Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that include an implantable lead having a terminal pin, a conductor member configured to rotate in response to rotation of the terminal pin and a coupler arranged within configured to interface with the conductor member and having a rear bearing surface contacting the inner wall of a housing.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that include an implantable lead having a terminal pin, a conductor member configured to rotate in response to rotation of the terminal pin and a coupler arranged within configured to interface with the conductor member and having a rear bearing surface contacting the inner wall of a housing.

Abstract: An endoprosthesis includes a stent having an inner surface defining a lumen and an outer surface; and a polymeric cover on the outer surface of the stent. The polymeric cover includes a base and adhesion elements. When the endoprosthesis is expanded to the expanded state in a lumen defined by a vessel wall, the adhesion elements create an interlock between the vessel wall and the endoprosthesis.

Abstract: A system includes a medical device lead including a connector at a proximal end of the lead, a conductor electrically connected to the connector at a proximal end of the conductor, and at least one electrode coupled to a distal end of the conductor. The system further includes a device securable to the proximal end of the lead including an inductive element. The device includes a port configured to receive the connector and position the inductive element around at least a portion of the connector.

Abstract: An endoprosthesis includes a stent having an inner surface defining a lumen and an outer surface; and a polymeric cover on the outer surface of the stent. The polymeric cover includes a base and adhesion elements. When the endoprosthesis is expanded to the expanded state in a lumen defined by a vessel wall, the adhesion elements create an interlock between the vessel wall and the endoprosthesis.

Abstract: A system includes a medical device lead including a connector at a proximal end of the lead, a conductor electrically connected to the connector at a proximal end of the conductor, and at least one electrode coupled to a distal end of the conductor. The system further includes a device securable to the proximal end of the lead including an inductive element. The device includes a port configured to receive the connector and position the inductive element around at least a portion of the connector.

Abstract: A system includes a medical device lead including a connector at a proximal end of the lead, a conductor electrically connected to the connector at a proximal end of the conductor, and at least one electrode coupled to a distal end of the conductor. The system further includes a device securable to the proximal end of the lead including an inductive element. The device includes a port configured to receive the connector and position the inductive element around at least a portion of the connector.

Abstract: System and methods for adhering a patch of stimulation electrode(s) to blood vessels to stimulate a target site on the blood vessel are described. In various embodiments, the system includes an adhesion patch and at least one electrode. The adhesion patch includes a passive adhesion mechanism that may produce an adhesive force sufficiently strong to adhere the adhesion patch to the exterior of the blood vessel and to operationally position the at least one electrode for use in electrically stimulating a target site of the blood vessel. The adhesion patch may also include a release mechanism that is configured for a user to disengage the patch from the exterior of the blood vessel without significant trauma to the blood vessel. After being released, the adhesion patch may be re-adhered to a different target site of the blood vessel and stimulate the different target site.

Abstract: System and methods for adhering a patch of stimulation electrode(s) to blood vessels to stimulate a target site on the blood vessel are described. In one embodiment, the system includes an adhesion patch and at least one electrode. The adhesion patch includes an active adhesion mechanism that may produce an adhesive force sufficiently strong to adhere the adhesion patch to the exterior of the blood vessel and to operationally position the at least one electrode for use in electrically stimulating a target site of the blood vessel. The adhesion patch may also include a release mechanism that is configured for a user to disengage the patch from the exterior of the blood vessel without significant trauma to the blood vessel. After being released, the adhesion patch may be re-adhered to a different target site of the blood vessel and stimulate the different target site.

Abstract: Various techniques are described for replacement heart valve implantation. In one example, a system includes a specialized conduction system tissue activation potential sensing device, configured for delivery to an intracardiac region, a specialized conduction system tissue activation detector circuit, configured to detect, using the sensing device, a specialized conduction system tissue activation potential, and a processor circuit, configured to use information about the detected specialized conduction system tissue activation potential to generate a heart valve placement indication.

Abstract: System and methods for adhering a patch of stimulation electrode(s) to blood vessels to stimulate a target site on the blood vessel are described. In one embodiment, the system includes an adhesion patch and at least one electrode. The adhesion patch includes an active adhesion mechanism that may produce an adhesive force sufficiently strong to adhere the adhesion patch to the exterior of the blood vessel and to operationally position the at least one electrode for use in electrically stimulating a target site of the blood vessel. The adhesion patch may also include a release mechanism that is configured for a user to disengage the patch from the exterior of the blood vessel without significant trauma to the blood vessel. After being released, the adhesion patch may be re-adhered to a different target site of the blood vessel and stimulate the different target site.

Abstract: System and methods for adhering a patch of stimulation electrode(s) to blood vessels to stimulate a target site on the blood vessel are described. In various embodiments, the system includes an adhesion patch and at least one electrode. The adhesion patch includes a passive adhesion mechanism that may produce an adhesive force sufficiently strong to adhere the adhesion patch to the exterior of the blood vessel and to operationally position the at least one electrode for use in electrically stimulating a target site of the blood vessel. The adhesion patch may also include a release mechanism that is configured for a user to disengage the patch from the exterior of the blood vessel without significant trauma to the blood vessel. After being released, the adhesion patch may be re-adhered to a different target site of the blood vessel and stimulate the different target site.

Abstract: A system includes a medical device lead including a connector at a proximal end of the lead, a conductor electrically connected to the connector at a proximal end of the conductor, and at least one electrode coupled to a distal end of the conductor. The system further includes a device securable to the proximal end of the lead including an inductive element. The device includes a port configured to receive the connector and position the inductive element around at least a portion of the connector.

Abstract: Medical devices and methods for making and using medical devices are disclosed. An example medical device may include a loading tool. The loading tool may include a tubular member that is configured to be disposed about a balloon catheter. The tubular member may include a distal portion and a proximal portion. The tubular member may be configured to shift between a first configuration and a shortened configuration.

Abstract: Various techniques are described for replacement heart valve implantation. In one example, a system includes a specialized conduction system tissue activation potential sensing device, configured for delivery to an intracardiac region, a specialized conduction system tissue activation detector circuit, configured to detect, using the sensing device, a specialized conduction system tissue activation potential, and a processor circuit, configured to use information about the detected specialized conduction system tissue activation potential to generate a heart valve placement indication.