Patents by Inventor John Naumovitz

John Naumovitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10872990
    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 22, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Michael D. White
  • Patent number: 10770609
    Abstract: Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 8, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Patent number: 10759152
    Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 1, 2020
    Assignee: dow global technologies llc
    Inventors: Jeffrey E Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Publication number: 20200048448
    Abstract: The present invention relates generally to vinylidene chloride polymer compositions. In one embodiment, a vinylidene chloride polymer composition comprises (a) a vinylidene chloride polymer formed from a monomer mixture comprising from 60 to 99 weight percent vinylidene chloride monomer and from 40 to 1 weight percent of a monoethylenically unsaturated monomer copolymerizable therewith; (b) 0.3 to 5 weight percent of an acrylic polymer based on the total weight of the polymer composition; and (c) 0.2 to 7 weight percent of at least one additive comprising (i) at least one wax in an amount of from 0.01 to 2 weight percent based on the total weight of the polymer composition, (ii) at least one polyethylene having a density greater than 0.940 g/cm3 in an amount of from 0.1 to 5 weight percent based on the total weight of the polymer composition, or combinations thereof.
    Type: Application
    Filed: August 17, 2016
    Publication date: February 13, 2020
    Inventors: Huiqing Zhang, Douglas E. Beyer, John A. Naumovitz
  • Patent number: 10424682
    Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: September 24, 2019
    Assignees: DOW GLOBAL TECHNOLOGIES LLC, ROHM AND HAAS COMPANY
    Inventors: John A. Naumovitz, Hongyu Chen, Yan Huang, Ada Yu Zhang, Zhi Xu
  • Publication number: 20190140122
    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 9, 2019
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Michael D. White
  • Publication number: 20190118517
    Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 25, 2019
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John a. Naumovitz, Mark G. Hofius
  • Publication number: 20190123226
    Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 125° C., the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 25, 2019
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Patent number: 10164137
    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 25, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Michael D. White
  • Publication number: 20180304602
    Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I2) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer comprises 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm3 or more and having a melt index (I2) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 55 weight percent of the blend based on the total weight of the blend.
    Type: Application
    Filed: November 18, 2016
    Publication date: October 25, 2018
    Inventors: Carmelo Declet Perez, Brian W. Walther, James L. Cooper, Michael B. Biscoglio, John A. Naumovitz
  • Publication number: 20180186941
    Abstract: The present invention relates generally to methods of preparing vinylidene chloride polymer compositions. In one embodiment, a method of preparing a vinylidene chloride polymer composition comprises (a) adding a first dispersion comprising a wax, a polyolefin or a combination thereof to an aqueous dispersion comprising vinylidene chloride polymer particles; (b) adding an acrylic polymer latex to the aqueous dispersion; and (c) coagulating the wax, the polyolefin, or the combination of the wax and polyolefin, and the acrylic polymer on the surface of the polymer particles.
    Type: Application
    Filed: August 17, 2016
    Publication date: July 5, 2018
    Inventors: Huiqing Zhang, Douglas E. Beyer, John A. Naumovitz
  • Publication number: 20180148525
    Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 31, 2018
    Inventors: Rajen M. Patel, Shaofu Wu, Mark T. Bernius, Mohamed Esseghir, Robert L. McGee, Michael H. Mazor, John Naumovitz
  • Publication number: 20170338360
    Abstract: The present disclosure provides a photovoltaic module. In an embodiment, the photovoltaic module includes a photovoltaic cell, and a layer composed of a film. The film includes a silane-grafted polyolefin (Si-g-PO) resin composition comprising (i) one or more silane grafted polyolefins and (ii) from greater than 0 wt % to less than 5.0 wt % of a micronized silica gel, based on the total weight of the Si-g-PO resin composition. The film has a glass adhesion greater than or equal to 15 N/mm after aging the film at 40° C. and 0% relative humidity for 60 days as measured in accordance with ASTM F88/88M-09.
    Type: Application
    Filed: October 30, 2015
    Publication date: November 23, 2017
    Inventors: Fanny Deplace, Kumar Nanjundiah, Jeffrey E. Bonekamp, John A. Naumovitz
  • Publication number: 20160276512
    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.
    Type: Application
    Filed: April 16, 2014
    Publication date: September 22, 2016
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Michael D. White
  • Publication number: 20160260857
    Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
    Type: Application
    Filed: November 4, 2013
    Publication date: September 8, 2016
    Inventors: John A. Naumovitz, Hongyu Chen, Yan Huang, Ada Yu Zhang, Zhi Xu
  • Patent number: 9362436
    Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: June 7, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Rajen M. Patel, Morgan M. Hughes, Frank J. Cerk
  • Publication number: 20160149063
    Abstract: A backsheet or frontsheet having an outer layer with a melting temperature greater than or equal to 150° C. includes at least one surface comprising a surface modification to improve adhesion between the backsheet or frontsheet and an encapsulant. The adhesion of the backsheet or frontsheet and encapsulant, after lamination, is at least 20 N/cm, preferably at least 40 N/cm or no adhesion failure. More preferably, the adhesion is at least 20 N/cm, even more preferably 40 N/cm or no adhesion failure, before and after 1,000 hours, preferably 2,000 hours, of damp heat aging at 85° C. and 85% humidity.
    Type: Application
    Filed: June 13, 2014
    Publication date: May 26, 2016
    Inventors: Huiqing Zhang, Aude Pochon, John A. Naumovitz, Rudolf J. Koopmans, Ray E. Drumright
  • Patent number: 9169340
    Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: October 27, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Rajen M. Patel, Shaofu Wu, Mark T. Bernius, Mohamed Esseghir, Robert L. McGee, Michael H. Mazor, John A. Naumovitz
  • Publication number: 20150013753
    Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).
    Type: Application
    Filed: February 1, 2013
    Publication date: January 15, 2015
    Inventors: Kumar Nanjundiah, John A. Naumovitz, Rajen M. Patel, Morgan M. Hughes, Frank J. Cerk
  • Publication number: 20140174509
    Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.
    Type: Application
    Filed: June 28, 2012
    Publication date: June 26, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius