Abstract: A sensor package is disclosed. The sensor package includes a housing that has a recess and a sealing member epoxied within the recess of the housing. The housing also has small EDM holes to allow conductive output wires to feed through the housing. The sealing member provides a seal for the holes of the conductive outputs of the sensor package. The sensor package further includes a sensing die, which detects a pressure, and outputs an electrical signal through the output wires.

Abstract: A pressure sensor housing and assembly is disclosed. The pressure sensor may have a manifold and a header comprising one integral unitary housing. The unitary housing may have a pressure inlet in communication with an elongated tube. The unitary housing also may have a sensing die coupled to the elongated tube in order to receive pressure input signals through the pressure inlet. The sensing die may detect an applied pressure and derive an electrical signal from the applied pressure.

Abstract: A pressure sensor housing and assembly is disclosed. The pressure sensor may have a manifold and a header comprising one integral unitary housing. The unitary housing may have a pressure inlet in communication with an elongated tube. The unitary housing also may have a sensing die coupled to the elongated tube in order to receive pressure input signals through the pressure inlet. The sensing die may detect an applied pressure and derive an electrical signal from the applied pressure.

Abstract: A sensor package is disclosed. The sensor package includes a housing that has a recess and a sealing member epoxied within the recess of the housing. The housing also has small EDM holes to allow conductive output wires to feed through the housing. The sealing member provides a seal for the holes of the conductive outputs of the sensor package. The sensor package further includes a sensing die, which detects a pressure, and outputs an electrical signal through the output wires.

Abstract: A transducer packaging assembly for use in a sensing unit subjected to high forces of acceleration includes a base having a cavity. A pressure sensitive semiconductor die is bonded to a large backplate having a shape so that it nestles into the cavity but is spaced from a surface of the cavity. A planar cover secured to the base has a hole larger than the die but smaller than the backplate, and thin wires extend from the die to electrical connections on the assembly. A viscous fluid fills a space between the backplate and the cavity, and a space between the backplate and the cover, and transmits a pressure to be measured to the pressure sensitive die. The viscous fluid has a sufficiently high viscosity to oppose movement of the backplate relative to the cavity while cushioning the pressure sensitive die and the backplate from forces of acceleration.

Abstract: A magnetometer package with a housing, a plurality of sensing elements, a board, and a sealing element. The housing has a first end, a second end, and a bore. The first end of the housing is adapted to receive the board and the sealing element. The second end of the housing is adapted to receive a plug. The plurality of sensing elements, the board, and the sealing element rest in the bore. The plurality of sensing elements are mounted on the board and are orientated so that their sensing axes sense magnetic fields in different directions.

Abstract: A magnetometer package with a housing, a plurality of sensing elements, a board, and a sealing element. The housing has a first end, a second end, and a bore. The first end of the housing is adapted to receive the board and the sealing element. The second end of the housing is adapted to receive a plug. The plurality of sensing elements, the board, and the sealing element rest in the bore. The plurality of sensing elements are mounted on the board and are orientated so that their sensing axes sense magnetic fields in different directions.

Abstract: A connector has conductive pins extending from outside the device to within the device and an electrically conductive wall surrounding a portion of the pins. The conductive wall abuts a printed wiring board containing EMI protective circuitry and contacts a ground plane within the printed wiring board. A selected pin is brazed to the connector and holds the printed wiring board in compression to assure a low impedance connection to the ground plane.

Abstract: A header structure for a semiconductor pressure transducer includes a cylindrical glass member located within a tubular housing having a closed end. A tubular core member extends through a central axial hole in the glass member. The core member has a sealed end proximate the closed end of the housing and an opposite end. A plurality of electrically conductive terminal pins extend through the glass member in surrounding relation to the core member and exit the housing through a plurality of holes in the closed end. A semiconductor die is mounted adjacent the opposite end of the core member and is electrically connected to the surrounding terminal pins by wire leads.

Abstract: A transmitter comprises a housing, an electronics assembly, an inner cover, and an outer cover. The electronics assembly includes an actuatable switch and fits within an open-ended cavity in the housing. The inner cover is positionable over the open end to cover the electronics assembly and has a deflectable button portion which is alignable with the actuatable switch and accessable from the open end while the electronics assembly is energized. The inner cover is electrically conductive and has a sleeve which frictionally mates with electrically conductive walls of the housing to shield the electronics assembly from electromagnetic interference (EMI). The inner cover is preferably an insulating molded plastic part with a thin metallic coating.