Abstract: A material source arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material source arrangement includes a distribution pipe being configured to be in fluid communication with a material source providing the material to the distribution pipe; and at least one nozzle configured for guiding the material provided in the distribution pipe to the vacuum deposition chamber. The nozzle includes a thread for repeatedly connecting and disconnecting the nozzle to the distribution pipe. Further, a deposition apparatus for depositing material on a substrate including a material source arrangement, a nozzle for a material source arrangement, and a method for providing a distribution pipe and a nozzle for a material source arrangement are described.

Abstract: A material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is described. The material deposition arrangement includes a crucible for providing material to be evaporated; a linear distribution pipe in fluid communication with the crucible; and a plurality of nozzles in the distribution pipe for guiding the evaporated material into the vacuum chamber. Each nozzle may have a nozzle inlet for receiving the evaporated material, a nozzle outlet for releasing the evaporated material to the vacuum chamber, and a nozzle passage between the nozzle inlet and the nozzle outlet. The nozzle passage of at least one of the plurality of nozzles includes a first section having a first length and a first size, and a second having a second length and a second size. The ratio of the second size to the first size is between 2 and 10.

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

Abstract: Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material, a distribution pipe with one or more outlets provided along the length of the distribution pipe, wherein the distribution pipe is in fluid communication with the evaporation crucible, and wherein the distribution pipe has a cross-section perpendicular to the length of the distribution pipe, which is non-circular, and which includes: an outlet side at which the one or more outlets are provided, wherein the width of the outlet side of the cross-section is 30% or less of the maximum dimension of the cross-section.

Abstract: An evaporation source array for depositing two or more organic materials on a substrate is described. The evaporation source array includes two or more evaporation crucibles, wherein the two or more evaporation crucibles are configured to evaporate the two or more organic materials, two or more distribution pipes with outlets provided along the length of the two or more distribution pipes, wherein a first distribution pipe of the two or more distribution pipes is in fluid communication with a first evaporation crucible of the two or more evaporation crucibles, two or more heat shields, which surround the first distribution pipe, a cooling shield arrangement provided at at least one side of the two or more distribution pipes, wherein the at least one side is the side at which the outlets are provided, and a cooling element provided at or in the cooling shield arrangement for active cooling of the cooling shield arrangement.

Abstract: An apparatus for processing a flexible substrate is described.

Abstract: A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate is described. The depositing arrangement includes a first chamber configured for liquefying the material, wherein the first chamber comprises a gas inlet configured for inlet of a gas in the first chamber, an evaporation zone configured for vaporizing the liquefied material, a line providing a fluid communication between the first chamber and the evaporation zone for the liquefied material, wherein the line includes a first portion defining a flow resistance of the line, a valve configured for controlling the flow rate of the gas in the first chamber for controlling a flow rate of the liquefied material through the line having said flow resistance, and one or more outlets for directing the vaporized material towards the substrate.

Abstract: A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.

Abstract: A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate (4) is described. The arrangement a first chamber (110) configured for liquefying the material, a valve (130) being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone (114) being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets (116) for directing the vaporized material towards the substrate.

Abstract: Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.

Abstract: A process of coating at least one substrate with a plurality of deposition sources, a method of tooling, a carrier unit and a deposition system are described. The systems and methods provide for or allow for exposing a first substrate portion 112a of said at least one substrate 112 to a first deposition source 118a through an aperture 122 of a carrier unit 110, 510, depositing a first layer 126a over the first substrate portion, said first layer including material from said first deposition source, varying a relative position between said at least one substrate and said aperture for exposing a second substrate portion of said at least one substrate, or another substrate, to a second deposition source, and depositing a second layer 126b over the second substrate portion 112b, said second layer including material from said second deposition source.

Abstract: An apparatus for processing a flexible substrate is described. The apparatus includes a vacuum chamber having a first chamber portion, a second chamber portion and a third chamber portion, an unwinding shaft, a coating drum having a rotation axis and a curved outer surface for guiding the substrate along the curved outer surface through a first vacuum processing region and at least one second vacuum processing region, wherein a first portion of the coating drum is provided in the second chamber portion and the remaining portion of the coating drum is provided in the third chamber portion, a first processing station corresponding to the first processing region and at least one second processing station corresponding to the at least one second vacuum processing region, wherein the first processing station and the second processing station each includes a flange portion.

Abstract: An apparatus for coating a thin film on a flexible substrate is described. The apparatus includes a coating drum having an outer surface for guiding the flexible substrate through a first vacuum processing region and at least one second vacuum processing region, a gas separation unit for separating the first vacuum processing region and at least one second vacuum processing region and adapted to form a slit through which the flexible substrate can pass between the outer surface of the coating drum and the gas separation unit, wherein the gas separation unit is adapted to control fluid communication between the first processing region and the second processing region by adjusting the position of the gas separation unit.

Abstract: An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.

Abstract: The present invention generally relates to organic light emitting diode (OLED) structures and methods for their manufacture. To increase the lifetime of an OLED structure, an encapsulating layer may be deposited over the OLED structure. The encapsulating layer may fully enclose or “encapsulate” the OLED structure. The encapsulating layer may have a substantially planar surface opposite to the interface between the OLED structure and the encapsulating layer. The planar surface permits successive layers to be evenly deposited over the OLED structure. The encapsulating layer reduces any oxygen penetration into the OLED structure and may increase the lifetime of the OLED structure.

Abstract: Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.

Abstract: The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.