Patents by Inventor John McCormick

John McCormick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060009988
    Abstract: A method, apparatus, data structure and system are disclosed for developing order and/or lot sizes for an entity that are consistent with and supportive of an entity's strategic objective. The disclosed process uses the chosen units of measure of the strategic objective to evaluate the total impact each job has on the strategic objective and then develops the order and/or lot sizes based upon the equalizing the total impact the job has on the strategic objective, less any fixed impact the job may have on the strategic objective, against the individual impact a single unit of the order or job has on the strategic objective.
    Type: Application
    Filed: July 6, 2004
    Publication date: January 12, 2006
    Applicant: Strategic Foresight LLC
    Inventor: John McCormick
  • Publication number: 20060009989
    Abstract: A method, apparatus, data structure and system for scheduling work consistent with and supportive of the strategic objectives of an entity is disclosed herein. In its preferred embodiment, the strategic objectives are defined and the primary strategic objective is chosen along with a measure for the primary strategic objective. Next, a measure for scheduling work is defined and chosen that is consistent with the primary strategic objective and the objective's measure. Next, the constraints to schedule work by are evaluated, the primary constraint selected and the order within the chosen constraint prioritized. The work schedule measure is then calculated for each job in the work queue for the selected constraint. All of the jobs are sorted based upon the calculated work schedule measures with the job having the largest positive impact on the work schedule measure being first. The prioritized job is then scheduled into the prioritized constraint.
    Type: Application
    Filed: July 6, 2004
    Publication date: January 12, 2006
    Applicant: Strategic Foresight LLC
    Inventor: John McCormick
  • Publication number: 20060009990
    Abstract: A system and method for tangibly evaluating the impact that proposed daily or long term actions would have on an entity's strategic objectives, or other business goals, prior to implementing those proposed actions is provided by forecasting the probable results of those proposed actions and comparing them to the forecasted results of the existing planned actions. The invention also includes a provision to evaluate the impact of any proposed changes in terms of the changes' offsetting tradeoff impacts. The invention also includes the provision to limit the ability of different users of the system to over-ride the recommended actions based upon the individual user's authority level, based upon the expected results of the proposed actions and/or based upon the tradeoff results on the tradeoff threshold limits. In addition, all of the results and/or limits can be setup as a set of ranges to work within as opposed to just target values.
    Type: Application
    Filed: July 8, 2004
    Publication date: January 12, 2006
    Inventor: John McCormick
  • Publication number: 20050274164
    Abstract: A ready-to-use lawn colorant and fertilizer composition is provided in a spray bottle. The composition includes a water-based lawn paint, fertilizer with nitrogen, phosphate and potash, and water.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 15, 2005
    Inventors: Brian Coates, John McCormick
  • Patent number: 6666071
    Abstract: A method and apparatus for leak testing moulded plastic containers in which the containers are conveyed seriatim along a linear path. Each successive container is pressurized at a first station along the path and then sealed to maintain pressurization while being disconnected from the source of pressure. A test station is provided a distance downstream along the path from the first station selected to allow pressure in the container to stabilize if there is no leak. At the test station, the pressure in each successive container is momentarily determined and a signal is provided if a container is determined to be leaking. The apparatus includes battery-powered test heads that are brought into engagement with successive containers at the first station and momentarily energized by an optical transmitter when a pressure reading is to be taken, so that battery power is conserved.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: December 23, 2003
    Inventor: John McCormick
  • Publication number: 20030230135
    Abstract: A method and apparatus for leak testing moulded plastic containers in which the containers are conveyed seriatim along a linear path. Each successive container is pressurized at a first station along the path and then sealed to maintain pressurization while being disconnected from the source of pressure. A test station is provided a distance downstream along the path from the first station selected to allow pressure in the container to stabilize if there is no leak. At the test station, the pressure in each successive container is momentarily determined and a signal is provided if a container is determined to be leaking. The apparatus includes battery-powered test heads that are brought into engagement with successive containers at the first station and momentarily energized by an optical transmitter when a pressure reading is to be taken, so that battery power is conserved.
    Type: Application
    Filed: June 17, 2002
    Publication date: December 18, 2003
    Inventor: John McCormick
  • Patent number: 6523550
    Abstract: An application device for applying a wide variety of lotions and creams to the body. The application device includes a head portion that includes a first end, a second end, a top wall, a bottom wall and peripheral edge integrally coupled to and extending between the top and bottom walls such that a chamber is defined. The bottom wall includes a plurality of holes extending therethrough. A solution is positioned in the chamber. A handle member is integrally coupled to a central portion of the top wall. The handle member includes a first end, a second end and a peripheral wall extending therebetween. An absorbent member for absorbing the solution from the chamber through each of the holes in the bottom wall is securably attached to an outer surface of the bottom wall.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: February 25, 2003
    Inventor: John McCormick
  • Publication number: 20020069891
    Abstract: An application device for applying a wide variety of lotions and creams to the body. The application device includes a head portion that includes a first end, a second end, a top wall, a bottom wall and peripheral edge integrally coupled to and extending between the top and bottom walls such that a chamber is defined. The bottom wall includes a plurality of holes extending therethrough. A solution is positioned in the chamber. A handle member is integrally coupled to a central portion of the top wall. The handle member includes a first end, a second end and a peripheral wall extending therebetween. An absorbent member for absorbing the solution from the chamber through each of the holes in the bottom wall is securably attached to an outer surface of the bottom wall.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 13, 2002
    Inventor: John McCormick
  • Patent number: 6334766
    Abstract: A take-out system for a shuttle-type blow moulding machine having two moulding assemblies has a single gripper head for taking out moulded articles from both moulding assemblies. The gripper head is carried by a vertical gripper arm which can be raised and lowered by a rack and pinion drive with respect to a carriage that moves in line with the two moulding assemblies. Electric servomotors are used to raise and lower the gripper head and move the carriage under software control so that the motion of the gripper head can be programmed to match a particular moulding machine. The articles may be moulded with tabs that can be gripped by the gripper head, and the take-out system may include a trimmer for removing those tabs, and a waste conveyor for the trimmed material.
    Type: Grant
    Filed: October 9, 1997
    Date of Patent: January 1, 2002
    Inventor: John McCormick
  • Patent number: 6171888
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
    Type: Grant
    Filed: June 8, 1998
    Date of Patent: January 9, 2001
    Assignee: LSI Logic Corp.
    Inventors: Brian Lynch, John McCormick
  • Patent number: 6023420
    Abstract: A three-phase inverter for small, high speed motors such as a miniature centrifical compressor which has a low voltage, high current requirement. The inverter is supplied with DC power at 28 volts, and produces power of about 50 to 500 watts at about 15 volts, and at frequencies of about 5 to 9 kilohertz. Six D-type flip-flops with clock inputs produce twelve signals which are provided to six bridge drivers. Each bridge driver controls two MOSFET's in series. The MOSFET's are supplied with DC power. Outputs are fed to primaries of adjacent transformers in a circular array. The transformer secondaries are arranged in a star configuration to produce stepped voltage and saw-tooth current output wave forms approximating sinusoids in three phases.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: February 8, 2000
    Assignee: Creare, Inc.
    Inventors: John A. McCormick, Javier A. Valenzuela
  • Patent number: 6011992
    Abstract: A system for measuring changes in the resistance of a living body includes a resistance measuring circuit, an amplifier circuit and an indicator circuit in which the amplifier circuit includes a calibration circuit to give a generally constant amplitude response to a given measured input. Radio frequency insulators are included to reduce noise in the system. The circuits are operated such that when an overall change in the resistance of a living body occurs, the resistance measuring circuit is adjusted to determine the overall resistance. To account for changes in sensitivity caused by the overall change in resistance, the gain of the amplifier circuit is automatically adjusted to thereby maintain a generally constant amplitude response.
    Type: Grant
    Filed: May 9, 1996
    Date of Patent: January 4, 2000
    Assignee: Church of Spirtual Technology
    Inventors: Lafayette Ron Hubbard, deceased, by Norman F. Starkey, legal representative, John McCormick, James Stavropoulos, Richard Stinnett
  • Patent number: 6008991
    Abstract: An electronic system such as a Board-Level-Product (BLP) includes at least one integrated circuit device which is mounted on a circuit board. Each integrated circuit device includes a thin dielectric substrate bearing a plurality of conductive leads and has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on the circuit board.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: December 28, 1999
    Assignee: LSI Logic Corporation
    Inventors: Emily Hawthorne, John McCormick
  • Patent number: 5898575
    Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: April 27, 1999
    Assignee: LSI Logic Corporation
    Inventors: Emily Hawthorne, John McCormick
  • Patent number: 5854085
    Abstract: Separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly. TAB technology is utilized to produce an assembly that has superior electrical characteristics because power and ground is conducted on separate low impedance conductive layers. The power and ground leads connecting the semiconductor die and external circuits are selected from the signal trace layer, cut bent downward and attached by bonding to the respective power or ground layer. A tool is disclosed for cutting the selected leads. A method of attaching solder balls to a TBGA film using solder flux and photoimageable solder resist definition is also disclosed.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: December 29, 1998
    Assignee: LSI Logic Corporation
    Inventors: Kurt Raymond Raab, John McCormick
  • Patent number: 5831836
    Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate. Electrical connections between the integrated circuit die and the package leads are provided. A rigid upper protective layer is present. The rigid upper protective layer encloses the integrated circuit die, and at least partially covers the top surface of the upper insulative layer. The semiconductor device package further comprises a rigid or semi-rigid metal lower protective layer opposite the upper protective layer including a ground plane proximal to the electrical leads and a power plane distal to the leads. Methods of production are also given.
    Type: Grant
    Filed: January 30, 1992
    Date of Patent: November 3, 1998
    Assignee: LSI Logic
    Inventors: Jon Long, John McCormick
  • Patent number: 5801432
    Abstract: Electronic systems using separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly of the system. TAB technology is utilized to produce an assembly that has superior electrical characteristics because power and ground is conducted on separate low impedance conductive layers. The power and ground leads connecting the semiconductor die and external circuits are selected from the signal trace layer, cut bent downward and attached by bonding to the respective power or ground layer. A tool is disclosed for cutting the selected leads. The present invention further provides a system utilizing a wafer probe card which includes a multi-layer, relatively flexible tape-like substrate having a first conductive layer patterned to have a number of probe leads thereon.
    Type: Grant
    Filed: April 16, 1996
    Date of Patent: September 1, 1998
    Assignee: LSI Logic Corporation
    Inventors: Michael D. Rostoker, Kurt Raymond Raab, John McCormick
  • Patent number: 5786910
    Abstract: Security devices which are difficult to reproduce include a grid screen metallization pattern. The grid screen metallization pattern may be laid down over a hologram or diffraction grating formed as a surface relief pattern on a substrate, to form a visually identifiable, semi-transparent security device. Additionally, the metallization pattern may include resonant structures in which information about the security device is encoded. In some embodiments of these security devices, the metallization pattern is disposed in accurate registration with the underlying hologram or diffraction grating. These security devices are made by methods which include printing an oil pattern on the substrate. Areas on which oil is deposited do not receive metal during a metallization step. Since these methods do not use caustics, metallization patterns including features which would otherwise trap and hold caustics are possible.
    Type: Grant
    Filed: May 11, 1995
    Date of Patent: July 28, 1998
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, John A. McCormick
  • Patent number: 5763952
    Abstract: One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
    Type: Grant
    Filed: March 8, 1996
    Date of Patent: June 9, 1998
    Assignee: LSI Logic Corporation
    Inventors: Brian Lynch, John McCormick
  • Patent number: 5757521
    Abstract: Security devices which are difficult to reproduce include a grid screen metallization pattern. The grid screen metallization pattern may be laid down over a hologram or diffraction grating formed as a surface relief pattern on a substrate, to form a visually identifiable, semi-transparent security device. Additionally, the metallization pattern may include resonant structures in which information about the security device is encoded. In some embodiments of these security devices, the metallization pattern is disposed in accurate registration with the underlying hologram or diffraction grating. These security devices are made by methods which include printing an oil pattern on the substrate. Areas on which oil is deposited do not receive metal during a metallization step. Since these methods do not use caustics, metallization patterns including features which would otherwise trap and hold caustics are possible.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: May 26, 1998
    Assignee: Advanced Deposition Technologies, Inc.
    Inventors: Glenn J. Walters, Richard C. Shea, John A. McCormick