Abstract: Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.

Abstract: Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.

Abstract: Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.

Abstract: Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.

Abstract: Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.

Abstract: An apparatus includes a package having a first surface and a conductive contact exposed at the first surface. A capacitor is inside the package. The capacitor has a first conductive contact exposed at a first surface of the capacitor. The first conductive contact has a first portion spanning a width of the first surface of the capacitor. The first surface of the capacitor is substantially parallel to the first surface of the package. A conductive path connects the first portion of the first conductive contact of the capacitor to the first conductive contact proximate the first surface of the package.

Abstract: A capacitor includes multiple tiers (302, 304, 306, 1210, 1212, 1310, 1312, 1380, FIGS. 3, 12, 13), which provide capacitance to a load at different inductance values. Each tier includes multiple layers (311-325, 1220, 1222, 1320, 1322, 1382, FIGS. 3, 12, 13) of patterned conductive material, which are separated by layers of dielectric material. In one embodiment, tiers are stacked in a vertical direction, and are electrically connected through vias (330, 332, 334, 1230, 1232, FIGS. 3, 12) that extend through some or all of the tiers. In another embodiment, one or more tiers (1310, 1312, FIG. 13) are located in a center region (1404, FIG. 14) of the capacitor, and one or more other tiers (1380, FIG. 13) are located in a peripheral region (1408, FIG. 14) of the capacitor. In that embodiment, the center tiers and peripheral tiers are electrically connected through one or more additional layers (1370, FIG. 13) of patterned conductive material.

Abstract: A capacitor (FIGS. 6-9) includes one or more extended surface lands (604, 704, 804, 904, FIGS. 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, FIG. 6) of the capacitor or 20% of the length (914, FIG. 9) of the capacitor. When embedded within an integrated circuit package (1102, FIG. 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).

Abstract: An apparatus includes a package having a first surface and a conductive contact exposed at the first surface. A capacitor is inside the package. The capacitor has a first conductive contact exposed at a first surface of the capacitor. The first conductive contact has a first portion spanning a width of the first surface of the capacitor. The first surface of the capacitor is substantially parallel to the first surface of the package. A conductive path connects the first portion of the first conductive contact of the capacitor to the first conductive contact proximate the first surface of the package.

Abstract: A capacitor includes multiple tiers (302, 304, 306, 1210, 1212, 1310, 1312, 1380, FIGS. 3, 12, 13), which provide capacitance to a load at different inductance values. Each tier includes multiple layers (311-325, 1220, 1222, 1320, 1322, 1382, FIGS. 3, 12, 13) of patterned conductive material, which are separated by layers of dielectric material. In one embodiment, tiers are stacked in a vertical direction, and are electrically connected through vias (330, 332, 334, 1230, 1232, FIGS. 3, 12) that extend through some or all of the tiers. In another embodiment, one or more tiers (1310, 1312, FIG. 13) are located in a center region (1404, FIG. 14) of the capacitor, and one or more other tiers (1380, FIG. 13) are located in a peripheral region (1408, FIG. 14) of the capacitor. In that embodiment, the center tiers and peripheral tiers are electrically connected through one or more additional layers (1370, FIG. 13) of patterned conductive material.

Abstract: A capacitor (FIGS. 6-9) includes one or more extended surface lands (604, 704, 804, 904, FIGS. 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, FIG. 6) of the capacitor or 20% of the length (914, FIG. 9) of the capacitor. When embedded within an integrated circuit package (1102, FIG. 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).