Publication number: 20150003009
Abstract: Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack.
Type:
Application
Filed:
March 12, 2012
Publication date:
January 1, 2015
Applicant:
Hewlett-Packard Development Company, L.P.
Inventors:
David A. Moore, Michael L. Sabotta, John P. Franz, Tahir Cader