Patents by Inventor Joseph A. Boswell
Joseph A. Boswell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11781815Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.Type: GrantFiled: September 8, 2020Date of Patent: October 10, 2023Assignee: ThermAvant Technologies, LLCInventors: Benjamin Alexander, Daniel Pounds, Joshua Schorp, Bruce Drolen, Corey Wilson, Joseph Boswell
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Publication number: 20220074674Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.Type: ApplicationFiled: September 8, 2020Publication date: March 10, 2022Inventors: Benjamin ALEXANDER, Daniel POUNDS, Joshua SCHORP, Bruce DROLEN, Corey WILSON, Joseph BOSWELL
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Publication number: 20190315501Abstract: An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.Type: ApplicationFiled: April 17, 2019Publication date: October 17, 2019Inventors: Tuan L. Duong, Adam D. Leeds, James E. Benedict, Joseph A. Boswell, Daniel A. Pounds
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Patent number: 10101059Abstract: A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.Type: GrantFiled: November 26, 2008Date of Patent: October 16, 2018Assignees: The Curators of the University of Missouri, Thermavant Technologies LLCInventors: Hongbin Ma, Joseph A. Boswell, Peng Cheng
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Patent number: 8763408Abstract: A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC.Type: GrantFiled: October 1, 2010Date of Patent: July 1, 2014Assignee: The Curators of the University of MissouriInventors: Hongbin Ma, Peng Cheng, Joseph A. Boswell
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Publication number: 20130133871Abstract: A heat spreader has more than one thermal circuit to give better performance over a wider range of heat input regimes. Different working fluids may be used in the different thermal circuits. The thermal circuits may extend in three dimensions to improve the density of the channels in limited space.Type: ApplicationFiled: April 12, 2011Publication date: May 30, 2013Applicants: THERMAVANT TECHNOLOGIES LLC, THE CURATORS OF THE UNIVERSITY OF MISSOURIInventors: Hongbin Ma, Peng Cheng, Joseph A. Boswell
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Publication number: 20110259039Abstract: A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.Type: ApplicationFiled: November 26, 2008Publication date: October 27, 2011Applicant: THE CURATORS OF THE UNIVERSITY OF MISSOURIInventors: Hongbin Ma, Joseph A. Boswell, Peng Cheng
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Publication number: 20110079022Abstract: A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC.Type: ApplicationFiled: October 1, 2010Publication date: April 7, 2011Inventors: Hongbin Ma, Peng Cheng, Joseph A. Boswell