Patents by Inventor John A. Higginson

John A. Higginson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MASS TRANSFER TOOL MANIPULATOR ASSEMBLY WITH REMOTE CENTER OF COMPLIANCE
    Publication number: 20170072559
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Method and structure for receiving a micro device
    Patent number: 9589944
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 7, 2017
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • MASS TRANSFER TOOL
    Publication number: 20170015006
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 19, 2017
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli
  • COMPLIANT MICRO DEVICE TRANSFER HEAD
    Publication number: 20170015110
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE
    Publication number: 20170018613
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 19, 2017
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Mass transfer tool manipulator assembly with remote center of compliance
    Patent number: 9522468
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: December 20, 2016
    Assignee: Apple Inc.
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Mass transfer tool
    Patent number: 9511498
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: December 6, 2016
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli
  • Compliant micro device transfer head
    Patent number: 9505230
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: November 29, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 9463613
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: October 11, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
    Publication number: 20160293566
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • COMPLIANT MICRO DEVICE TRANSFER HEAD
    Publication number: 20160257131
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • Compliant electrostatic transfer head with spring support layer
    Patent number: 9425151
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: August 23, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • Micro device transfer system with pivot mount
    Patent number: 9391042
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 12, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • MASS TRANSFER TOOL MANIPULATOR ASSEMBLY
    Publication number: 20160176045
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
  • Compliant micro device transfer head
    Patent number: 9370864
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: June 21, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20160148916
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 27, 2016
    Publication date: May 26, 2016
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Micro pick up array with integrated pivot mount
    Patent number: 9314930
    Abstract: Systems and methods for transferring a micro device from a carrier substrate include, in an embodiment, a micro pick up array structure to allow the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 19, 2016
    Assignee: LuxVue Technology Corporation
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • Mass transfer tool manipulator assembly
    Patent number: 9308649
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: April 12, 2016
    Assignee: LuxVue Techonology Corporation
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
  • COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH DEFINED CAVITY
    Publication number: 20160094160
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • Method and structure for receiving a micro device
    Patent number: 9263627
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: February 16, 2016
    Assignee: LuxVue Technology Corporation
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu