Patents by Inventor Jon Zuo

Jon Zuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030015789
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Application
    Filed: September 12, 2002
    Publication date: January 23, 2003
    Inventors: Jon Zuo, Donald M. Ernst
  • Publication number: 20030010477
    Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.
    Type: Application
    Filed: July 10, 2001
    Publication date: January 16, 2003
    Inventors: Dmitry Khrustalev, Jon Zuo
  • Publication number: 20020139516
    Abstract: A heat pipe has a sealed envelope. A primary wick extends along an inside surface of the envelope. A working fluid is contained within the envelope. The fluid is capable of undergoing a liquid/vapor phase change. An evaporator section is defined within the envelope for vaporizing the fluid. The evaporator section has at least one high heat flux area that is capable of being thermally coupled to an external heat source to be cooled by the heat pipe. A secondary wick is formed of mesh screens or sintered metal powders. The secondary wick is connected to the primary wick in the high heat flux area and connected to the primary wick at a location approximately opposite the high heat flux area, for transporting subcooled liquid to the high heat flux area. A condenser section is defined within the envelope for condensing the vaporized fluid.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 3, 2002
    Inventor: Jon Zuo
  • Patent number: 6437437
    Abstract: A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: August 20, 2002
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Scott D. Garner
  • Publication number: 20020100288
    Abstract: The present invention relates to a miniature metal hydride thermal storage apparatus for the cooling of devices to subambient temperatures, the apparatus composed of at least two chambers containing distinct metal hydrides.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 1, 2002
    Inventor: Jon Zuo
  • Publication number: 20020100968
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Jon Zuo, Donald M. Ernst
  • Patent number: 6408941
    Abstract: A heat-exchanger is provided that comprises a fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs defining spaced fin walls having peripheral end edges wherein each of the fin walls has a thickness of about 0.020 inches of its length. The heat-exchanger may include at least one air-barrier plate fastened to the flat ridges on a first side of the fin core and a liquid-barrier plate fastened to the flat ridges on a second side of the fin core. A pair of end caps are sealingly fastened to and cover the peripheral end edges of the fin core so as to form a plurality of input and exit openings that communicate with the troughs. The fin wall thickness of about 0.002 inches to about 0.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 25, 2002
    Assignee: Thermal Corp.
    Inventor: Jon Zuo
  • Patent number: 6388882
    Abstract: The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic components and subsystems, in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: May 14, 2002
    Assignee: Thermal Corp.
    Inventors: L. Ronald Hoover, Jon Zuo, A. L. Phillips