Abstract: A method of applying a dielectric lubricant to an electrical connector of a consumer electronic device. The method includes inserting a dielectric lubricant delivery device apertures for delivering the dielectric lubricant to the electrical connector into a receptacle of the electronic device; applying pressure to a chamber including the dielectric lubricant, the chamber being fluidly coupled to the apertures of the lubricant delivery device such that the pressure causes the lubricant to enter the receptacle via the apertures and deposit on contacts of the electrical connector; and pulling vacuum using the lubricant delivery device to remove excess dielectric lubricant from the receptacle and the electrical connector.

Abstract: An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.

Abstract: Aesthetically pleasing strain-relief members for cables, and methods for making the same, may include a tapered, inner strain-relief portion and an aesthetically pleasing outer strain-relief portion.

Abstract: A method of applying a dielectric lubricant to an electrical connector of a consumer electronic device. The method includes inserting a dielectric lubricant delivery device apertures for delivering the dielectric lubricant to the electrical connector into a receptacle of the electronic device; applying pressure to a chamber including the dielectric lubricant, the chamber being fluidly coupled to the apertures of the lubricant delivery device such that the pressure causes the lubricant to enter the receptacle via the apertures and deposit on contacts of the electrical connector; and pulling vacuum using the lubricant delivery device to remove excess dielectric lubricant from the receptacle and the electrical connector.

Abstract: An aesthetically pleasing docking station that is able to accommodate electronic devices with and without cases. An actuator within the docking station allows the connector plug of the docking station to retract a variable amount such that little or no gap exists between the electronic device and the surface of the docking station. Other embodiments enable the top surface of the housing to translate vertically such that little or no gap exists between the electronic device and surface of the docking station.

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract: An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.

Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

Abstract: An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.

Abstract: An aesthetically pleasing docking station that is able to accommodate electronic devices with and without cases. An actuator within the docking station allows the connector plug of the docking station to retract a variable amount such that little or no gap exists between the electronic device and the surface of the docking station. Other embodiments enable the top surface of the housing to translate vertically such that little or no gap exists between the electronic device and surface of the docking station.

Abstract: An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.

Abstract: Adjustable antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member and other conductive antenna structures. The adjustable antenna structures may have a movable dielectric support. Multiple conductive paths may be formed on the dielectric support. The movable dielectric support may be installed within an electronic device housing so that a selected one of the multiple conductive paths is coupled into use to convey antenna signals. Coupling the selected path into use adjusts the position of an antenna feed terminal for the antenna feed and compensates for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance.

Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

Abstract: An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure.

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract: An improved electrical connector retainer employs a shell having a cavity. A pair of mated electrical connectors are received within the cavity and at least a portion of an upper wall of the shell is deflected towards a lower wall of the shell. The shell is configured to retain the upper wall in the deflected position, maintaining the pair of connectors in the mated position.

Abstract: Connector receptacles having a contoured form factor that allows their use in stylized enclosures. These receptacles may also be contoured to avoid circuitry internal to the device enclosure. The contoured form factor may also simplify the assembly of the connector receptacle.

Abstract: Reinforcing bars or a reinforcing element with holes can be embedded within the shell of a receptacle connector to strengthen the shell, and potentially provide shielding. For example, a receptacle connector having a plurality of contacts configured to mate with corresponding contacts of a corresponding plug connector can include a shell having an opening for receiving the corresponding plug connector. The shell can include an upper portion and reinforcing bars embedded within the upper portion. The shell can include an upper portion and a reinforcing element with holes embedded within the upper portion. Methods for manufacturing the shell are also provided.