Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.

Abstract: A chalcogenide material may include germanium (Ge), arsenic (As), selenium (Se) and from 0.5 to 10 at % of at least one group 13 element. A variable resistance memory device may include a first electrode, a second electrode, and a chalcogenide film interposed between the first electrode and the second electrode and including from 0.5 to 10 at % of at least one group 13 element. In addition, an electronic device may include a semiconductor memory. The semiconductor memory may include a column line, a row line intersecting the column line, and a memory cell positioned between the column line and the row line, wherein the memory cell comprises a chalcogenide film including germanium (Ge), arsenic (As), selenium (Se), and from 0.5 to 10 at % of at least one group 13 element.

Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes, and external electrodes, wherein the body has first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A length of a portion of the plurality of internal electrodes in the third direction in an intermediate region of the body in the first direction is greater than a length of the first surface or the second surface of the body in the third direction. The plurality of internal electrodes have a bottleneck structure between the intermediate region and at least one of the first and second surfaces, and wherein the bottleneck structure has a shape recessed into an inner portion of the body.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness T1 of the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 ?m or more and 30 ?m or less, a thickness T2 of the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 ?m or more and 15 ?m or less, and a thickness T3 of the electrode layer corresponding to a corner portion of the ceramic body is 0.1 ?m or more and 10 ?m or less.

Abstract: A dielectric composition and a multilayer capacitor including the same are disclosed. The dielectric composition including: a BaTiO3-based main ingredient; a first auxiliary ingredient including rare earth elements; and a second auxiliary ingredient including at least one of Ba and Ca but essentially including Ba, wherein the rare earth elements include Tb and Dy, and the first auxiliary ingredient and the second auxiliary ingredient satisfy a molar content condition of 0.40<(Tb/T_RE)*(Ba+Ca)<0.93, where T_RE is a total molar content of the rare earth elements in the first auxiliary ingredient.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and including a first conductive metal and external electrodes disposed on an external surface of the body and including a second conductive metal, wherein the ratio of internal electrodes including an alloy region of the first and second conductive metals to the plurality of internal electrodes is 40 to 80%.

Abstract: A multilayer capacitor is provided. The multilayer capacitor includes a body and an external electrode disposed outside the body, wherein the body includes an active portion including a plurality of dielectric layers and a plurality of internal electrodes stacked with dielectric layers interposed therebetween, and a side margin portion covering at least one side surface of side surfaces to which the internal electrodes are exposed in the laminate, wherein the side margin portion includes a dielectric including a BaTiO3-based main component, a first subcomponent including a rare earth element, and a second subcomponent including Zr, wherein, based on a molar content per 100 moles of the main component, when a molar content of the rare earth element is RE, a molar content of Zr and RE satisfies 0.20?Zr/RE?0.37.

Abstract: A dielectric composition and a multilayer capacitor including the same are disclosed. The dielectric composition including a BaTiO3-based main ingredient, and an auxiliary ingredient including rare earth elements, wherein the rare earth elements include Dy and Eu, Dy and Eu molar contents based on 100 moles of the BaTiO3-based main ingredient satisfy conditions of 0.10<Eu/(Dy+Eu)?0.50 and 0.60?Dy+Eu?1.0, and the rare earth elements do not include another element in a higher molar content than Dy and Eu.

Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.

Abstract: A camera module includes a lens unit including one or more lenses disposed in an optical axis direction; an image sensor on which light passing through the lens unit is incident; a first module including a first driving unit configured to move the lens unit in the optical axis direction; and a second module including a second driving unit configured to move the image sensor in a direction perpendicular to the optical axis direction, wherein the first module further includes a lens holder supporting the lens unit and at least partially overlapping the second module in a first direction perpendicular to the optical axis direction; and a housing in which the lens holder is disposed.

Abstract: An optical image stabilization actuator includes a fixed frame having an internal space, a moving frame accommodated in the fixed frame and being movable relative to the fixed frame, a first ball member disposed between the fixed frame and the moving frame, a first driving unit including a plurality of magnets disposed in the fixed frame and a plurality of coils disposed in the moving frame and moved together with the moving frame, a sensor substrate partially coupled to the moving frame to move together with the moving frame, a plurality of yokes disposed in the moving frame and generating attractive force with respect to the plurality of magnets, and an image sensor disposed in a portion of the sensor substrate.

Abstract: A camera module includes a lens module including at least one lens; a housing in which the lens module is disposed; a magnet disposed on the lens module; a coil facing the magnet; a first yoke member fixed to the housing; and first and second ball units disposed between the lens module and the housing, spaced apart from each other in a first direction perpendicular to an optical axis, and each including a plurality of balls disposed in a direction parallel to the optical axis, wherein the lens module includes a first extension protruding in the direction parallel to the optical axis, the housing includes a second extension protruding in the direction parallel to the optical axis and accommodating at least a portion of the first extension, and at least one ball among the balls included in the first and second ball units is disposed between the first and second extensions.

Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.