Patents by Inventor John W. Osenbach

John W. Osenbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10741999
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: August 11, 2020
    Assignee: Infinera Coropration
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Publication number: 20190341359
    Abstract: Consistent with the present disclosure, the back side of a chip is attached to a lid structure. Legs are attached or integrated monolithically to the lid such that the legs are provided in and around the periphery of the lid and are designed in such a way as to not interfere with the optical output/input (facet) of the PIC, for example, by not putting the leg or a portion of the leg in front of the optical output/input region of the PIGC. Since the lid, to which the chip is attached, is secured to the substrate, the electrical connections between the chip and the substrate are also subject to little, if any, mechanical stress, thereby obviating the need for the underfill. Accordingly, electrical traces on the chip and the substrate do not contact a high dielectric constant material, and, as a result, impedance and loss may be reduced.
    Type: Application
    Filed: March 11, 2019
    Publication date: November 7, 2019
    Inventors: Jie Tang, Jiaming Zhang, Timothy Butrie, John W. Osenbach, Fred Kish, JR.
  • Publication number: 20190339468
    Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Applicant: Infinera Corporation
    Inventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Pleumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
  • Publication number: 20190342009
    Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Applicant: Infinera Corporation
    Inventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Ploumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
  • Publication number: 20190342010
    Abstract: Consistent with the present disclosure, one or more spare Widely Tunable Lasers (WTLs) are integrated on a PIC. In the event that a channel, including, for example, a laser, a modulator and a semiconductor optical amplifier in a transmitter or Tx PIC, or a laser, optical hybrid, and photodiodes, for example, in a receiver PIC (Rx PIC), includes one or more defective devices, a spare channel is selected that includes a widely tunable laser (WTL) which may be tuned to the wavelength associated with any of the channels on the PIC. Accordingly, the spare channel replaces the defective channel or the lowest performing channel and outputs modulated optical signals at the wavelength associated with the defective channel. Thus, even though a defective channel may be present, a die consistent with the present disclosure may still output or receive the desired channels because the spare channel replaces the defective channel.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Applicant: Infinera Corporation
    Inventors: Peter W. Evans, Fred A. Kish, JR., Vikrant Lal, Jacco Pleumeekers, Timothy Butrie, David G. Coult, John W. Osenbach, Jie Tang, Jiaming Zhang
  • Patent number: 10290619
    Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: May 14, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, John W. Osenbach, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti
  • Publication number: 20190137186
    Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: John W. Osenbach, Jie Tang, S. Eugene Messenger, John Coronati
  • Patent number: 10205301
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: February 12, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Patent number: 10181698
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: January 15, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Patent number: 10181697
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: January 15, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Patent number: 10175005
    Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: January 8, 2019
    Assignee: Infinera Corporation
    Inventors: John W. Osenbach, Jie Tang, S. Eugene Messenger, John Coronati
  • Patent number: 10177531
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: January 8, 2019
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Publication number: 20180331498
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Application
    Filed: January 9, 2018
    Publication date: November 15, 2018
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Publication number: 20180331497
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Application
    Filed: January 9, 2018
    Publication date: November 15, 2018
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Patent number: 10122149
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: November 6, 2018
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, Jr., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Patent number: 10037982
    Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: July 31, 2018
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, John W. Osenbach, Fred A. Kish, Jr., Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti
  • Patent number: 10026723
    Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: July 17, 2018
    Assignee: Infinera Corporation
    Inventors: Peter W. Evans, John W. Osenbach, Fred A. Kish, Jiaming Zhang, Miguel Iglesias Olmedo, Maria Anagnosti
  • Publication number: 20180131159
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 10, 2018
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Publication number: 20180131157
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 10, 2018
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan
  • Publication number: 20180131158
    Abstract: Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 10, 2018
    Inventors: Peter W. Evans, Mingzhi Lu, Fred A. Kish, JR., Vikrant Lal, Scott Corzine, John W. Osenbach, Jin Yan