Abstract: A phase-change random access memory (PRAM) device includes a PRAM cell array including a first sector and a second sector, a first global bit line coupled to a first local bit line of the first sector and a first local bit line of the second sector, and a first plurality of global bit line discharge units coupled to the first global bit line, the first plurality of global bit line discharge units configured to discharge the first global bit line in response to a first global discharge signal.

Abstract: A semiconductor device according to example embodiments may be configured so that, when a read command for performing a read operation is input while a write operation is performed, and when a memory bank accessed by a write address during the write operation is the same as a memory bank accessed by a read address during the read operation, the semiconductor device may suspend the write operation automatically or in response to an internal signal until the read operation is finished and performs the write operation after the read operation is finished.

Abstract: A non-volatile memory device is employed in which data values are determined by the polarities at both ends of a cell, The non-volatile memory device includes a first decoder which decodes a plurality of predetermined bit values of a row address into a first address and is disposed in a row direction of a memory cell array; a second decoder which decodes the other bit values of the row address into a second address and is disposed in a column direction of the memory cell array; and a driver which applies bias voltages to a word line which corresponds to the first address or the second address in accordance with the data values. By including first and second decoders and decoding a row address in two steps, a bi-directional RRAM according to the present invention can perform addressing at high speeds while reducing chip size.

Abstract: A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided.

Abstract: A nonvolatile memory device includes a stack-type memory cell array, a selection circuit and a read circuit. The memory cell array includes multiple memory cell layers and a reference cell layer, which are vertically laminated. Each of the memory cell layers includes multiple nonvolatile memory cells for storing data, and the reference cell layer includes multiple reference cells for storing reference data. The selection circuit selects a nonvolatile memory cell from the memory cell layers and at least one reference cell, corresponding to the selected nonvolatile memory cell, from the reference cell layer. The read circuit supplies a read bias to the selected nonvolatile memory cell and the selected reference cell corresponding to the selected nonvolatile memory cell, and reads data from the selected nonvolatile memory cell.

Abstract: A memory cell of a resistive semiconductor memory device, a resistive semiconductor memory device having a three-dimensional stack structure, and related methods are provided. The memory cell of a resistive semiconductor memory device includes a twin cell, wherein the twin cell stores data values representing one bit of data. The twin cell includes a main unit cell connected to a main bit line and a word line, and a sub unit cell connected to a sub bit line and the word line. Also, the main unit cell includes a first variable resistor and a first diode, and the sub unit cell includes a second variable resistor and a second diode.

Abstract: A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided.

Abstract: A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different.

Abstract: In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write buffer configured to store data being written into the non-volatile memory cell array, and a write address buffer configured to store a write address associated with each data stored in the write buffer. An output circuit is configured to selectively output one of data read from the non-volatile memory array and data from the write buffer. A by-pass control circuit is configured to control the output circuit based on whether an input read address matches a valid write address stored in the write address buffer. An invalidation unit is configured to invalidate an address stored in the write address buffer if the stored write address matches an input write address.

Abstract: A nonvolatile memory device includes multiple first bit lines extending in a first direction, multiple word lines formed on the first bit lines and extending in a second direction different from the first direction, and multiple second bit lines, formed on the word lines and extending in the first direction. The nonvoliative memory device also includes multiple twin memory cells, each of which includes a first memory cell coupled between a first bit line and a word line and a second memory cell coupled between the word line and a second bit line. The first and second memory cells store different data.

Abstract: A non-volatile memory device, in which data values are determined by polarities at cell terminals, includes a memory cell array. The memory cell array is divided into multiple sub cell arrays, each sub cell array including at least one input/output line and an X-decoder/driver. First input/output lines included in different sub cell arrays may be simultaneously activated and bias voltages may be applied to the activated first input/output lines in accordance with the data values. The non-volatile memory device may be a bi-directional resistive random access memory (RRAM).

Abstract: The phase change memory device includes a plurality of memory banks, a plurality of local conductor lines connected to the plurality of memory banks, at least one global conductor line connected to the plurality of local conductor lines, and at least one repair control circuit configured to selectively replace at least one of the at least one global conductor line with at least one redundant global conductor line and configured to selectively replace at least one of the plurality of local conductor lines with at least one redundant local conductor line.

Abstract: A semiconductor device according to example embodiments may be configured so that, when a read command for performing a read operation is input while a write operation is performed, and when a memory bank accessed by a write address during the write operation is the same as a memory bank accessed by a read address during the read operation, the semiconductor device may suspend the write operation automatically or in response to an internal signal until the read operation is finished and performs the write operation after the read operation is finished.

Abstract: A semiconductor memory device having an efficient core structure for multi-writing includes a data input/output line, a plurality of memory banks each comprising a plurality of memory cells, a first global bit line and a second global bit line which are shared by the plurality of memory banks, and a first write driver and a second write driver which are connected with the data input/output line and provide a program current to the plurality of memory banks through the first and second global bit lines, respectively. Each memory bank includes a first cell area connected with the first global bit line and a second cell area connected with the second global bit line.

Abstract: A PRAM and programming method are disclosed. The PRAM includes a memory cell array including a test cell, a write driver applying a program pulse and providing a program current to the memory cell array, a sense amplification and verification circuit reading data programmed in the memory cell array and performing a program verify operation on the data, and a program loop control unit storing program verification result for the test cell at each program loop during test operation and generating the program pulse according to the program verification result to control the start of the program loop during normal operation.

Abstract: Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using a first internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage.

Abstract: A phase-change random access memory (PRAM) device includes a PRAM cell array including a first sector and a second sector, a first global bit line coupled to a first local bit line of the first sector and a first local bit line of the second sector, and a first plurality of global bit line discharge units coupled to the first global bit line, the first plurality of global bit line discharge units configured to discharge the first global bit line in response to a first global discharge signal.

Abstract: A phase-change random access memory (PRAM) device includes a PRAM cell array having a first bank that includes first to mth sectors, where m is a positive integer of at least 2, and sense amplifiers disposed between an xth sector and an (x+1)th sector of the bank, where x is a positive integer less than m.

Abstract: A nonvolatile memory device includes multiple first bit lines extending in a first direction, multiple word lines formed on the first bit lines and extending in a second direction different from the first direction, and multiple second bit lines, formed on the word lines and extending in the first direction. The nonvoliative memory device also includes multiple twin memory cells, each of which includes a first memory cell coupled between a first bit line and a word line and a second memory cell coupled between the word line and a second bit line. The first and second memory cells store different data.

Abstract: Embodiments of the invention provide a multi-layer semiconductor memory device and a related error checking and correction (ECC) method. The multi-layer semiconductor memory device includes first and second memory cell array layers, wherein the first memory cell array layer stores first payload data. The multi-layer semiconductor memory device also includes an ECC engine selectively connected to the second memory cell array layer and configured to receive the first payload data, generate first parity data corresponding to the first payload data, and store the first parity data exclusively in the second memory cell array layer.