Patents by Inventor Joel L. Harringa

Joel L. Harringa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder
    Patent number: 10442037
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: October 15, 2019
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Lead-free composite solder
    Publication number: 20170095891
    Abstract: A composite solder material for mixing with flux to provide a composite solder paste. The solder material includes a mixture having a relatively low melting solder or solder-forming powder and a relatively high melting Ni-containing reinforcement powder. Use of the solder paste under solder reflow conditions produces a high melting point solder joint by liquid phase diffusion bonding wherein a Ni-stabilized high temperature hexagonal (Cu,Ni)6Sn5 phase is the solder joint matrix that bonds together the Ni-containing reinforcement powder particles. With each reflow cycle, more of the low melting solder or solder-forming powder is converted to the hexagonal (Cu,Ni)6Sn5 matrix phase, raising the final melting temperatures of the post-processed solder joint and giving the solder the ability to withstand higher Joule-heating, all while improving resistance to solder joint cracking.
    Type: Application
    Filed: September 28, 2016
    Publication date: April 6, 2017
    Inventors: Iver E. Anderson, Stephanie M. Choquette, Kathlene N. Reeve, Joel L. Harringa
  • Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder
    Publication number: 20150231741
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Application
    Filed: February 24, 2015
    Publication date: August 20, 2015
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder
    Publication number: 20110303448
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Application
    Filed: April 22, 2011
    Publication date: December 15, 2011
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Superabrasive boride and a method of preparing the same by mechanical alloying and hot pressing
    Patent number: 6432855
    Abstract: A ceramic material which is an orthorhombic boride of the general formula: AlMgB14:X, with X being a doping agent. The ceramic is a superabrasive, and in most instances provides a hardness of 40 GPa or greater.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: August 13, 2002
    Assignee: Iowa State University Reseach Foundation, Inc,.
    Inventors: Bruce A. Cook, Joel L. Harringa, Alan M. Russell
  • Superabrasive boride and a method of preparing the same by mechanical alloying and hot pressing
    Patent number: 6099605
    Abstract: A ceramic material which is an orthorhombic boride of the general formula: AlMgB.sub.14 :X, with X being a doping agent. The ceramic is a superabrasive, and in most instances provides a hardness of 40 GPa or greater.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: August 8, 2000
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Bruce A. Cook, Joel L. Harringa, Alan M. Russell