Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.

Abstract: A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: Systems, device and methods are provided for measuring parameters of a medium such as the dielectric properties of a medium including a plurality of layers, using an array of sensors. The array includes at least two transducers and at least one transceiver attached to the at least two transducers, the at least one transceiver being configured to transmit at least one signal toward the medium and receive a plurality of signals affected by the medium; a data acquisition unit and at least one processor unit, configured to: process the affected plurality of signals to yield a plurality of transfer functions wherein each of the plurality of transfer functions including the medium response between two transducers of the at least two transducers as function of frequency or time; process the plurality of transfer functions to yield a plurality of statistical measures, and process the statistical measures to calculate the medium parameters.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: Systems of multiple transmitters and multiple receivers, allowing receivers to identify the transmitters from which reference signals originate. Identification is according to frequency offset patterns based on transmitter and local oscillator frequencies, and is particularly suitable in radio-frequency integrated-circuit devices and MIMO radar systems. Also disclosed are variations of passive reference signal distribution cavities for efficient, cost-effective distribution of reference signals in multi-module systems.

Abstract: A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio- frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.

Abstract: Systems of multiple transmitters and multiple receivers, allowing receivers to identify the transmitters from which reference signals originate. Identification is according to frequency offset patterns based on transmitter and local oscillator frequencies, and is particularly suitable in radio-frequency integrated-circuit devices and MIMO radar systems.

Abstract: A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.

Abstract: Systems, device and methods are provided for calibrating an antenna array comprising a plurality of antennas such as a plurality of transmit and receive antennas by utilizing an arena comprising one or more targets and a medium.

Abstract: Systems, device and methods are provided for measuring parameters of a medium such as the dielectric properties of a medium including a plurality of layers, using an array of sensors. The array includes at least two transducers and at least one transceiver attached to the at least two transducers, the at least one transceiver being configured to transmit at least one signal toward the medium and receive a plurality of signals affected by the medium; a data acquisition unit and at least one processor unit, configured to: process the affected plurality of signals to yield a plurality of transfer functions wherein each of the plurality of transfer functions including the medium response between two transducers of the at least two transducers as function of frequency or time; process the plurality of transfer functions to yield a plurality of statistical measures, and process the statistical measures to calculate the medium parameters.

Abstract: A system and methods for RF (Radio Frequency) penetration imaging of one or more objects in a medium, the system including a generation and reception subsystem configured to generate and receive a plurality of RF signals, an RF antenna array including a plurality of antennas, the antennas being configured to transmit the RF signals towards the medium and receive a plurality of RF signals reflected from the medium, a data acquisition subsystem configured to receive and store the reflected RF signals, and a processor configured to estimate the distance between the surface of the target medium and the antenna array, the delay between the transmitted signals and the plurality of signals reflected from the object using a dedicated frequency sub-band of the received signals, the location of the antennas at each transmitting time, and determine whether there is an object within the medium.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: Systems of multiple transmitters and multiple receivers, allowing receivers to identify the transmitters from which reference signals originate. Identification is according to frequency offset patterns based on transmitter and local oscillator frequencies, and is particularly suitable in radio-frequency integrated-circuit devices and MIMO radar systems.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: Systems, device and methods are provided for measuring parameters of a medium such as the dielectric properties of a medium including a plurality of layers, using an array of sensors. The array includes at least two transducers and at least one transceiver attached to the at least two transducers, the at least one transceiver being configured to transmit at least one signal toward the medium and receive a plurality of signals affected by the medium; a data acquisition unit and at least one processor unit, configured to: process the affected plurality of signals to yield a plurality of transfer functions wherein each of the plurality of transfer functions including the medium response between two transducers of the at least two transducers as function of frequency or time; process the plurality of transfer functions to yield a plurality of statistical measures, and process the statistical measures to calculate the medium parameters.

Abstract: A system and methods for RF (Radio Frequency) penetration imaging of one or more objects in a medium, the system including a generation and reception subsystem configured to generate and receive a plurality of RF signals, an RF antenna array including a plurality of antennas, the antennas being configured to transmit the RF signals towards the medium and receive a plurality of RF signals reflected from the medium, a data acquisition subsystem configured to receive and store the reflected RF signals, and a processor configured to estimate the distance between the surface of the target medium and the antenna array, the delay between the transmitted signals and the plurality of signals reflected from the object using a dedicated frequency sub-band of the received signals, the location of the antennas at each transmitting time, and determine whether there is an object within the medium.