Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.

Abstract: The present invention relates to a printed circuit board, which includes a metal circuit layer electrically connected to an electronic component, a solder layer formed on an upper surface of the metal circuit layer, an intermetallic compound layer formed between the solder layer and the metal circuit layer, and a chunk portion formed in the intermetallic compound layer according to the thickness of the metal circuit layer, wherein the thickness of the metal circuit layer is 20 to 50 ?m, and a manufacturing method thereof.

Abstract: Disclosed herein is a printed circuit board having an insulating layer crack preventing port. The printed circuit board includes: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing ports formed at positions at which they are not affected by the respective circuit patterns of the insulating layer part and supporting the insulating layer part from external impact.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.

Abstract: The present invention discloses a method of manufacturing a multilayer PCB including: a panel preparation step of preparing a working panel on which a plurality of PCB units having a plurality of inner layer circuit pattern portions are arrayed; a defective portion removing step of removing a defective inner layer circuit pattern portion among the plurality of inner layer circuit pattern portions; a good portion providing step of providing a good inner layer circuit pattern portion in a portion of the working panel, from which the defective inner layer circuit pattern portion is removed; and an outer layer forming step of forming an outer layer circuit pattern portion in the PCB unit. The present invention is capable of improving productivity and reducing manufacturing costs by preventing product loss due to disposal of the PCB unit having the defective inner layer circuit pattern portion.