Patents by Inventor John Liebeskind

John Liebeskind has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11806788
    Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: November 7, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Champion, Pavan Suri, John Liebeskind, Richard Seaver
  • Patent number: 11668528
    Abstract: In an example implementation, a sintering system includes optical fiber installed into a sintering furnace. A support structure inside the furnace is to support a token green object in a predetermined position and to hold a distal end of the fiber adjacent to the predetermined position. A light source is operably engaged at a proximal end of the fiber to transmit light through the fiber into the furnace. A light detector is operably engaged at the proximal end of the fiber to receive reflected light through the fiber that scatters off a surface of the token green object.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 6, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John Liebeskind, Andrew L. Van Brocklin, David Champion
  • Publication number: 20210325113
    Abstract: In an example implementation, a sintering system includes optical fiber installed into a sintering furnace. A support structure inside the furnace is to support a token green object in a predetermined position and to hold a distal end of the fiber adjacent to the predetermined position. A light source is operably engaged at a proximal end of the fiber to transmit light through the fiber into the furnace. A light detector is operably engaged at the proximal end of the fiber to receive reflected light through the fiber that scatters off a surface of the token green object.
    Type: Application
    Filed: January 4, 2019
    Publication date: October 21, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: John Liebeskind, Andrew L. Van Brocklin, David Champion
  • Publication number: 20210213525
    Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.
    Type: Application
    Filed: November 26, 2018
    Publication date: July 15, 2021
    Inventors: David Champion, Pavan Suri, John Liebeskind, Richard Seaver
  • Patent number: 8678571
    Abstract: A fluid ejection cartridge for a fluid ejection device includes a print head, having a plurality of fluid ejection nozzles, a fluid reservoir, configured to hold a fluid to be ejected from the print head, and a selectively breachable isolator mechanism, separating the fluid reservoir and the print head.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: March 25, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: William R. Wagner, Donald B Ouchida, Daniel S Kuehler, John Liebeskind
  • Publication number: 20110181672
    Abstract: A fluid ejection cartridge for a fluid ejection device includes a print head, having a plurality of fluid ejection nozzles, a fluid reservoir, configured to hold a fluid to be ejected from the print head, and a selectively breachable isolator mechanism, separating the fluid reservoir and the print head.
    Type: Application
    Filed: October 15, 2008
    Publication date: July 28, 2011
    Inventors: William R. Wagner, Donald B. Ouchida, Daniel S. Kuehler, John Liebeskind
  • Patent number: 7608998
    Abstract: A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: October 27, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sriram Ramamoorthi, Zhizhang Chen, John Liebeskind, Ronald L. Enck, Jennifer Shih
  • Patent number: 7508132
    Abstract: A device including a substrate, a getter structure coupled to the substrate, and a photomask disposed over the getter structure. The photomask has a substantially transmissive and a substantially non-transmissive region. The substantially transmissive region substantially aligns with the getter structure.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: March 24, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, James C. McKinnell, John Liebeskind
  • Patent number: 7332411
    Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: February 19, 2008
    Assignee: Hewlett-Packard Development Company, LP
    Inventors: James McKinnell, Chien-Hua Chen, John Liebeskind, Ronald A Hellekson
  • Patent number: 7294914
    Abstract: An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: November 13, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: John Liebeskind
  • Publication number: 20070152352
    Abstract: A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.
    Type: Application
    Filed: March 13, 2007
    Publication date: July 5, 2007
    Inventors: James McKinnell, John Liebeskind, Chien-Hua Chen
  • Patent number: 7205675
    Abstract: A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: April 17, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James C. McKinnell, John Liebeskind, Chien-Hua Chen
  • Patent number: 7129503
    Abstract: Determining a beam size of an emitter for a data storage medium is disclosed. The emitter, having an emitted beam, is moved across conductor of a detector. Current through the conductor, resulting from the emitted beam as the emitter moves across the detector, is measured. The size of the emitted beam of the emitter is determined based on the position of the emitter and the measured current.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: October 31, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey M. Valley, John Liebeskind
  • Publication number: 20060183299
    Abstract: An electronic device that is sealed under vacuum includes a substrate, a transistor formed on the substrate, and a dielectric layer covering at least a portion of the transistor. The electronic device further includes a layer of non-evaporable getter material disposed on a portion of the dielectric layer; and a vacuum device disposed on a portion of the substrate. Electrical power pulses activate the non-evaporable getter material.
    Type: Application
    Filed: March 2, 2006
    Publication date: August 17, 2006
    Inventor: John Liebeskind
  • Publication number: 20060164009
    Abstract: A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.
    Type: Application
    Filed: March 22, 2006
    Publication date: July 27, 2006
    Inventors: Sriram Ramamoorthi, Zhizhang Chen, John Liebeskind, Ronald Enck, Jennifer Shih
  • Patent number: 7045958
    Abstract: A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: May 16, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sriram Ramamoorthi, Zhizhang Chen, John Liebeskind, Ronald L. Enck, Jennifer Shih
  • Patent number: 7042075
    Abstract: An electronic device that is sealed under vacuum includes a substrate, a transistor formed on the substrate, and a dielectric layer covering at least a portion of the transistor. The electronic device further includes a layer of non-evaporable getter material disposed on a portion of the dielectric layer; and a vacuum device disposed on a portion of the substrate. Electrical power pulses activate the non-evaporable getter material.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: May 9, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: John Liebeskind
  • Publication number: 20060087232
    Abstract: A method of manufacturing a getter structure, including forming a support structure having a support perimeter, where the support structure is disposed over a substrate. In addition, the method includes forming a non-evaporable getter layer having an exposed surface area, where the non-evaporable getter layer is disposed over the support structure, and includes forming a vacuum gap between the substrate and the non-evaporable getter layer. The non-evaporable getter layer extends beyond the support perimeter of the support structure increasing the exposed surface area.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 27, 2006
    Inventors: Sriram Ramamoorthi, Zhizhang Chen, John Liebeskind, Ronald Enck, Jennifer Shih
  • Publication number: 20060033676
    Abstract: A display device includes a base and light valve components formed over the base. The base includes electrical circuitry. Each of the light valve components includes a chamber that defines an optical path, particles within the chamber, and a mechanism for transversely repositioning the particles in relation to the optical path in response to voltages provided by the electrical circuitry.
    Type: Application
    Filed: August 10, 2004
    Publication date: February 16, 2006
    Inventors: Kenneth Faase, Timothy Weber, John Liebeskind, Charles Morehouse, James McKinnell
  • Publication number: 20060033201
    Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
    Type: Application
    Filed: August 12, 2004
    Publication date: February 16, 2006
    Inventors: James McKinnell, Chien-Hua Chen, John Liebeskind, Ronald Hellekson