Patents by Inventor Jong-Gyoon Kim

Jong-Gyoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7488235
    Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: February 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
  • Publication number: 20060189259
    Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.
    Type: Application
    Filed: May 3, 2006
    Publication date: August 24, 2006
    Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
  • Patent number: 7066785
    Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: June 27, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han
  • Publication number: 20040137829
    Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.
    Type: Application
    Filed: November 17, 2003
    Publication date: July 15, 2004
    Inventors: Moo-Yong Park, Sang-Rok Hah, Jong-Gyoon Kim, Hong-Seong Son, Ja-Hyung Han