Patents by Inventor JongPil Jeon

JongPil Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130323906
    Abstract: A method of manufacturing a thin-film bonded substrate used for semiconductor devices. The method includes the steps of epitaxially growing an epitaxial growth layer on a first substrate of a bulk crystal, cleaving the first substrate, thereby leaving a crystal thin film on the epitaxial growth layer, the crystal thin film being separated out of the first substrate, and bonding a second substrate to the crystal thin film, the chemical composition of the second substrate being different from the chemical composition of the first substrate. It is possible to preclude a conductive barrier layer of the related art, prevent a reflective layer from malfunctioning due to high-temperature processing, and essentially prevent cracks due to the difference in the coefficients of thermal expansion between heterogeneous materials that are bonded to each other.
    Type: Application
    Filed: May 28, 2013
    Publication date: December 5, 2013
    Applicant: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
    Inventors: Donghyun Kim, Dong-Woon Kim, Mikyoung Kim, MinJu Kim, A-Ra Kim, Hyunjoon Kim, Joong Won Shur, Kwang-Je Woo, Bohyun Lee, JongPil Jeon, Kyungsub Jung