Abstract: File systems which provide several different and improved locking capabilities. An application on a client workstation communicates through a client driver to a server which interfaces with a metadata database, which contains locking information about the files. Applications perform as normal. The client driver provides lock and unlock requests to the server when a write lock or a read with intent to write lock is required. If only a read lock is considered appropriate, the client driver does not provide a lock request. The server transparently performs read operations and read locking using the metadata database without specific requests from the client driver. When a read with intent to write or write lock is required, the lock ownership is placed with a given expiration time. When the time expires the lock is not automatically released but remains with the particular requesting client driver until another client driver requests it.

Abstract: File systems which provide several different and improved locking capabilities. An application on a client workstation communicates through a client driver to a server which interfaces with a metadata database, which contains locking information about the files. Applications perform as normal. The client driver provides lock and unlock requests to the server when a write lock or a read with intent to write lock is required. If only a read lock is considered appropriate, the client driver does not provide a lock request. The server transparently performs read operations and read locking using the metadata database without specific requests from the client driver. When a read with intent to write or write lock is required, the lock ownership is placed with a given expiration time. When the time expires the lock is not automatically released but remains with the particular requesting client driver until another client driver requests it.

Abstract: A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.

Abstract: The acid copper sulfate solutions used for electroplating copper circuitry in trenches and vias in IC dielectric material in the Damascene process are replaced with a type of plating system based on the use of highly complexing anions (e.g., pyrophosphate, cyanide, sulfamate, etc.) to provide an inherently high overvoltage that effectively suppresses runaway copper deposition. Such systems, requiring only one easily-controlled organic additive species to provide outstanding leveling, are more efficacous for bottom-up filling of Damascene trenches and vias than acid copper sulfate baths, which require a minimum of two organic additive species. The highly complexed baths produce fine-grained copper deposits that are typically much harder than large-grained acid sulfate copper deposits, and which exhibit stable mechanical properties that do not change with time, thereby minimizing “dishing” and giving more consistent CMP results.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.

Abstract: A direct displacement plating process provides a uniform, adherent coating of a relatively stable metal (e.g., nickel) on a highly reactive metal (e.g., aluminum) that is normally covered with a recalcitrant oxide layer. The displacement reaction proceeds, preferably in a nonaqueous solvent, as the oxide layer is dissolved by a fluoride activator. Halide anions are used to provide high solubility, to serve as an anhydrous source of stable metal ions, and to control the rate of the displacement reaction. A low concentration of activator species and little or no solution agitation are used to cause depletion of the activator species within pores in the surface oxide so that attack of the reactive metal substrate is minimized. Used in conjunction with electroless nickel deposition to thicken the displacement coating, this process can be used to render aluminum pads on IC chips solderable without the need for expensive masks and vacuum deposition operations.

Abstract: Electrochemical surface analysis using a deoxygenated gel electrolyte provides advantages over a liquid electrolyte in processes such as sequential electrochemical reduction analysis. In sequential electrochemical reduction analysis, a solderable portion of an electronic component or circuit board to be tested is placed in contact with a deoxygenated gel electrolyte such as a borate buffer solution having a gelling agent. The gel electrolyte prevents capillary attraction up or along a lead of the component so that the power source cathode lead does not contact the electrolyte and electrochemical analysis can be localized to the area of interest, such as the portion of the component lead to be soldered. Interfering effects of atmospheric oxygen are minimized for deaerated gel electrolytes because convection mixing is practically absent and diffusion is generally a very slow process in a gel.

Abstract: A low pressure radial ply tire (20) for light off-the-road use has tow radial carcass plies (22) oriented at a cord angle (CA) with respect to the Equatorial Plane (EP) from 65 to 85.degree.. The tire is not reinforced by a belt reinforcing structure to allow the carcass (22) to compensate within the footprint of the tire under varying conditions. The tread (26) is provided with a number of holes (38) having a very shallow depth and spaced uniformly across the tread surface to increase flotation and wherein the net-to-gross is in the range of 0.63 to 0.77.

Abstract: An annular, variable geometry combustor is provided with an actuation system operable to inversely vary air inflow to the combustor liner through axially spaced inlet openings formed therein.

Abstract: A band of material is formed by plating the material onto a cylindrical cathode sandwiched between a pair of insulating end pieces and is supported in a plating bath spaced a short distance from an anode. The cathode is rotated about its axis to provide uniform, reproducible mass transport to the plating surface. In order to determine the tensile properties of the plated material, the band is removed from the cathode and pulled apart in a tensile machine. During tensile testing, the band is held using a pair of pins and clevis, or it is formed into a strip and gripped in a standard fixture. In order to determine the stress condition of the plated material, the band is cut open and its change in diameter measured.

Abstract: A hemicylindrical crystal is used in a variable frequency multi-orifice ink jet modulator. Unwanted resonant frequencies are damped providing the capability of wide band operation. A phase control is used with the modulator to control printing operations.

Abstract: Disk cutting apparatus embodying a pair of detachable clamping elements having flat surfaces facing each other for clamping a stack of sheets of material therebetween from which the disks are cut. At least one opening is provided through a clamping element and is of a size corresponding to the size of the disk to be cut. A cutter extends through the opening and has inner and outer cylindrical surfaces with the outer surface being of a size corresponding to the size of the opening. The inner surface at one end of the cutter is beveled to provide an outwardly flaring annular surface which terminates in an annular cutting edge.

Abstract: A modulator for ink jet printers is provided for operation over a wide bandwidth of high frequency drop rates. The longitudinal dimensions of each part of the modulator are made small compared to the wavelength of the shortest standing longitudinal acoustic wave that may be produced in a structure of the same material as the part in question. A piezoelectric crystal is seated within a mount acoustically decoupled at the edges therof. An electrode is axially aligned with the crystal and placed in contact with the crystal. A short hollow cylinder forms an ink chamber axially aligned with the crystal. The end of the ink chamber opposite the crystal is closed by a front plate having a nozzle axially located therein.Plural nozzles may be utilized to produce parallel ink streams which break into droplets at substantially the same time and at a near uniform distance from the nozzles.

Abstract: A valve system for selective control of flow of fluids from plural sources to a common conduit. Plural valves, are aligned along the conduit at different distances from a system axis. A cam array serves to selectively force the valves against a diaphragm to close off ports leading to the conduit upon rotation about the system axis.The invention is particularly suitable for use with a pressurized ink reservoir connected to one port, an ink solvent to a second port, and a drying gas to a third port. The valve system then may be rotated sequentially for initiating an ink operation, cleansing with the ink solvent, and drying with the gas without necessitating a disassembly of the system.