Patents by Inventor Jose Arvin M. PLOMANTES

Jose Arvin M. PLOMANTES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THICKNESS
    Publication number: 20240178166
    Abstract: In some examples, a method for manufacturing a semiconductor package comprises forming a copper member on a surface; applying a photoresist to the copper member and the surface; and forming a cavity in the photoresist above the copper member. The cavity has a first volume with a first diameter and a second volume with a second diameter larger than the first diameter. The second volume is more proximal to the copper member than the first volume. The method also includes forming a nickel member in the second volume forming a palladium member in the first volume.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Inventors: Rafael Jose Lizares GUEVARA, Jose Arvin M. PLOMANTES