Abstract: A station for maintaining and electrically charging electric hair cutting devices has a housing with first and second sections and an internal space within the housing below the sections. The first section has multiple electrical charging docks which are affixed to that section, each of the charging docks being dedicated and configured to electrically charge a specific manufacturer's electric hair cutting device. The second section has multiple through openings, each of the through openings being configured to accept and circumscribe, a separable, removeable, independent charging dock of a manufacturer's electric hair cutting device. The internal space of the housing contains one or more electrical power strips with electrical wires which exit the housing and are configured to be connected to an electrical power source for supplying electricity to the charging docks.

Abstract: The embodiments described herein provide a die crack detector and method that use a conductive trace arranged to at least substantially extend around a perimeter of an integrated circuit die. A one-time programmable element, such as a fuse, is coupled in series with the conductive trace, and a package lead is electrically coupled to both the fuse and another operational element on the integrated circuit die. With the fuse intact the package lead can thus be used to determine a measurement of the conductivity of the conductive trace, with the measurement of conductivity indicative of the presence of a crack on the die. After such testing the fuse can be electrically opened, and the package lead used for normal operation of the device on the packaged die without the conductive trace interfering with this operation.

Abstract: Systems and methods for releasing semiconductor dies from an adhesive tape or film. In some embodiments, a semiconductor manufacturing device may include: a chuck plate configured to support an array of semiconductor dies, where each die in the array has a top surface and a bottom surface, where each die's bottom surface is bonded to an adhesive tape, and where the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape; and a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape.

Abstract: The embodiments described herein provide a die crack detector and method that use a conductive trace arranged to at least substantially extend around a perimeter of an integrated circuit die. A one-time programmable element, such as a fuse, is coupled in series with the conductive trace, and a package lead is electrically coupled to both the fuse and another operational element on the integrated circuit die. With the fuse intact the package lead can thus be used to determine a measurement of the conductivity of the conductive trace, with the measurement of conductivity indicative of the presence of a crack on the die. After such testing the fuse can be electrically opened, and the package lead used for normal operation of the device on the packaged die without the conductive trace interfering with this operation.

Abstract: An electronic apparatus includes a semiconductor substrate, a device structure supported by the semiconductor substrate, and a guard ring surrounding the device structure. The guard ring includes a plurality of conductive structures spaced apart from one another, supported by the semiconductor substrate, and coupled to a voltage source to establish an operating voltage for the guard ring.

Abstract: An electronic apparatus includes a semiconductor substrate, a device structure supported by the semiconductor substrate, and a guard ring surrounding the device structure. The guard ring includes a plurality of conductive structures spaced apart from one another, supported by the semiconductor substrate, and coupled to a voltage source to establish an operating voltage for the guard ring.

Abstract: A closed loop amplifier circuit (100) having an on state (202) and an off state (204) is disclosed. The amplifier circuit (100) includes an Automatic Gain Control (AGC) circuit (116). The AGC circuit (116) controls the rate of change in the output power (120) of the amplifier circuit (100) when it changes from the off state (204) to the on state (202) or vice versa. The amplifier circuit (100) also includes a programming circuit (114) that is coupled to the AGC circuit (116). The programming circuit (114) is used to program a desired rate of change into the AGC circuit (116).