Patents by Inventor John Harold Zechman

John Harold Zechman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of making an integrated circuit chip composite
    Patent number: 5824568
    Abstract: A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
    Type: Grant
    Filed: July 5, 1996
    Date of Patent: October 20, 1998
    Assignee: International Business Machines Corporation
    Inventor: John Harold Zechman
  • Integrated circuit chip composite having a parylene coating
    Patent number: 5656830
    Abstract: A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
    Type: Grant
    Filed: December 10, 1992
    Date of Patent: August 12, 1997
    Assignee: International Business Machines Corp.
    Inventor: John Harold Zechman