auburger, Jochen Dangelmaier, Volker Geungerich, Bernd Stadler
  • Publication number: 20060175691
    Abstract: A semiconductor device (7) has gold coatings (1 to 5) which are applied to metallic or ceramic components (6) of the semiconductor device (7). The gold coatings (1 to 4) have a multifunctional multilayer metal coating (8) with a minimal gold layer (9). The gold layer has a thickness dG where dG?0.5 ?m. Moreover, at least one metallic interlayer (10) is arranged between the gold layer (9) and the metallic or ceramic components (6).
    Type: Application
    Filed: February 9, 2006
    Publication date: August 10, 2006
    Inventors: Jochen Dangelmaier, Donald Fowlkes, Volker Guengerich, Henrik Hoyer
  • Patent number: 7071571
    Abstract: The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: July 4, 2006
    Assignee: Infineon Technoloiges AG
    Inventors: Jochen Dangelmaier, Horst Theuss
  • Publication number: 20060091561
    Abstract: The invention relates to an electronic device and a method for producing it having external area contacts and having a rewiring structure and also having a semiconductor chip, which has contact areas, the external area contacts being electrically connected to the contact areas at least by means of the rewiring structure, and the external area contacts and/or the rewiring structure having chemically or galvanically selectively deposited metal.
    Type: Application
    Filed: May 23, 2003
    Publication date: May 4, 2006
    Inventors: Jochen Dangelmaier, Harry Hedler, Roland Irsigler, Stefan Paulus
  • Patent number: 7037844
    Abstract: A method for manufacturing a chip housing includes a first basis having a photolithograpically structurable layer on a main face, structured into a cover. A chip has the structure at a main face between first contact elements. A second photolithograpically structurable layer applied to the main face is structured forming a recess surrounded by a wall near the structure exposing the first contact elements. Then, the first basis and the chip are merged with the structure and the cover facing and aligned with each other, and the recess closed by the cover. Removing the first basis leads to an on-chip cavity. Afterwards, a second basis and the chip are merged with the first contact elements connected to the second basis via a conductive structure. Afterwards, the second basis is removed for exposing the conductive structure. The method is less subject to cost and size limitations of known housing technologies.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: May 2, 2006
    Assignee: Infineon Technologies AG
    Inventors: Frank Dāche, Jochen Dangelmaier, Günter Ehrler, Andreas Meckes, Michael Weber
  • Publication number: 20060088256
    Abstract: A micro-optical module includes a housing, at least one optoelectronic component, and an optoelectronic unit assigned thereto. The housing is partly embodied as an MID body, having a cavity and having a three-dimensional conductor structure in the cavity. The MID body includes an optical channel filled with a plastic waveguide.
    Type: Application
    Filed: November 15, 2005
    Publication date: April 27, 2006
    Inventors: Jochen Dangelmaier, Horst Theuss, Helmut Wietschorke
  • Publication number: 20060012016
    Abstract: The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor components, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.
    Type: Application
    Filed: May 22, 2003
    Publication date: January 19, 2006
    Inventors: Bernd Betz, Jochen Dangelmaier, Rudolf Lehner, Stefan Paulus
  • Publication number: 20050151246
    Abstract: A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
    Type: Application
    Filed: February 1, 2005
    Publication date: July 14, 2005
    Inventors: Frank Daeche, Jochen Dangelmaier, Stefan Paulus, Bernd Stadler, Horst Theuss, Michael Weber
  • Publication number: 20050142933
    Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • Publication number: 20050051905
    Abstract: The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.
    Type: Application
    Filed: July 23, 2004
    Publication date: March 10, 2005
    Inventors: Jochen Dangelmaier, Horst Theuss
  • Publication number: 20040067650
    Abstract: A method for manufacturing a housing for a chip having a micromechanical structure is primarily based on a first basis comprising a photolithograpically structurable layer on at least one partial region of a main face. The same is structured in order to obtain a cover for the micromechanical structure. Further, a chip comprising the micromechanical structure is provided, which is arranged at a main face of the chip between the first contact elements. A second photolithograpically structurable layer is applied to at least one partial region of the main face of the chip and is structured for generating a recess in the same surrounded by a wall in the region of the micromechanical structure and for exposing the first contact elements. After that, the first basis and the chip are merged such that the micromechanical structure and the cover are facing each other and are aligned with each other, so that the recess is closed by the cover. Removing the first basis leads to a chip comprising an on-chip cavity.
    Type: Application
    Filed: October 2, 2003
    Publication date: April 8, 2004
    Inventors: Frank Dache, Jochen Dangelmaier, Gunter Ehrler, Andreas Meckes, Michael Weber