Patents by Inventor John J. Liutkus

John J. Liutkus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5546655
    Abstract: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: August 20, 1996
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh
  • Patent number: 5360946
    Abstract: The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: November 1, 1994
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh
  • Patent number: 5268815
    Abstract: A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: December 7, 1993
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Cipolla, Paul W. Coteus, Brian C. Derdall, Christina M. Knoedler, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Lawrence S. Mok, Irene A. Sterian
  • Patent number: 4780754
    Abstract: A cement composition containing cement, water, and a silanol terminated polysiloxane, and cured products thereof exhibiting improved thermal stability and dielectric constant.
    Type: Grant
    Filed: September 15, 1987
    Date of Patent: October 25, 1988
    Assignee: International Business Machines Corporation
    Inventors: John J. Liutkus, Caroline A. Kovac
  • Patent number: 4678850
    Abstract: Poly(halogenated styrene) compositions having a molecular weight range of from about 1.times.10.sup.5 to 1.times.10.sup.6 and a dispersivity of from about 1.5 to about 2.5 useful as negative resists.
    Type: Grant
    Filed: October 19, 1984
    Date of Patent: July 7, 1987
    Assignee: International Business Machines Corp.
    Inventors: Michael Hatzakis, John J. Liutkus, Jurij R. Paraszcszak, Jane M. Shaw