Abstract: An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.

Abstract: A method for producing an organic light-emitting diode and an organic light-emitting diode are disclosed. In an embodiment, the method includes providing a substrate with a continuous application surface, generating multiple adhesion regions on the application surface, the adhesion regions being completely surrounded by the application surface, applying metal nanowires over the entire surface of the application surface, removing the metal nanowires outside of the adhesion regions by a washing process using a solvent such that the remaining metal nanowires completely or partly form a light-permeable electrode of the organic light-emitting diode, and applying an organic layer sequence onto the light-permeable electrode.

Abstract: A method of producing an organic optoelectronic component includes: forming a first electrode layer comprising a contact region, arranging an electrically conductive contact lug on the first electrode layer. A first section of the contact lug is secured in the contact region on the first electrode layer such that a second section projects beyond the contact region. The method further includes forming an organic functional layer structure laterally alongside the contact lug on the first electrode layer, forming a second electrode on the organic functional layer structure, forming an encapsulation layer such that it extends over the second electrode and over the first section, and severing the first electrode layer and the encapsulation layer in the region of the lug such that subsequently the first section is arranged between the contact region and the encapsulation layer and the second section projects between the encapsulation layer and the first electrode layer.

Abstract: In various embodiments, an optoelectronic assembly may include at least one organic light emitting diode including a first light emitting diode element and a second light emitting diode element, and an electronic circuit. The first light emitting diode element and the second light emitting diode element are electrically connected in parallel and are deposited monolithically on a common substrate, and the electronic circuit is designed to compare an electric current through the first light emitting diode element that flows during operation with an electric current through the second light emitting diode element that flows during operation and, depending on the comparison, to detect a short circuit of the first light emitting diode element or of the second light emitting diode element and to initiate an electrical switching off of one of the light emitting diode elements and/or of the assembly.

Abstract: An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.

Abstract: A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

Abstract: The invention relates to a lighting device comprising an illuminant embodied as an OLED, and comprising a capacitive switching means, which are arranged on a substrate, wherein the illuminant has a first electrically conductive electrode and a second electrically conductive electrode, wherein a layer comprising organic, electroluminescent material is arranged between the first electrode and the second electrode, wherein the switching means has an electrode, wherein one electrode from the first electrode or the second electrode of the illuminant together with the electrode of the switching means is arranged in one plane, wherein a nonconductive spacing amounting to between 100 ?m and 700 ?m, more particularly between 400 ?m and 600 ?m, is present between said one electrode of the illuminant and the electrode of the switching means in the plane.

Abstract: A radiation emitting apparatus including a substrate, at least one layer sequence arranged on the substrate and producing electromagnetic radiation in a wavelength range, having at least one first electrode surface, at least one second electrode surface, and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer produces electromagnetic radiation in the wavelength range in a switched-on operating state, and a scatter layer having a first region and a second region, wherein radiation produced by the functional layer is directly incident on the scatter layer only in the first region of the scatter layer, and the scatter layer at least partially scatters radiation incident upon the first region of the scatter layer so that said radiation enters the second region of the scatter layer.

Abstract: An optical element includes a light guide plate with a first major surface and with a second major surface opposite the first major surface and with side faces connecting the first and second major surfaces, wherein the light guide plate includes a matrix material transparent to ultraviolet light in which scattering centers are embedded, at least one light-emitting semiconductor device that couples ultraviolet light into the light guide plate via a side face when in operation, a first filter layer on the first major surface and a second filter layer on the second major surface, wherein the filter layers opaque to ultraviolet light and at least partially transparent to visible light, and a first photochromic layer at least on the first major surface, between the light guide panel and the first filter layer, with a transparency to visible light by ultraviolet light.

Abstract: An optoelectronic device is disclosed. In an embodiment the optoelectronic device includes a light-transmissive first electrode, an electrically conductive track including a metal, and a functional organic region having at least one active region, wherein the electrically conductive track is arranged between the first electrode and the functional organic region and wherein the electrically conductive track is in direct contact with the first electrode and the functional organic region.

Abstract: In various exemplary embodiments, an optoelectronic component device is provided. The optoelectronic component device includes a first organic light emitting diode and a second organic light emitting diode, which are connected to one another in physical contact one above the other. The first organic light emitting diode is electrically connected in parallel with the second organic light emitting diode. The first organic light emitting diode and the second organic light emitting diode have at least an approximately identical or identical electronic diode characteristic and/or an approximately identical or identical electronic diode characteristic variable.

Abstract: In various embodiments, an optoelectronic assembly may include at least one organic light emitting diode including a first light emitting diode element and a second light emitting diode element, and an electronic circuit. The first light emitting diode element and the second light emitting diode element are electrically connected in parallel and are deposited monolithically on a common substrate, and the electronic circuit is designed to compare an electric current through the first light emitting diode element that flows during operation with an electric current through the second light emitting diode element that flows during operation and, depending on the comparison, to detect a short circuit of the first light emitting diode element or of the second light emitting diode element and to initiate an electrical switching off of one of the light emitting diode elements and/or of the assembly.

Abstract: An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.

Abstract: An optoelectronic component may include a first electrode having one outer electrode segment formed at a lateral edge of the first electrode, and one inner electrode segment formed apart from the lateral edge of the first electrode, an electrically conductive current distribution structure formed above the first electrode and having one outer substructure extending over the outer electrode segment, and one inner substructure extending over the inner electrode segment and electrically insulated from the outer substructure, one current lead extending from the lateral edge of the first electrode toward the inner substructure, electrically coupled to the inner substructure, electrically insulated from the outer substructure and which structure corresponds to the current distribution structure, an insulation structure, which covers the current distribution structure and the current lead, an organic functional layer structure, and a second electrode above the organic functional layer structure.

Abstract: Various embodiments may relate to a method for producing an optoelectronic component, including forming a first electrode on a substrate, arranging a first mask structure on or above the substrate, wherein the first mask structure comprises a first structuring region including an opening and/or a region prepared for forming an opening, arranging a second mask structure on or above the first mask structure, forming a second structuring region in the first mask structure and in the second mask structure in such a way that at least one part of the first structuring region in the first mask structure is formed outside the second structuring region in the first mask structure.

Abstract: A lighting device may include a substrate having a carrier, a first electrical busbar, a second electrical busbar, and an optically functional structure on or above the carrier, wherein the optically functional structure is formed laterally between the first and the second electrical busbar, and a first electrode electrically coupled to the first electrical busbar and/or the second electrical busbar, on or above the carrier, and an organic functional layer structure on or above the first electrode, wherein the organic functional layer structure is formed for converting an electric current into an electromagnetic radiation, and a second electrode on or above the organic functional layer structure. The optically functional structure is formed in such a way that the beam path of the electromagnetic radiation which passes through the substrate and/or the spectrum of the electromagnetic radiation passing through the substrate are/is variable by means of the optically functional structure.

Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) Providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general formula IA where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general formula ILA where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer.

Abstract: An optical element includes a light guide plate with a first major surface and with a second major surface opposite the first major surface and with side faces connecting the first and second major surfaces, wherein the light guide plate includes a matrix material transparent to ultraviolet light in which scattering centers are embedded, at least one light-emitting semiconductor device that couples ultraviolet light into the light guide plate via a side face when in operation, a first filter layer on the first major surface and a second filter layer on the second major surface, wherein the filter layers opaque to ultraviolet light and at least partially transparent to visible light, and a first photochromic layer at least on the first major surface, between the light guide panel and the first filter layer, with a transparency to visible light by ultraviolet light.

Abstract: Disclosed is an organic light-emitting, component which comprises a substrate, a first electrode on the substrate, a first organic functional layer stack on the first electrode, a charge carrier-generating layer stack on the first organic functional layer stack, a second organic functional layer stack on the charge carrier-generating layer stack, and a second electrode on the second organic functional layer stack. The charge carrier-generating layer stack comprises at least one hole-transporting layer, one electron-transporting layer and one intermediate layer, wherein the at least one intermediate layer comprises a naphthalocyanine derivative.

Abstract: An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.