Patents by Inventor Jonathan J. Fain

Jonathan J. Fain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics package with improved thermal performance
    Patent number: 10840165
    Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: November 17, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Jonathan J. Fain, Mark C. Woods
  • ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE
    Publication number: 20190252287
    Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Inventors: Jonathan J. Fain, Mark C. Woods
  • Electronics package with improved thermal performance
    Patent number: 10325828
    Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: June 18, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Jonathan J. Fain, Mark C. Woods
  • ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE
    Publication number: 20170287807
    Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Inventors: Jonathan J. Fain, Mark C. Woods