Patents by Inventor John Klocke

John Klocke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140262794
    Abstract: A method for electroplating a wafer detects plating bath failure based on a voltage change. The method is useful in plating wafers having TSV features. Voltage of each anode of a plating processor may be monitored. An abrupt drop in voltage signals a bath failure resulting from conversion of an accelerator such as SPS to it's by products MPS. Bath failure is delayed or avoided by current pulsing or current ramping. An improved plating bath has a catholyte with a very low acid concentration.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Daniel K. Gebregziabiher, John Klocke, Charles Sharbono, Chandru Thambidurai, David J. Erickson
  • Patent number: 7628898
    Abstract: Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: December 8, 2009
    Assignee: Semitool, Inc.
    Inventors: John Klocke, Kyle M. Hanson, Rajesh Baskaran
  • Publication number: 20090114533
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
    Type: Application
    Filed: June 3, 2004
    Publication date: May 7, 2009
    Inventors: Kyle Hanson, John Klocke
  • Patent number: 7351314
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: April 1, 2008
    Assignee: Semitool, Inc.
    Inventors: John Klocke, Kyle M Hanson
  • Patent number: 7351315
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having a plurality of electrodes and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrodes. The chamber further includes a barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The barrier can be a porous, permeable barrier or a nonporous, semipermeable barrier.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: April 1, 2008
    Assignee: Semitool, Inc.
    Inventors: John Klocke, Kyle M Hanson
  • Publication number: 20070175759
    Abstract: The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry.
    Type: Application
    Filed: December 22, 2006
    Publication date: August 2, 2007
    Inventors: John Klocke, Kyle Hanson
  • Publication number: 20070068820
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: May 3, 2006
    Publication date: March 29, 2007
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20070043474
    Abstract: Methods and systems for managing a process for electrochemically treating a surface of a microfeature workpiece in an electrochemical treatment chamber that includes a processing unit for receiving a first processing fluid separated by an ion-permeable barrier from an electrode unit for receiving a second processing fluid are described. The methods and systems provide the operator the ability to effectively troubleshoot, evaluate, and modify electrochemical treatment processes so that effective results can be achieved and cost savings realized.
    Type: Application
    Filed: August 17, 2005
    Publication date: February 22, 2007
    Inventor: John Klocke
  • Patent number: 7147765
    Abstract: The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: December 12, 2006
    Assignee: Semitool, Inc.
    Inventors: John Klocke, Kyle Hanson
  • Publication number: 20060260946
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 23, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060237323
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: April 28, 2006
    Publication date: October 26, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060189129
    Abstract: The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The processes described modify an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process. According to the processes described metallized features are formed on the treated barrier layers using processes that employ ion permeable barriers.
    Type: Application
    Filed: April 28, 2006
    Publication date: August 24, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Robert Batz, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060163072
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: December 7, 2005
    Publication date: July 27, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060157355
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: December 8, 2005
    Publication date: July 20, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060144712
    Abstract: Systems and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, a method includes flowing a first processing fluid at least proximate to a processing site in a reaction chamber, flowing a second processing fluid at least proximate to an electrode in the reaction chamber, applying an electrical current to the electrode to establish an electrical current flow in the first and second processing fluids, separating the first processing fluid and the second processing fluid with a barrier, and changing a batch of the first and/or second processing fluid after at least five weeks of normal operation.
    Type: Application
    Filed: August 31, 2005
    Publication date: July 6, 2006
    Inventor: John Klocke
  • Publication number: 20060144699
    Abstract: Systems and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, a system includes (a) a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece, (b) an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode, (c) a barrier between the processing unit and the electrode unit to separate the first and second processing fluids, and (d) a water balance unit for maintaining the concentration of water in the first processing fluid within a desired range.
    Type: Application
    Filed: August 31, 2005
    Publication date: July 6, 2006
    Inventor: John Klocke
  • Publication number: 20060032758
    Abstract: Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.
    Type: Application
    Filed: August 5, 2005
    Publication date: February 16, 2006
    Inventors: John Klocke, Kyle Hanson, Rajesh Baskaran
  • Publication number: 20050121326
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having a plurality of electrodes and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrodes. The chamber further includes a barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The barrier can be a porous, permeable barrier or a nonporous, semipermeable barrier.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 9, 2005
    Inventors: John Klocke, Kyle Hanson
  • Publication number: 20050121317
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 9, 2005
    Inventors: John Klocke, Kyle Hanson
  • Publication number: 20050087439
    Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.
    Type: Application
    Filed: June 3, 2004
    Publication date: April 28, 2005
    Inventors: Kyle Hanson, John Klocke