Abstract: A gas detection device is provided. The device includes a substrate and a dielectric material applied to the substrate. A sensor material is applied to the dielectric film. The sensor material has a bottom, a side, and a top surface. An electrode material is at least partially applied to the dielectric film and at least partially applied to a portion of the side of the sensor material and a portion of the top surface of the sensor material to pin a portion of the sensor material to the dielectric material. The electrode material forms a vapor barrier upon the sensor material to facilitate preventing delamination between the sensor material and the electrode material over portions of the sensor material where the sensor material is not pinned to the dielectric material.

Abstract: An isolated sensor and method of isolating a sensor are provided. The isolated sensor includes a mounting portion, a sensor portion disposed adjacent to the mounting portion, and at least one pedestal connecting a mounting portion to a sensor portion.

Abstract: A personal protective positive pressure device includes a mask with an inlet connector and a tube with a first connector and a second connector. The tube is connected through the first connector to the inlet connector of the mask and the tube is connected through the second connector to an air nozzle of a ventilation system onboard a transportation vehicle. The personal protective positive pressure device is configured to limit inhalation of airborne pathogens while traveling on the transportation vehicle and to inspire confidence in the safe use of public transportation.

Abstract: A gas detection device is provided having a substrate. A sensing element is coupled to the substrate and constructed and arranged to sense a target gas. A top surface is positioned on the sensing element opposite the substrate. A dopant is disposed within the sensing element. The dopant enhances the ability of the sensing element to sense the target gas. An electric field is applied to the dopant to constrain the dopant at or near the top surface of the sensing element.

Abstract: A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.

Abstract: A gas detection device is provided having a substrate. A sensing element is coupled to the substrate and constructed and arranged to sense a target gas. A top surface is positioned on the sensing element opposite the substrate. A dopant is disposed within the sensing element. The dopant enhances the ability of the sensing element to sense the target gas. An electric field is applied to the dopant to constrain the dopant at or near the top surface of the sensing element.

Abstract: A gas detection device is provided. The device includes a substrate and a dielectric material applied to the substrate. A sensor material is applied to the dielectric film. The sensor material has a bottom, a side, and a top surface. An electrode material is at least partially applied to the dielectric film and at least partially applied to a portion of the side of the sensor material and a portion of the top surface of the sensor material to pin a portion of the sensor material to the dielectric material. The electrode material forms a vapor barrier upon the sensor material to facilitate preventing delamination between the sensor material and the electrode material over portions of the sensor material where the sensor material is not pinned to the dielectric material.

Abstract: An isolated sensor and method of isolating a sensor are provided. The isolated sensor includes a mounting portion, a sensor portion disposed adjacent to the mounting portion, and at least one pedestal connecting a mounting portion to a sensor portion.

Abstract: A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.

Abstract: A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.

Abstract: A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.

Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.

Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.

Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.

Abstract: An auxiliary power unit for generating electrical power. The auxiliary power unit includes a fuel cell system for combining hydrogen and oxygen to provide electrical power, and a system for storing and retrieving elemental hydrogen for supplying hydrogen to the fuel cell system. The storing and retrieving system contains at least one hydrogen storage member formed by a mass of porous silicon having interior and exterior surfaces, in which at least the interior surfaces have dangling bond sites at which reversible chemisorption of hydrogen atoms occurs. The storing and retrieving system further includes a control system for liberating the chemisorbed hydrogen atoms from the dangling bond sites and releasing the liberated hydrogen atoms as hydrogen gas for use by the fuel cell system.

Abstract: A semiconductor wafer is etched to create an array of MEMS devices and at the same time, test sites having geometry which represent critical geometry of the MEMS devices. Probe contacts are provided in the test sites to permit measurement of resistance and capacitance between test site geometry as a way of determining the effectiveness of the etch. One test site comprises a ladder of semiconductor structures separated by gaps of graded width. Another test site comprises finger structures formed over a cavity and the probe contacts are located so as to detect inter-finger capacitance and resistance (or continuity) as well as intra-finger resistance.

Abstract: A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair.

Abstract: A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair.