Patents by Inventor John W. Cassen
John W. Cassen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6278400Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.Type: GrantFiled: November 29, 1999Date of Patent: August 21, 2001Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Edward L. Rich, III, Gary N. Bonadies, John S. Fisher, John W. Gipprich, John D. Gornto, Daniel J. Heffernan, David A. Herlihy, Scott C. Tolle, Patrick K. Richard, David W. Strack, Scott K. Suko, Timothy L. Eder, Chad E. Wilson, Gary L. Ferrell, Stephanie A. Parks
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Patent number: 6114986Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.Type: GrantFiled: September 23, 1998Date of Patent: September 5, 2000Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Stephanie A. Parks, Edward L. Rich, III, Gary N. Bonadies, Gary L. Ferrell, John S. Fisher, John W. Gipprich, John D. Gornto, Daniel J. Heffernan, David A. Herlihy, Andrew J. Piloto, Patrick K. Richard, David W. Strack, Scott K. Suko
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Patent number: 6097335Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.Type: GrantFiled: December 8, 1999Date of Patent: August 1, 2000Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Stephanie A. Parks, Edward L. Rich, III, Gary N. Bonadies, Gary L. Ferrell, John S. Fisher, John W. Gipprich, John D. Gornto, Daniel J. Heffernan, David A. Herlihy, Patrick K. Richard, David W. Strack, Scott K. Suko
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Patent number: 6094161Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.Type: GrantFiled: December 8, 1999Date of Patent: July 25, 2000Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Stephanie A. Parks, Edward L. Rich, III, Gary N. Bonadies, Gary L. Ferrell, John S. Fisher, John W. Gipprich, John D. Gornto, Daniel J. Heffernan, David A. Herlihy, Andrew J. Piloto, Patrick K. Richard, David W. Strack, Scott K. Suko
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Patent number: 6034633Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.Type: GrantFiled: September 23, 1998Date of Patent: March 7, 2000Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Stephanie A. Parks, Edward L. Rich, III, Gary N. Bonadies, Gary L. Ferrell, John S. Fisher, John W. Gipprich, John D. Gornto, Daniel J. Heffernan, David A. Herlihy, Patrick K. Richard, David W. Strack, Scott K. Suko
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Patent number: 6005531Abstract: An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connectedType: GrantFiled: September 23, 1998Date of Patent: December 21, 1999Assignee: Northrop Grumman CorporationInventors: John W. Cassen, Gary N. Bonadies, Patrick K. Richard, David A. Herlihy, Ayn U. Fuller, Daniel H. Wenzlick, Richard C. Kapraun, Mark R. Schrote, Kerry M. Yon, H. Halley Lisle, IV, Toby Hess, Edward L. Rich, III, George T. Hall, Brian T. Drude
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Patent number: 5175560Abstract: A planar dielectric substrate supports a stripline conductor therein. A conductive housing has one or more recesses for receiving a dielectric and a conductive cover is mountable over the dielectric in contact with the housing to enclose the dielectric and isolate the stripline from adjacent structures. The housing and cover have aligned slots disposed on opposite sides of the dielectric and transverse to the stripline for providing coupling of signals between the stripline and the slot. An aperture is formed in the housing in communication with the slot.Other embodiments of the invention include impedance matching means for either or both of the stripline and the aperture for optimizing the efficiency measured in terms of VSWR of the radiator.Type: GrantFiled: March 25, 1991Date of Patent: December 29, 1992Assignee: Westinghouse Electric Corp.Inventors: Eric W. Lucas, Michael A. Mongilio, Kenneth M. Leader, Charles P. Stieneke, John W. Cassen
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Patent number: 4547776Abstract: Loop radiating elements for microwave frequencies which result in balanced ower division at the feed points and equi-phase currents in the radiating segments are in the form of an Alford loop design having a "kink" in the stripline path on the side of a printed circuit board opposite the cross-over to restore equal path lengths on both sides of a central feed terminal. Alternatively, the radiating segments of a loop may be in the form of end-loaded bent dipoles which are dual-fed on diametrically opposite points of the loop with equi-phase and amplitude signal. The result is loop radiating elements which have an axial null with a symmetrical doughnut radiating pattern.Type: GrantFiled: November 3, 1983Date of Patent: October 15, 1985Assignee: The United States of America as represented by the Secretary of the NavyInventors: Conway A. Bolt, Jr., John W. Cassen, Helmut E. Schrank