Patents by Inventor John W. Osenbach
John W. Osenbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12218031Abstract: Systems and methods of providing a bare circuit integrated circuit package with a containment ring are described. The bare circuit integrated circuit package may be provided with a substrate connected to a printed circuit board. An integrated circuit may be connected to the substrate. A stiffener ring that surrounds the integrated circuit may be attached to the substrate. A heat sink may be positioned on the stiffener ring and over the integrated circuit such that there is a space between a top of the integrated circuit and a bottom surface of the heat sink. A thermal interface material may be provided to thermally connect the integrated circuit and the heat sink. A containment ring may be positioned between the stiffener ring and the integrated circuit, the containment ring sized and positioned to prevent pumping and/or displacement of the thermal interface material.Type: GrantFiled: January 4, 2022Date of Patent: February 4, 2025Assignee: Infinera CorporationInventors: John W. Osenbach, Gannon Reichert, Vinh Nguyen
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Publication number: 20240282722Abstract: Consistent with an aspect of the present disclosure, a flexible electrical interconnect connects a transmit receive optical subassembly (TROSA) with an integrated circuit package via a transmission line provided on a surface of a substrate upon which the integrated circuit is provided. Alternatively, the transmission line is embedded in the substrate. Mechanisms are provided to mechanically balance temperature induced stresses within the substrate and keep the substrate substantially planar and thus minimize damage to the integrated circuit and/or the electrical connections thereto.Type: ApplicationFiled: February 21, 2023Publication date: August 22, 2024Applicant: Infinera CorporationInventors: John W. Osenbach, Jiaming Zhang, Li Li, Thomas Gregorich
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Publication number: 20220238449Abstract: Disclosed herein are multi-layer substrates for integrated circuit packages and methods of making the same. The multi-layer substrate may comprise a plurality of lower layers, at least one core layer, a plurality of upper layers, and a side surface. A first connection and a second connection may extend through or on an uppermost layer of the plurality of upper layers. A trace may be embedded in or on one of the plurality of upper layers, the trace electrically connected to the first connection and the second connection. A first mounting pad and a second mounting pad may be positioned on the side surface and/or the uppermost layer of the plurality of upper layers and a blocking capacitor may be electrically connected to the first mounting pad and the second mounting pad with the second mounting pad electrically connected to the second connection.Type: ApplicationFiled: January 25, 2022Publication date: July 28, 2022Inventors: John W. Osenbach, Jiaming Zhang
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Publication number: 20220216127Abstract: Systems and methods of providing a bare circuit integrated circuit package with a containment ring are described. The bare circuit integrated circuit package may be provided with a substrate connected to a printed circuit board. An integrated circuit may be connected to the substrate. A stiffener ring that surrounds the integrated circuit may be attached to the substrate. A heat sink may be positioned on the stiffener ring and over the integrated circuit such that there is a space between a top of the integrated circuit and a bottom surface of the heat sink. A thermal interface material may be provided to thermally connect the integrated circuit and the heat sink. A containment ring may be positioned between the stiffener ring and the integrated circuit, the containment ring sized and positioned to prevent pumping and/or displacement of the thermal interface material.Type: ApplicationFiled: January 4, 2022Publication date: July 7, 2022Inventors: John W. Osenbach, Gannon Reichert, Vinh Nguyen
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Patent number: 10962296Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.Type: GrantFiled: January 7, 2019Date of Patent: March 30, 2021Assignee: Infinera CorporationInventors: John W. Osenbach, Jie Tang, S. Eugene Messenger, John Coronati
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Patent number: 10741999Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 9, 2018Date of Patent: August 11, 2020Assignee: Infinera CoroprationInventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Publication number: 20190341359Abstract: Consistent with the present disclosure, the back side of a chip is attached to a lid structure. Legs are attached or integrated monolithically to the lid such that the legs are provided in and around the periphery of the lid and are designed in such a way as to not interfere with the optical output/input (facet) of the PIC, for example, by not putting the leg or a portion of the leg in front of the optical output/input region of the PIGC. Since the lid, to which the chip is attached, is secured to the substrate, the electrical connections between the chip and the substrate are also subject to little, if any, mechanical stress, thereby obviating the need for the underfill. Accordingly, electrical traces on the chip and the substrate do not contact a high dielectric constant material, and, as a result, impedance and loss may be reduced.Type: ApplicationFiled: March 11, 2019Publication date: November 7, 2019Inventors: Jie Tang, Jiaming Zhang, Timothy Butrie, John W. Osenbach, Fred Kish, JR.
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Publication number: 20190339468Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.Type: ApplicationFiled: May 7, 2018Publication date: November 7, 2019Applicant: Infinera CorporationInventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Pleumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
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Publication number: 20190342009Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.Type: ApplicationFiled: May 7, 2018Publication date: November 7, 2019Applicant: Infinera CorporationInventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Ploumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
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Publication number: 20190342010Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.Type: ApplicationFiled: May 7, 2018Publication date: November 7, 2019Applicant: Infinera CorporationInventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Pleumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
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Patent number: 10290619Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.Type: GrantFiled: January 4, 2017Date of Patent: May 14, 2019Assignee: Infinera CorporationInventors: Peter W. Evans, John W. Osenbach, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti
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Publication number: 20190137186Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.Type: ApplicationFiled: January 7, 2019Publication date: May 9, 2019Inventors: John W. Osenbach, Jie Tang, S. Eugene Messenger, John Coronati
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Patent number: 10205301Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 9, 2018Date of Patent: February 12, 2019Assignee: Infinera CorporationInventors: Peter W Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Patent number: 10181698Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 9, 2018Date of Patent: January 15, 2019Assignee: Infinera CorporationInventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Patent number: 10181697Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 9, 2018Date of Patent: January 15, 2019Assignee: Infinera CorporationInventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Patent number: 10177531Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 9, 2018Date of Patent: January 8, 2019Assignee: Infinera CorporationInventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Patent number: 10175005Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.Type: GrantFiled: March 30, 2015Date of Patent: January 8, 2019Assignee: Infinera CorporationInventors: John W. Osenbach, Jie Tang, S. Eugene Messenger, John Coronati
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Publication number: 20180331498Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: ApplicationFiled: January 9, 2018Publication date: November 15, 2018Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Publication number: 20180331497Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: ApplicationFiled: January 9, 2018Publication date: November 15, 2018Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
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Patent number: 10122149Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.Type: GrantFiled: January 4, 2017Date of Patent: November 6, 2018Assignee: Infinera CorporationInventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan