Abstract: An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: A plug which has a plugging portion and a stem extending therefrom is formed of an elastomeric material in order to deform to create a wiping engagement and a seal with the walls of a receiving cavity. The stem and plugging portion include both cavities for receiving alignment pins in the device being plugged and a manually engageable portion on a distal end of the stem for removing the plug from the sealed cavity, such as within an optical subassembly module. The side edges of the plugging member conform to the cavity cross-section to enhance the sealing yet do not unduly deform the member. The sealing member is formed with one or more standoffs to engage an end face of the cavity, assuring no contact between the optical elements and the plug. The edges of the plug deform upon insertion to create the seal and form a wiping engagement with the cavity interior.

Abstract: An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: A plug which has a plugging portion and a stem extending therefrom is formed of an elastomeric material in order to deform to create a wiping engagement and a seal with the walls of a receiving cavity. The stem and plugging portion include both cavities for receiving alignment pins in the device being plugged and a manually engageable portion on a distal end of the stem for removing the plug from the sealed cavity, such as within an optical subassembly module.. The side edges of the plugging member conform to the cavity cross-section to enhance the sealing yet do not unduly deform the member. The sealing member is formed with one or more standoffs to engage an end face of the cavity, assuring no contact between the optical elements and the plug. The edges of the plug deform upon insertion to create the seal and form a wiping engagement with the cavity interior.

Abstract: A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compression portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56).

Abstract: An electrical connector for coupling two circuitized substrates (e.g., a ball grid array module and a printed circuit board) wherein the connector includes a base member fixedly secured (e.g., soldered) to the printed circuit board and having one substrate oriented therein. The connector further includes a 2-part retention member including one part movably oriented in the base and a second part for directly engaging the retained substrate to cause it to move downwardly (and thus in a completely different direction than the direction of rotation of the movable one part within the base) to thereby provide effective connection between substrates. An interposer may be used if desired. An information handling system including a microprocessor and connector electrically coupled thereto is also disclosed.

Abstract: A socket connects electronic components such as integrated circuit modules with arrays of solder balls or columns, lands, pads of similar contacts to other components, typically substrates such as printed circuit boards. The socket has a polarization post and locator posts that extend through polarization and locator holes in the substrate and in a registration sheet that locates the module with respect to the substrate. The heads of the posts, which are all substantially the same size, extend through arcuate slots in a cam ring. Each of the slots has an inclined ramp that engages the heads of the post. When the cam ring is turned, the heads of the posts ride up the ramps, moving the cam ring towards the substrate and compressing a wave spring that presses against a pressure plate.

Abstract: A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compressible portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. The support member may also be metallic, e.g., for use as an electrical ground shield.