Patents by Inventor John Adam Edmond

John Adam Edmond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10260683
    Abstract: A lamp includes an optically transmissive enclosure for emitting an emitted light and a base connected to the enclosure. At least one first LED filament and at least one second LED filament are located in the enclosure and are operable to emit light when energized through an electrical path from the base. The first LED filament emits light having a first correlated color temperature (CCT) and the second LED filament emits light having a second CCT that are combined to generate the emitted light. A controller operates to change the CCT of the emitted light when the lamp is dimmed.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: April 16, 2019
    Assignee: Cree, Inc.
    Inventors: Michael John Bergmann, John Adam Edmond
  • Publication number: 20180328543
    Abstract: A lamp includes an optically transmissive enclosure for emitting an emitted light and a base connected to the enclosure. At least one first LED filament and at least one second LED filament are located in the enclosure and are operable to emit light when energized through an electrical path from the base. The first LED filament emits light having a first correlated color temperature (CCT) and the second LED filament emits light having a second CCT that are combined to generate the emitted light. A controller operates to change the CCT of the emitted light when the lamp is dimmed.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 15, 2018
    Inventors: Michael John Bergmann, John Adam Edmond
  • Patent number: 9905731
    Abstract: A light emitting diode is disclosed that includes a silicon carbide substrate and a light emitting structure formed from the Group III nitride material system on the substrate. The diode has an area greater than 100,000 square microns and has a radiant flux at 20 milliamps current of at least 29 milliwatts at its dominant wavelength between 390 and 540 nanometers.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: February 27, 2018
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Michael J. Bergmann, David T. Emerson, Kevin Ward Haberern
  • Patent number: 9890940
    Abstract: A LED fixture is provided, the lamp comprising a LED board having a thermally conductive periphery, the LED board comprising at least one LED operable to emit light when energized through an electrical path from a base; and a heat sink assembly thermally coupled to the thermally conductive periphery.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: February 13, 2018
    Assignee: Cree, Inc.
    Inventors: Bart P. Reier, Curt Progl, Daniel J. Van Epps, Jr., John R. Rowlette, Jr., John Adam Edmond, Kurt Wilcox, David Power
  • Patent number: 9831220
    Abstract: An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: November 28, 2017
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, Christopher P. Hussell, John Adam Edmond
  • Patent number: 9810379
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: November 7, 2017
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Patent number: 9754926
    Abstract: An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: September 5, 2017
    Assignee: CREE, INC.
    Inventors: Matthew Donofrio, John Adam Edmond, Hua-Shuang Kong, Peter S. Andrews, David Todd Emerson
  • Patent number: 9673363
    Abstract: A light emitting device includes a mounting substrate having a reflective layer that defines spaced apart anode and cathode pads, and a gap between them. A light emitting diode die is flip-chip mounted on the mounting substrate, such that the anode contact of the LED die is bonded to the anode pad and the cathode contact of the LED die is bonded to the cathode pad. A lens extends from the mounting substrate to surround the LED die. The reflective layer extends on the mounting substrate to cover substantially all of the mounting substrate that lies beneath the lens, excluding the gap, and may also extend beyond the lens.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: June 6, 2017
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, John Adam Edmond, Peter Scott Andrews, David Der Chi Chang
  • Patent number: 9660153
    Abstract: A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: May 23, 2017
    Assignee: Cree, Inc.
    Inventors: David Todd Emerson, Raymond Rosado, Matthew Donofrio, John Adam Edmond
  • Patent number: 9640737
    Abstract: Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 ?m is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 2, 2017
    Assignee: Cree, Inc.
    Inventors: Matthew Donofrio, John Adam Edmond, James Ibbetson, David Todd Emerson, Michael John Bergmann, Kevin Haberern, Raymond Rosado, Jeffrey Carl Britt
  • Publication number: 20160363269
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Application
    Filed: August 5, 2016
    Publication date: December 15, 2016
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Publication number: 20160348884
    Abstract: A LED fixture is provided, the lamp comprising a LED board having a thermally conductive periphery, the LED board comprising at least one LED operable to emit light when energized through an electrical path from a base; and a heat sink assembly thermally coupled to the thermally conductive periphery.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 1, 2016
    Inventors: Bart P. Reier, Curt Progl, Daniel J. Van Epps, JR., John R. Rowlette, JR., John Adam Edmond, Kurt Wilcox, David Power
  • Patent number: 9410687
    Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 9, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Patent number: 9395051
    Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In some embodiments, the LEDs can be mounted on or fixed to a light transmissive submount. In some embodiments, LEDs can be disposed on both sides of a two-sided submount, or on thee or more sides if the submount structure includes three or more mounting surfaces. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the gas is at a pressure of from about 0.5 to about 10 atmospheres and has a thermal conductivity of at least about 60 mW/m-K.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: July 19, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley
  • Patent number: 9395074
    Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: July 19, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez, Ed Adams
  • Patent number: 9362455
    Abstract: A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: June 7, 2016
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Matthew Donofrlo, Shawn Pyles
  • Patent number: 9353937
    Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: May 31, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye, Charles M. Swoboda, Antony Paul van de Ven, Paul Kenneth Pickard, Bart P. Reier, James Michael Lay, Peter E. Lopez
  • Patent number: 9322543
    Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: April 26, 2016
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, John Adam Edmond, Gerald H. Negley, Curt Progl, Mark Edmond, Praneet Athalye
  • Patent number: RE46588
    Abstract: The present invention is a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum. The semiconductor structure includes a Group III nitride active layer positioned between a first n-type Group III nitride cladding layer and a second n-type Group III nitride cladding layer, the respective bandgaps of the first and second n-type cladding layers being greater than the bandgap of the active layer. The semiconductor structure further includes a p-type Group III nitride layer, which is positioned in the semiconductor structure such that the second n-type cladding layer is between the p-type layer and the active layer.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: October 24, 2017
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Kathleen Marie Doverspike, Hua-shuang Kong, Michael John Bergmann
  • Patent number: RE46589
    Abstract: The present invention is a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum. The structure includes a first n-type cladding layer of AlxInyGa1?x?yN, where 0?x?1 and 0?y<1 and (x+y)?1; a second n-type cladding layer of AlxInyGa1?x?yN, where 0?x?1 and 0?y<1 and (x+y)?1, wherein the second n-type cladding layer is further characterized by the substantial absence of magnesium; an active portion between the first and second cladding layers in the form of a multiple quantum well having a plurality of InxGa1?xN well layers where 0<x<1 separated by a corresponding plurality of AlxInyGa1?x?yN barrier layers where 0?x?1 and 0?y?1; a p-type layer of a Group III nitride, wherein the second n-type cladding layer is positioned between the p-type layer and the multiple quantum well; and wherein the first and second n-type cladding layers have respective bandgaps that are each larger than the bandgap of the well layers.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: October 24, 2017
    Assignee: Cree, Inc.
    Inventors: John Adam Edmond, Kathleen Marie Doverspike, Hua-shuang Kong, Michael John Bergmann, David Todd Emerson