Abstract: A method of classifying a cerebrovascular branch in cerebrovascular image is disclosed, the method including receiving, by an analysis device, an cerebrovascular image of a subject; extracting, by the analysis device, a plurality of vascular unit structures from the cerebrovascular image based on geometric features of a 3D model; extracting, by the analysis device, feature values for each of the plurality of vascular unit structures; inputting, by the analysis device, the feature values of each of the plurality of vascular unit structures into a first learning model trained in advance, and classifying chunks to which each of the plurality of vascular unit structures belongs; and inputting, by the analysis device, the feature values of each of the vascular unit structures belonging to same chunk into a second learning model trained in advance, and classifying a vessel branch composed of the vascular unit structures belonging to the same chunk.

Abstract: A display device is provided. An embodiment of a display device includes a first substrate, a second substrate disposed on the first substrate, first and second partition walls disposed on the second substrate, the second partition wall being disposed outside the first partition wall, a first trench disposed inside the first partition wall and having a first width, a second trench disposed between the first and second partition walls and having a second width greater than the first width; an alignment key disposed to overlap the second trench; a first spacer disposed on the alignment key, and a sealing member disposed along an edge between the first substrate and the second substrate without overlapping the alignment key, wherein the first spacer partially overlaps the first partition wall, the second partition wall, and the sealing member.

Abstract: A method for fabricating a semiconductor device includes preparing a substrate including a first region and a second region, forming a lower alternating stack on the substrate; etching the lower alternating stack to form a lower opening in the second region, forming an upper alternating stack on the lower opening and the lower alternating stack to form recess portion caused by filling the lower opening in the second region, forming a mask layer on the upper alternating stack using the recess portion as an alignment key, and etching the upper alternating stack by using the mask layer as a barrier to form a pattern in the first region.

Abstract: A method of manufacturing a coupler for an air suspension includes: preparing a topping cord sheet and a rubber band; connecting the topping cord sheet and the rubber band to each other by attaching the rubber band to an outer circumferential surface of the topping cord sheet; and vulcanizing an intermediately formed body made by the connecting of the topping cord sheet and the rubber band to each other.

Abstract: A method of manufacturing a coupler for an air suspension includes: preparing a topping cord sheet and a rubber band; connecting the topping cord sheet and the rubber band to each other by attaching the rubber band to an outer circumferential surface of the topping cord sheet; and vulcanizing an intermediately formed body made by the connecting of the topping cord sheet and the rubber band to each other.

Abstract: Embodiments provide a light control member that includes a light control layer including quantum dots, a low refractive layer disposed on the light control layer, and a capping layer disposed between the light control layer and the low refractive layer. The capping layer includes a first silicon oxynitride containing an amount of nitrogen in a range of about 0.1 at % to about 18 at %, an amount of oxygen in a range of about 42 at % to about 70 at %, and an amount of silicon in a range of about 25 at % to about 45 at %. Accordingly, the light control member exhibits excellent reliability.

Abstract: A display device is provided. An embodiment of a display device includes a first substrate, a second substrate disposed on the first substrate, first and second partition walls disposed on the second substrate, the second partition wall being disposed outside the first partition wall, a first trench disposed inside the first partition wall and having a first width, a second trench disposed between the first and second partition walls and having a second width greater than the first width; an alignment key disposed to overlap the second trench; a first spacer disposed on the alignment key, and a sealing member disposed along an edge between the first substrate and the second substrate without overlapping the alignment key, wherein the first spacer partially overlaps the first partition wall, the second partition wall, and the sealing member.

Abstract: A display panel includes a light emitting element layer including a light emitting element that generates a first color light, a light control layer over the light emitting element layer, a color filter layer over the light control layer, and a low refractive index layer that is between the light control layer and the color filter layer and that has a thickness of about 0.2 ?m to about 2.5 ?m.

Abstract: A semiconductor package includes: semiconductor chips being offset-stacked to expose edge regions adjacent to first side surfaces; chip pads disposed in each of the edge regions of the semiconductor chips, the chip pads including a plurality of first chip pads arranged in a first column and a plurality of second chip pads arranged in a second column; a horizontal common interconnector having one end connected to the second chip pad of a semiconductor chip of the semiconductor chips, and another end connected to the first chip pad of another semiconductor chip; and a vertical common interconnector having one end connected to the second chip pad of the uppermost semiconductor chip, which is electrically connected to the first chip pad of the uppermost semiconductor chip connected to the horizontal common interconnector.

Abstract: A display device includes a display substrate including a display area, a non-display area adjacent to the display area, and light emitting elements disposed in the display area. The display device includes a light control substrate facing the display substrate and including a color filter layer, a light conversion layer, and a low refractive index layer disposed between the color filter layer and the light conversion layer. The color filter layer extends from the display area to the non-display area and includes a first surface facing the display substrate, and the first surface includes a step difference overlapping the non-display area.

Abstract: A semiconductor package includes a package substrate, a plurality of memory stacks, at least one processor chip and one or more heat dissipation structures. The memory stacks are disposed on the package substrate. The memory stacks are spaced apart from each other by a predetermined distance. The processor chip is disposed on the memory stacks to be partially overlapped with each of the memory stacks. The heat dissipation structure is disposed on the upper surfaces of the memory stacks.

Abstract: A display panel includes an upper display substrate, a lower display substrate, and a partition wall. The upper display substrate includes a display area and a non-display area adjacent to the display area. The display area includes pixel areas and a light blocking area adjacent to the pixel areas. The lower display substrate includes display elements configured to emit light having a first color and respectively overlapping the pixel areas. The partition wall includes a partition wall part overlapping the light blocking area and a reflection part disposed on the partition wall part. The upper display substrate includes a base substrate, a color filter layer disposed on the base substrate, and a light control layer disposed on the color filter layer. The light control layer is configured to control the light having the first color. The partition wall is disposed on the light control layer.

Abstract: The present invention relates to a composition or cell therapeutic agent for preventing or treating liver fibrosis, containing an exosome or exosome-derived ribonucleic acid. The exosome or ribonucleic acid derived therefrom, of the present invention, has effects of inhibiting activities of hepatic stellate cells and Kupffer cells and reducing the expression of ?-SMA and inhibits the progression of liver fibrosis by inhibiting the deposition of collagen, thereby being effectively usable as a cell therapeutic agent for the prevention or treatment of liver fibrosis.

Abstract: Example memory controllers are disclosed. An example memory controller may include a PHY module including a first PHY terminal connected to a plurality of pins of a device connector, a MAC module including a first MAC terminal that is enabled to form a first lane with the first PHY terminal, and a second MAC terminal that is disabled without being connected to the first PHY terminal, a switch controller configured to receive a signal of a host connector connected to the device connector from at least one of the plurality of pins and output a switch signal in response to the signal of the host connector, and a switch configured to disable the second MAC terminal and form the first lane by connecting the first PHY terminal to the first MAC terminal in response to the switch signal.

Abstract: A semiconductor package includes: semiconductor chips being offset-stacked to expose edge regions adjacent to first side surfaces; chip pads disposed in each of the edge regions of the semiconductor chips, the chip pads including a plurality of first chip pads arranged in a first column and a plurality of second chip pads arranged in a second column; a horizontal common interconnector having one end connected to the second chip pad of a semiconductor chip of the semiconductor chips, and another end connected to the first chip pad of another semiconductor chip; and a vertical common interconnector having one end connected to the second chip pad of the uppermost semiconductor chip, which is electrically connected to the first chip pad of the uppermost semiconductor chip connected to the horizontal common interconnector.

Abstract: The present invention provides a patch for attaching to teeth or a surrounding part of teeth, and the patch can be easily removed by tooth brushing alone.

Abstract: A color filter panel includes: a base substrate having a first pixel area, a second pixel area, and a light blocking area between the first pixel area and the second pixel area; a first color filter on the base substrate in the first pixel area; a second color filter on the base substrate in the second pixel area; a first photoluminescence pattern on the first color filter in the first pixel area and configured to convert a color of light; and a second photoluminescence pattern on the second color filter in the second pixel area and configured to convert a color of light. The second photoluminescence pattern partially overlaps the first photoluminescence pattern in the light blocking area.

Abstract: A system and a method for providing a gifting service between a first country and a second country can include a service server of a first country receives a gift-giving request from a buyer client of the first country; the service server of the first country provides a plurality of product lists for each brand to the buyer client of the first country; the service server of the first country receives a selection of a specific product from the plurality of product lists from the buyer client of the first country; the service server of the first country requests payment for the specific product to the buyer client of the first country; and upon completion of payment, the service server of the first country requests a gift-giving of the specific product to a service server of a second country.

Abstract: There are provided a semiconductor and a method of fabricating the same. The semiconductor device may include a second semiconductor substrate directly bonded to a first semiconductor substrate. The first semiconductor substrate may include a first through via with an end portion protruding through a first top surface, the first top surface being a top surface of a first semiconductor substrate body, a liner extending to partially expose a side surface of the end portion of the first through via, and a first diffusion barrier layer. The liner may include a third top surface that is positioned at a lower height than a second top surface, the second top surface being a top surface of the end portion of the first through via and substantially equal to the first top surface. Alternatively, the liner may include a third surface positioned at a height that is lower than the second top surface and higher than the first top surface.

Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.